Varying thickness of a single conductor Conductors in the same plane having different thicknesses

Industry

CPC
H05K2201/09736

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

Current Industry

H05K2201/09736Varying thickness of a single conductor Conductors in the same plane having different thicknesses

Industries

Patents Grantslast 30 patents

Information Patent Grant
Power electronic switching device, power semiconductor module there...
- Patent number 11,800,644
- Issue date Oct 24, 2023
- Semikron Elektronik GmbH & Co. KG
- Markus Düsel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual trace thickness for single layer routing
- Patent number 11,769,719
- Issue date Sep 26, 2023
- Intel Corporation
- Jonathan Rosch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating contact pads for electronic substrates
- Patent number 11,765,826
- Issue date Sep 19, 2023
- Qorvo US, Inc.
- John August Orlowski
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flexible printed circuit board and method of manufacturing flexible...
- Patent number 11,696,401
- Issue date Jul 4, 2023
- Sumitomo Electric Industries, Ltd.
- Koji Nitta
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Chip on film, display device, method of fabricating chip on film, a...
- Patent number 11,693,287
- Issue date Jul 4, 2023
- Samsung Display Co., Ltd.
- Myong Soo Oh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible printed circuit board and method of manufacturing flexible...
- Patent number 11,659,662
- Issue date May 23, 2023
- Sumitomo Electric Industries, Ltd.
- Koji Nitta
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ceramic electronic component
- Patent number 11,647,581
- Issue date May 9, 2023
- Murata Manufacturing Co., Ltd.
- Yuki Takemori
- B32 - LAYERED PRODUCTS
Information Patent Grant
Ceramic electronic component
- Patent number 11,641,712
- Issue date May 2, 2023
- Murata Manufacturing Co., Ltd.
- Yuki Takemori
- B32 - LAYERED PRODUCTS
Information Patent Grant
Component carrier with electrically reliable bridge with sufficient...
- Patent number 11,483,927
- Issue date Oct 25, 2022
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Ismadi Bin Ismail
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Functional panel, method for manufacturing the same and terminal
- Patent number 11,423,825
- Issue date Aug 23, 2022
- CHONGQING BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Ying Zhang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Substrate structures and methods of manufacture
- Patent number 11,419,217
- Issue date Aug 16, 2022
- Semiconductor Components Industries, LLC
- Yusheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Signal transmission method and apparatus, and display device
- Patent number 11,335,238
- Issue date May 17, 2022
- CHONGQING BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Xianyong Gao
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Electrical conductors
- Patent number 11,324,113
- Issue date May 3, 2022
- 3M Innovative Properties Company
- Nicholas T. Gabriel
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Circuit board
- Patent number 11,291,123
- Issue date Mar 29, 2022
- SAMWON ACT CO., LTD.
- Kyung Yul Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Panel, manufacturing method thereof, and terminal
- Patent number 11,227,532
- Issue date Jan 18, 2022
- CHONGQING BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Xianyong Gao
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method for providing an electrical connection and printed circuit b...
- Patent number 11,219,119
- Issue date Jan 4, 2022
- Advantest Corporation
- Sylvia Ehrler
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
LED light strip and method for manufacturing the same
- Patent number 11,178,735
- Issue date Nov 16, 2021
- SIGNIFY HOLDING B.V.
- Joris Hubertus Antonius Hagelaar
- F21 - LIGHTING
Information Patent Grant
Component carrier with electrically reliable bridge with sufficient...
- Patent number 10,966,318
- Issue date Mar 30, 2021
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Ismadi Bin Ismail
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for reduction of interfacial stress accumulation between dou...
- Patent number 10,923,621
- Issue date Feb 16, 2021
- NATIONAL CHUNG SHAN INSTITUTE OF SCIENCE AND TECHNOLOGY
- Chun-Te Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact pads for electronic substrates and related methods
- Patent number 10,905,007
- Issue date Jan 26, 2021
- Qorvo US, Inc.
- John August Orlowski
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board
- Patent number 10,856,406
- Issue date Dec 1, 2020
- Rohm Co., Ltd.
- Masashi Nagasato
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board and method of manufacturing the same
- Patent number 10,849,226
- Issue date Nov 24, 2020
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Mi-Sun Hwang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Resin multilayer substrate and method of manufacturing the same
- Patent number 10,743,414
- Issue date Aug 11, 2020
- Murata Manufacturing Co., Ltd.
- Toshiro Adachi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board and electronic package
- Patent number 10,672,697
- Issue date Jun 2, 2020
- KYOCERA Corporation
- Akihiko Funahashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrical conductors
- Patent number 10,653,006
- Issue date May 12, 2020
- 3M Innovative Properties Company
- Nicholas T. Gabriel
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Circuit assembly with increased mounting area
- Patent number 10,652,994
- Issue date May 12, 2020
- AutoNetworks Technologies, Ltd.
- Arinobu Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board, electronic control unit, and switching control metho...
- Patent number 10,624,247
- Issue date Apr 14, 2020
- Toyota Jidosha Kabushiki Kaisha
- Yuki Wakayama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Stretchable circuit board and strain sensor
- Patent number 10,455,695
- Issue date Oct 22, 2019
- Seiko Epson Corporation
- Yohei Yamada
- G01 - MEASURING TESTING
Information Patent Grant
Electronic device, method for producing same, and circuit substrate
- Patent number 10,383,214
- Issue date Aug 13, 2019
- Stanley Electric Co., Ltd.
- Akihiko Hanya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductor pad for flexible circuits and flexible circuit incorporat...
- Patent number 10,368,436
- Issue date Jul 30, 2019
- OSRAM SYLVANIA Inc.
- Sridharan Venk
- G06 - COMPUTING CALCULATING COUNTING

