Vanadium [V]

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H01L2924/01023

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

Current Industry

H01L2924/01023Vanadium [V]

Industries

Patents Grantslast 30 patents

Information Patent Grant
Manufacturing method and electronic module with new routing possibi...
- Patent number RE49970
- Issue date May 14, 2024
- IMBERATEK, LLC
- Antti Kivikero
Information Patent Grant
Semiconductor device with sealed semiconductor chip
- Patent number 11,854,946
- Issue date Dec 26, 2023
- Kioxia Corporation
- Isao Ozawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for fabricating a semiconductor device
- Patent number 11,817,417
- Issue date Nov 14, 2023
- Infineon Technologies Austria AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, manufacturing method, solid state image senso...
- Patent number 11,776,923
- Issue date Oct 3, 2023
- Sony Corporation
- Masaki Haneda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of room temperature covalent bonding
- Patent number 11,760,059
- Issue date Sep 19, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Qin-Yi Tong
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device and method for production of semiconductor device
- Patent number 11,715,752
- Issue date Aug 1, 2023
- Sony Group Corporation
- Atsushi Okuyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D IC method and device
- Patent number 11,515,202
- Issue date Nov 29, 2022
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Paul M. Enquist
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Four D device process and structure
- Patent number 11,458,717
- Issue date Oct 4, 2022
- International Business Machines Corporation
- Roy R. Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stretchable form of single crystal silicon for high performance ele...
- Patent number 11,456,258
- Issue date Sep 27, 2022
- The Board of Trustees of the University of Illinois
- John A. Rogers
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device with sealed semiconductor chip
- Patent number 11,424,176
- Issue date Aug 23, 2022
- Kioxia Corporation
- Isao Ozawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing semiconductor device
- Patent number 11,315,854
- Issue date Apr 26, 2022
- Fuji Electric Co., Ltd.
- Ryoichi Kato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D IC method and device
- Patent number 11,289,372
- Issue date Mar 29, 2022
- INVENSAS BONDING TECHNOLOGIES, INC.
- Paul M. Enquist
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making a pillar structure having a non-metal sidewall pro...
- Patent number 11,257,714
- Issue date Feb 22, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chien Ling Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package process and package structure
- Patent number 11,222,866
- Issue date Jan 11, 2022
- Advanced Semiconductor Engineering, Inc.
- Chi-Chih Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked-chip packages in package-on-package apparatus, methods of a...
- Patent number 11,217,516
- Issue date Jan 4, 2022
- Intel Corporation
- Sriram Muthukumar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Designs and methods for conductive bumps
- Patent number 11,201,129
- Issue date Dec 14, 2021
- Intel Corporation
- Valery M. Dubin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder material for semiconductor device
- Patent number 11,145,615
- Issue date Oct 12, 2021
- Fuji Electric Co., Ltd.
- Hirohiko Watanabe
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and method for production of semiconductor device
- Patent number 11,121,164
- Issue date Sep 14, 2021
- Sony Corporation
- Atsushi Okuyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate with embedded stacked through-silicon via die
- Patent number 11,107,766
- Issue date Aug 31, 2021
- Intel Corporation
- Javier Soto Gonzalez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D IC method and device
- Patent number 11,011,418
- Issue date May 18, 2021
- INVENSAS BONDING TECHNOLOGIES, INC.
- Paul M. Enquist
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer-level chip-scale package including power semiconductor and ma...
- Patent number 10,991,637
- Issue date Apr 27, 2021
- MagnaChip Semiconductor, Ltd.
- Myung Ho Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with island and associated leads
- Patent number 10,978,379
- Issue date Apr 13, 2021
- Rohm Co., Ltd.
- Akihiro Koga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, manufacturing method, solid state image senso...
- Patent number 10,950,637
- Issue date Mar 16, 2021
- Sony Corporation
- Masaki Haneda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Alignment marks in substrate having through-substrate via (TSV)
- Patent number 10,910,267
- Issue date Feb 2, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsin Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Treatment, before the bonding of a mixed Cu-oxide surface, by a pla...
- Patent number 10,910,782
- Issue date Feb 2, 2021
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Laurent Vandroux
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Semiconductor device with sealed semiconductor chip
- Patent number 10,872,844
- Issue date Dec 22, 2020
- TOSHIBA MEMORY CORPORATION
- Isao Ozawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for electromagnetic interference shielding
- Patent number 10,763,220
- Issue date Sep 1, 2020
- Intel Corporation
- Rajendra C. Dias
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper paste for joining, method for manufacturing joined body, and...
- Patent number 10,748,865
- Issue date Aug 18, 2020
- Hitachi Chemical Company, Ltd.
- Yuki Kawana
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Solder material for semiconductor device
- Patent number 10,727,194
- Issue date Jul 28, 2020
- Fuji Electric Co., Ltd.
- Hirohiko Watanabe
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Alignment marks in substrate having through-substrate via (TSV)
