Varying width along a single conductor Conductors or pads having different widths

Industry

CPC
H05K2201/09727

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

Current Industry

H05K2201/09727Varying width along a single conductor Conductors or pads having different widths

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Transmission module, electronic unit, and electronic device
- Patent number 12,213,244
- Issue date Jan 28, 2025
- Canon Kabushiki Kaisha
- Shoji Matsumoto
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Backplane footprint for high speed, high density electrical connectors
- Patent number 12,207,395
- Issue date Jan 21, 2025
- Amphenol Corporation
- Marc Robert Charbonneau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrically conductive film
- Patent number 12,177,967
- Issue date Dec 24, 2024
- Gentherm GmbH
- Martin Schaetzle
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Differential circuit board and semiconductor light emitting device
- Patent number 12,082,336
- Issue date Sep 3, 2024
- Lumentum Japan, Inc.
- Koichiro Adachi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board and display device including the same
- Patent number 11,968,775
- Issue date Apr 23, 2024
- Samsung Display Co., Ltd.
- Yeon Sun Na
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fine feature formation techniques for printed circuit boards
- Patent number 11,903,138
- Issue date Feb 13, 2024
- Intel Corporation
- Eric Li
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Backplane footprint for high speed, high density electrical connectors
- Patent number 11,805,595
- Issue date Oct 31, 2023
- Amphenol Corporation
- Marc Robert Charbonneau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Information handling system with split trace for high speed routing
- Patent number 11,805,594
- Issue date Oct 31, 2023
- Dell Products L.P.
- Sandor Farkas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual trace thickness for single layer routing
- Patent number 11,769,719
- Issue date Sep 26, 2023
- Intel Corporation
- Jonathan Rosch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Backplane footprint for high speed, high density electrical connectors
- Patent number 11,765,813
- Issue date Sep 19, 2023
- Amphenol Corporation
- Marc Robert Charbonneau
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrically conductive film
- Patent number 11,751,327
- Issue date Sep 5, 2023
- Gentherm GmbH
- Martin Schaetzle
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and display device
- Patent number 11,726,373
- Issue date Aug 15, 2023
- Semiconductor Energy Laboratory Co., Ltd.
- Hajime Kimura
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Bump-on-trace design for enlarge bump-to-trace distance
- Patent number 11,658,143
- Issue date May 23, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sheng-Yu Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ceramic electronic component
- Patent number 11,647,581
- Issue date May 9, 2023
- Murata Manufacturing Co., Ltd.
- Yuki Takemori
- B32 - LAYERED PRODUCTS
Information Patent Grant
Ceramic electronic component
- Patent number 11,641,712
- Issue date May 2, 2023
- Murata Manufacturing Co., Ltd.
- Yuki Takemori
- B32 - LAYERED PRODUCTS
Information Patent Grant
Flexible circuit board
- Patent number 11,606,860
- Issue date Mar 14, 2023
- Chipbond Technology Corporation
- Gwo-Shyan Sheu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board
- Patent number 11,606,861
- Issue date Mar 14, 2023
- Ibiden Co., Ltd.
- Kyohei Yoshikawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Impedance matching within a signal transmission channel
- Patent number 11,582,864
- Issue date Feb 14, 2023
- Dell Products L.P.
- Sandor Farkas
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Backplane footprint for high speed, high density electrical connectors
- Patent number 11,553,589
- Issue date Jan 10, 2023
- Amphenol Corporation
- Marc Robert Charbonneau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and display device
- Patent number 11,520,193
- Issue date Dec 6, 2022
- Semiconductor Energy Laboratory Co., Ltd.
- Hajime Kimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal base circuit board and method of manufacturing the metal base...
- Patent number 11,490,513
- Issue date Nov 1, 2022
- NHK Spring Co., Ltd.
- Katsumi Mizuno
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Component carrier with electrically reliable bridge with sufficient...
- Patent number 11,483,927
- Issue date Oct 25, 2022
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Ismadi Bin Ismail
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Light source module
- Patent number 11,421,861
- Issue date Aug 23, 2022
- Nichia Corporation
- Tomohiko Hatano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Functional panel, method for manufacturing the same and terminal
- Patent number 11,423,825
- Issue date Aug 23, 2022
- CHONGQING BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Ying Zhang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Electronic circuit board and electronic circuit device
- Patent number 11,419,208
- Issue date Aug 16, 2022
- Hitachi Astemo, Ltd.
- Kumiko Yoshinaga
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Land for surface mounted component
- Patent number 11,399,431
- Issue date Jul 26, 2022
- Sony Corporation
- Norikimi Moriuchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrically conductive film
- Patent number 11,388,814
- Issue date Jul 12, 2022
- Gentherm GmbH
- Martin Schaetzle
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Input device with reinforcement plate and wider grounding wire
- Patent number 11,382,212
- Issue date Jul 5, 2022
- Alps Alpine Co., Ltd.
- Hideto Sasagawa
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Conductive pattern
- Patent number 11,360,612
- Issue date Jun 14, 2022
- Dongwoo Fine-Chem Co., Ltd.
- Byung Hoon Song
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Detection device and display device with detection function
- Patent number 11,347,338
- Issue date May 31, 2022
- Japan Display Inc.
- Hayato Kurasawa
- G06 - COMPUTING CALCULATING COUNTING