Patents Applicationslast 30 patents

Information Patent Application
DUAL TRACE THICKNESS FOR SINGLE LAYER ROUTING
- Publication number 20230369192
- Publication date Nov 16, 2023
- Intel Corporation
- Jonathan ROSCH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLEXIBLE PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING FLEXIBLE...
- Publication number 20230247763
- Publication date Aug 3, 2023
- Sumitomo Electric Industries, Ltd.
- Koji NITTA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for manufacturing a component
- Publication number 20230209703
- Publication date Jun 29, 2023
- Scio Holding GmbH
- Marius Sillmann
- B60 - VEHICLES IN GENERAL
Information Patent Application
WIRING SUBSTRATE AND SEMICONDUCTOR DEVICE
- Publication number 20230130183
- Publication date Apr 27, 2023
- Shinko Electric Industries Co., Ltd.
- Akihiro TAKEUCHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATE STRUCTURES AND METHODS OF MANUFACTURE
- Publication number 20220369468
- Publication date Nov 17, 2022
- Semiconductor Components Industries, LLC
- Yusheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
USER INTERFACE CONSOLE FOR AN APPLIANCE PROVIDING CLEARANCE FOR AN...
- Publication number 20220151457
- Publication date May 19, 2022
- Haier US Appliance Solutions, Inc.
- Michelle Diana Gross
- A47 - FURNITURE DOMESTIC ARTICLES OR APPLIANCES COFFEE MILLS SPICE MILLS SUCT...
Information Patent Application
PRINTED CIRCUIT BOARD, POWER SUPPLY, AND POWER SUPPLY SYSTEM
- Publication number 20210161013
- Publication date May 27, 2021
- Huawei Technologies Co., Ltd
- Zongxun CHEN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Component Carrier With Electrically Reliable Bridge With Sufficient...
- Publication number 20210161012
- Publication date May 27, 2021
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Ismadi Bin Ismail
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONTACT PADS FOR ELECTRONIC SUBSTRATES AND RELATED METHODS
- Publication number 20210144853
- Publication date May 13, 2021
- Qorvo US, Inc.
- John August Orlowski
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONTACT PADS FOR ELECTRONIC SUBSTRATES AND RELATED METHODS
- Publication number 20210007224
- Publication date Jan 7, 2021
- Qorvo US, Inc.
- John August Orlowski
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Component Carrier With Electrically Reliable Bridge With Sufficient...
- Publication number 20200253053
- Publication date Aug 6, 2020
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Ismadi Bin Ismail
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRICAL CONDUCTORS
- Publication number 20200236780
- Publication date Jul 23, 2020
- 3M Innovative Properties Company
- Nicholas T. Gabriel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
- Publication number 20200178392
- Publication date Jun 4, 2020
- Samsung Electro-Mechanics Co., Ltd.
- Mi-Sun HWANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONDUCTOR PAD FOR FLEXIBLE CIRCUITS AND FLEXIBLE CIRCUIT INCORPORAT...
- Publication number 20190306976
- Publication date Oct 3, 2019
- OSRAM SYLVANIA INC.
- Sridharan Venk
- F21 - LIGHTING
Information Patent Application
CIRCUIT BOARD
- Publication number 20190029124
- Publication date Jan 24, 2019