- Patent number 10,692,764
- Issue date Jun 23, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsin Chang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
REVERSABLE ATTACHMENT SYSTEM
- Publication number 20240213212
- Publication date Jun 27, 2024
- The Boeing Company
- Peter D. Brewer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method for Fabricating a Semiconductor Device
- Publication number 20240038714
- Publication date Feb 1, 2024
- Infineon Technologies Austria AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, MANUFACTURING METHOD, SOLID STATE IMAGE SENSO...
- Publication number 20230402411
- Publication date Dec 14, 2023
- SONY GROUP CORPORATION
- Masaki HANEDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20230387064
- Publication date Nov 30, 2023
- RENESAS ELECTRONICS CORPORATION
- Kodai OZAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REWORKABLE INTER-SUBSTRATE BOND STRUCTURE
- Publication number 20230378126
- Publication date Nov 23, 2023
- The Boeing Company
- Peter D. Brewer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH SEALED SEMICONDUCTOR CHIP
- Publication number 20220352053
- Publication date Nov 3, 2022
- KIOXIA Corporation
- Isao OZAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE PROCESS AND PACKAGE STRUCTURE
- Publication number 20220157775
- Publication date May 19, 2022
- Advanced Semiconductor Engineering, Inc.
- Chi-Chih SHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DESIGNS AND METHODS FOR CONDUCTIVE BUMPS
- Publication number 20220059484
- Publication date Feb 24, 2022
- Intel Corporation
- Valery M. DUBIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH SEALED SEMICONDUCTOR CHIP
- Publication number 20220044987
- Publication date Feb 10, 2022
- Toshiba Memory Corporation
- Isao OZAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER MATERIAL FOR SEMICONDUCTOR DEVICE
- Publication number 20210407953
- Publication date Dec 30, 2021
- Fuji Electric Co., Ltd.
- Hirohiko WATANABE
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCTION OF SEMICONDUCTOR DEVICE
- Publication number 20210366975
- Publication date Nov 25, 2021
- SONY GROUP CORPORATION
- Atsushi Okuyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D IC METHOD AND DEVICE
- Publication number 20210313225
- Publication date Oct 7, 2021
- INVENSAS BONDING TECHNOLOGIES, INC.
- Paul M. Enquist
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D IC METHOD AND DEVICE
- Publication number 20210280461
- Publication date Sep 9, 2021
- INVENSAS BONDING TECHNOLOGIES, INC.
- Paul M. Enquist
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, MANUFACTURING METHOD, SOLID STATE IMAGE SENSO...
- Publication number 20210183661
- Publication date Jun 17, 2021
- SONY CORPORATION
- Masaki HANEDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING A SEMICONDUCTOR DEVICE
- Publication number 20210111143
- Publication date Apr 15, 2021
- Infineon Technologies Austria AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH SEALED SEMICONDUCTOR CHIP
- Publication number 20210074609
- Publication date Mar 11, 2021
- Toshiba Memory Corporation
- Isao OZAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20210066158
- Publication date Mar 4, 2021
- Fuji Electric Co., Ltd.
- Ryoichi KATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER MATERIAL FOR SEMICONDUCTOR DEVICE
- Publication number 20200303337
- Publication date Sep 24, 2020
- Fuji Electric Co., Ltd.
- Hirohiko WATANABE
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE, MANUFACTURING METHOD, SOLID STATE IMAGE SENSO...
- Publication number 20200227462
- Publication date Jul 16, 2020
- SONY CORPORATION
- Masaki HANEDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER PASTE FOR JOINING, METHOD FOR MANUFACTURING JOINED BODY, AND...
- Publication number 20200176411
- Publication date Jun 4, 2020
- Hitachi Chemical Company, Ltd.
- Yuki KAWANA
- B22 - CASTING POWDER METALLURGY
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCTION OF SEMICONDUCTOR DEVICE
- Publication number 20200119075
- Publication date Apr 16, 2020
- SONY CORPORATION
- Atsushi Okuyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stretchable Form of Single Crystal Silicon for High Performance Ele...
- Publication number 20200013720
- Publication date Jan 9, 2020
- THE BOARD OF TRUSTEES OF THE UNIVERSITY OF ILLINOIS
- John A. ROGERS
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR DEVICE WITH ISLAND AND ASSOCIATED LEADS
- Publication number 20190385937
- Publication date Dec 19, 2019
- Rohm Co., Ltd.
- Akihiro KOGA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF ROOM TEMPERATURE COVALENT BONDING
- Publication number 20190344534
- Publication date Nov 14, 2019
- INVENSAS BONDING TECHNOLOGIES, INC.
- Qin-Yi Tong
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD OF ROOM TEMPERATURE COVALENT BONDING
- Publication number 20190344533
- Publication date Nov 14, 2019
- INVENSAS BONDING TECHNOLOGIES, INC.
- Qin-Yi Tong
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR DEVICE WITH SEALED SEMICONDUCTOR CHIP
- Publication number 20190295928
- Publication date Sep 26, 2019
- Toshiba Memory Corporation
- Isao OZAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, MANUFACTURING METHOD, SOLID STATE IMAGE SENSO...
- Publication number 20190206919
- Publication date Jul 4, 2019
- SONY CORPORATION
- Masaki HANEDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DESIGNS AND METHODS FOR CONDUCTIVE BUMPS
- Publication number 20190198472
- Publication date Jun 27, 2019
- Intel Corporation
- Valery M. DUBIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D IC METHOD AND DEVICE
- Publication number 20190148222
- Publication date May 16, 2019
- INVENSAS BONDING TECHNOLOGIES, INC.
- Paul M. Enquist
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED-CHIP PACKAGES IN PACKAGE-ON-PACKAGE APPARATUS, METHODS OF A...
- Publication number 20190148275
- Publication date May 16, 2019
- Intel Corporation
- Sriram MUTHUKUMAR
- H01 - BASIC ELECTRIC ELEMENTS