- Samwon Act Co., Ltd
- Kyung Yul LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONNECTION STRUCTURE BETWEEN OPTICAL DEVICE AND CIRCUIT SUBSTRATE,...
- Publication number 20180288874
- Publication date Oct 4, 2018
- Sumitomo Osaka Cement Co., Ltd.
- Toshio KATAOKA
- G02 - OPTICS
Information Patent Application
SUBSTRATE STRUCTURES AND METHODS OF MANUFACTURE
- Publication number 20180132358
- Publication date May 10, 2018
- Semiconductor Components Industries, LLC
- Yusheng Lin
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Application
WIRED CIRCUIT BOARD AND PRODUCING METHOD THEREOF
- Publication number 20180124912
- Publication date May 3, 2018
- Nitto Denko Corporation
- Daisuke YAMAUCHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD AND ELECTRONIC APPARATUS
- Publication number 20180035536
- Publication date Feb 1, 2018
- Fujitsu Limited
- Takayoshi Matsumura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20170367191
- Publication date Dec 21, 2017
- Avary Holding (Shenzhen) Co., Limited.
- WEI-SHUO SU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRICAL CONDUCTORS
- Publication number 20170359894
- Publication date Dec 14, 2017
- 3M Innovative Properties Company
- Nicholas T. Gabriel
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
ELECTRO STATIC DISCHARGE PROTECTION DEVICE
- Publication number 20140368963
- Publication date Dec 18, 2014
- TDK Corporation
- Shingo Suzuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITOR ARRANGEMENT STRUCTURE AND METHOD OF MOUNTING CAPACITOR
- Publication number 20140367154
- Publication date Dec 18, 2014
- Jun Muto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ARRAY SUBSTRATE ASSEMBLY AND DISPLAY DEVICE
- Publication number 20140362542
- Publication date Dec 11, 2014
- BOE TECHNOLOGY GROUP CO., LTD.
- Juncai Ma
- G02 - OPTICS
Information Patent Application
Integration of current measurement in wiring structure of an electr...
- Publication number 20140327458
- Publication date Nov 6, 2014
- Martin GRUBER
- G01 - MEASURING TESTING
Information Patent Application
PRINTED CIRCUIT BOARD HAVING IMPROVED CHARACTERISTIC IMPEDANCE
- Publication number 20140322984
- Publication date Oct 30, 2014
- JERRY WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC CONTROL DEVICE INCLUDING INTERRUPT WIRE
- Publication number 20140307359
- Publication date Oct 16, 2014
- Yuuki MIKAMI
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
CIRCUIT BOARD WITH SIGNAL ROUTING LAYER HAVING UNIFORM IMPEDANCE
- Publication number 20140262441
- Publication date Sep 18, 2014
- HON HAI PRECISION INDUSTRY CO., LTD.
- KAI-WEN WU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
VARIABLE-DEPTH MICRO-CHANNEL STRUCTURE
- Publication number 20140251660
- Publication date Sep 11, 2014
- RONALD Steven COK
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MICRO-CHANNEL CONNECTION PAD
- Publication number 20140251672
- Publication date Sep 11, 2014
- Ronald Steven Cok
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Varying thickness of a single conductor Conductors in the same plane having different thicknesses

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Power electronic switching device, power semiconductor module there...

Dual trace thickness for single layer routing

Method of fabricating contact pads for electronic substrates

Flexible printed circuit board and method of manufacturing flexible...

Chip on film, display device, method of fabricating chip on film, a...

Flexible printed circuit board and method of manufacturing flexible...

Ceramic electronic component

Ceramic electronic component

Component carrier with electrically reliable bridge with sufficient...

Functional panel, method for manufacturing the same and terminal

Substrate structures and methods of manufacture

Signal transmission method and apparatus, and display device

Electrical conductors

Circuit board

Panel, manufacturing method thereof, and terminal

Method for providing an electrical connection and printed circuit b...

LED light strip and method for manufacturing the same

Component carrier with electrically reliable bridge with sufficient...

Method for reduction of interfacial stress accumulation between dou...

Contact pads for electronic substrates and related methods

Printed wiring board

Printed circuit board and method of manufacturing the same

Resin multilayer substrate and method of manufacturing the same

Wiring board and electronic package

Electrical conductors

Circuit assembly with increased mounting area

Circuit board, electronic control unit, and switching control metho...

Stretchable circuit board and strain sensor

Electronic device, method for producing same, and circuit substrate

Conductor pad for flexible circuits and flexible circuit incorporat...

Patents Applicationslast 30 patents

DUAL TRACE THICKNESS FOR SINGLE LAYER ROUTING

FLEXIBLE PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING FLEXIBLE...

Method for manufacturing a component

WIRING SUBSTRATE AND SEMICONDUCTOR DEVICE

SUBSTRATE STRUCTURES AND METHODS OF MANUFACTURE

USER INTERFACE CONSOLE FOR AN APPLIANCE PROVIDING CLEARANCE FOR AN...

PRINTED CIRCUIT BOARD, POWER SUPPLY, AND POWER SUPPLY SYSTEM

Component Carrier With Electrically Reliable Bridge With Sufficient...

CONTACT PADS FOR ELECTRONIC SUBSTRATES AND RELATED METHODS

CONTACT PADS FOR ELECTRONIC SUBSTRATES AND RELATED METHODS

Component Carrier With Electrically Reliable Bridge With Sufficient...

ELECTRICAL CONDUCTORS

PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

CONDUCTOR PAD FOR FLEXIBLE CIRCUITS AND FLEXIBLE CIRCUIT INCORPORAT...

CIRCUIT BOARD

CONNECTION STRUCTURE BETWEEN OPTICAL DEVICE AND CIRCUIT SUBSTRATE,...

SUBSTRATE STRUCTURES AND METHODS OF MANUFACTURE

WIRED CIRCUIT BOARD AND PRODUCING METHOD THEREOF

WIRING BOARD AND ELECTRONIC APPARATUS

PRINTED CIRCUIT BOARD

ELECTRICAL CONDUCTORS

ELECTRO STATIC DISCHARGE PROTECTION DEVICE

CAPACITOR ARRANGEMENT STRUCTURE AND METHOD OF MOUNTING CAPACITOR

ARRAY SUBSTRATE ASSEMBLY AND DISPLAY DEVICE

Integration of current measurement in wiring structure of an electr...

PRINTED CIRCUIT BOARD HAVING IMPROVED CHARACTERISTIC IMPEDANCE

ELECTRONIC CONTROL DEVICE INCLUDING INTERRUPT WIRE

CIRCUIT BOARD WITH SIGNAL ROUTING LAYER HAVING UNIFORM IMPEDANCE

VARIABLE-DEPTH MICRO-CHANNEL STRUCTURE

MICRO-CHANNEL CONNECTION PAD