Vanadium [V]

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Manufacturing method and electronic module with new routing possibi...

Semiconductor device with sealed semiconductor chip

Semiconductor device and method for fabricating a semiconductor device

Semiconductor device, manufacturing method, solid state image senso...

Method of room temperature covalent bonding

Semiconductor device and method for production of semiconductor device

3D IC method and device

Four D device process and structure

Stretchable form of single crystal silicon for high performance ele...

Semiconductor device with sealed semiconductor chip

Semiconductor device and method of manufacturing semiconductor device

3D IC method and device

Method of making a pillar structure having a non-metal sidewall pro...

Package process and package structure

Stacked-chip packages in package-on-package apparatus, methods of a...

Designs and methods for conductive bumps

Solder material for semiconductor device

Semiconductor device and method for production of semiconductor device

Substrate with embedded stacked through-silicon via die

3D IC method and device

Wafer-level chip-scale package including power semiconductor and ma...

Semiconductor device with island and associated leads

Semiconductor device, manufacturing method, solid state image senso...

Alignment marks in substrate having through-substrate via (TSV)

Treatment, before the bonding of a mixed Cu-oxide surface, by a pla...

Semiconductor device with sealed semiconductor chip

Systems and methods for electromagnetic interference shielding

Copper paste for joining, method for manufacturing joined body, and...

Solder material for semiconductor device

Alignment marks in substrate having through-substrate via (TSV)

Patents Applicationslast 30 patents

REVERSABLE ATTACHMENT SYSTEM

Semiconductor Device and Method for Fabricating a Semiconductor Device

SEMICONDUCTOR DEVICE, MANUFACTURING METHOD, SOLID STATE IMAGE SENSO...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

REWORKABLE INTER-SUBSTRATE BOND STRUCTURE

SEMICONDUCTOR DEVICE WITH SEALED SEMICONDUCTOR CHIP

PACKAGE PROCESS AND PACKAGE STRUCTURE

DESIGNS AND METHODS FOR CONDUCTIVE BUMPS

SEMICONDUCTOR DEVICE WITH SEALED SEMICONDUCTOR CHIP

SOLDER MATERIAL FOR SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCTION OF SEMICONDUCTOR DEVICE

3D IC METHOD AND DEVICE

3D IC METHOD AND DEVICE

SEMICONDUCTOR DEVICE, MANUFACTURING METHOD, SOLID STATE IMAGE SENSO...

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING A SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE WITH SEALED SEMICONDUCTOR CHIP

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

SOLDER MATERIAL FOR SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE, MANUFACTURING METHOD, SOLID STATE IMAGE SENSO...

COPPER PASTE FOR JOINING, METHOD FOR MANUFACTURING JOINED BODY, AND...

SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCTION OF SEMICONDUCTOR DEVICE

Stretchable Form of Single Crystal Silicon for High Performance Ele...

SEMICONDUCTOR DEVICE WITH ISLAND AND ASSOCIATED LEADS

METHOD OF ROOM TEMPERATURE COVALENT BONDING

METHOD OF ROOM TEMPERATURE COVALENT BONDING

SEMICONDUCTOR DEVICE WITH SEALED SEMICONDUCTOR CHIP

SEMICONDUCTOR DEVICE, MANUFACTURING METHOD, SOLID STATE IMAGE SENSO...

DESIGNS AND METHODS FOR CONDUCTIVE BUMPS

3D IC METHOD AND DEVICE

STACKED-CHIP PACKAGES IN PACKAGE-ON-PACKAGE APPARATUS, METHODS OF A...