Patents Applicationslast 30 patents

Information Patent Application
MULTILAYER BOARD, MULTILAYER BOARD MODULE, AND ELECTRONIC DEVICE
- Publication number 20250048533
- Publication date Feb 6, 2025
- Murata Manufacturing Co., Ltd.
- Nobuo IKEMOTO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Core Resonance Suppression in Signal Integrity Optimized Package
- Publication number 20250048535
- Publication date Feb 6, 2025
- Avago Technologies International Sales Pte. Limited
- Kun Jiang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD
- Publication number 20240431030
- Publication date Dec 26, 2024
- SUMITOMO ELECTRIC PRINTED CIRCUITS, INC.
- Michi OGATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD AND MANUFACTURING METHOD FOR THE SAME
- Publication number 20240422900
- Publication date Dec 19, 2024
- KYOCERA CORPORATION
- Noriyuki SHIMIZU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD
- Publication number 20240387344
- Publication date Nov 21, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Chi Hyeon JEONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD, ELECTRONIC COMPONENT STORAGE PACKAGE, AND ELECTRONIC...
- Publication number 20240292530
- Publication date Aug 29, 2024
- KYOCERA CORPORATION
- Shigenori TAKAYA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING CIRCUIT BOARD
- Publication number 20240023237
- Publication date Jan 18, 2024
- Nitto Denko Corporation
- Rihito FUKUSHIMA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
BACKPLANE FOOTPRINT FOR HIGH SPEED, HIGH DENSITY ELECTRICAL CONNECTORS
- Publication number 20240023232
- Publication date Jan 18, 2024
- Amphenol Corporation
- Marc Robert Charbonneau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD
- Publication number 20230403790
- Publication date Dec 14, 2023
- LG Innotek Co., Ltd.
- Jung Eun HAN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DUAL TRACE THICKNESS FOR SINGLE LAYER ROUTING
- Publication number 20230369192
- Publication date Nov 16, 2023
- Intel Corporation
- Jonathan ROSCH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bump-on-Trace Design for Enlarge Bump-to-Trace Distance
- Publication number 20230253358
- Publication date Aug 10, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Sheng-Yu Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD
- Publication number 20230156913
- Publication date May 18, 2023
- Murata Manufacturing Co., Ltd.
- Kosuke NISHIO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
BACKPLANE FOOTPRINT FOR HIGH SPEED, HIGH DENSITY ELECTRICAL CONNECTORS
- Publication number 20220361320
- Publication date Nov 10, 2022
- Amphenol Corporation
- Marc Robert Charbonneau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC CIRCUIT AND CIRCUIT BOARD
- Publication number 20220312581
- Publication date Sep 29, 2022
- FUJIFILM Business Innovation Corp.
- Daisuke HORIKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMPEDANCE MATCHING WITHIN A SIGNAL TRANSMISSION CHANNEL
- Publication number 20220295628
- Publication date Sep 15, 2022
- DELL PRODUCTS, L.P.
- Sandor Farkas
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRICALLY CONDUCTIVE FILM
- Publication number 20220287173
- Publication date Sep 8, 2022
- GENTHERM GMBH
- Martin Schaetzle
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD AND METHOD FOR MANUFACTURING WIRING BOARD
- Publication number 20220201838
- Publication date Jun 23, 2022
- DAI NIPPON PRINTING CO., LTD.
- Koichi SUZUKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD AND DISPLAY DEVICE INCLUDING THE SAME
- Publication number 20220151058
- Publication date May 12, 2022
- SAMSUNG DISPLAY CO., LTD.
- Yeon Sun NA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIFFERENTIAL CIRCUIT BOARD AND SEMICONDUCTOR LIGHT EMITTING DEVICE
- Publication number 20220087007
- Publication date Mar 17, 2022
- Lumentum Japan, Inc.
- Koichiro ADACHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INFORMATION HANDLING SYSTEM WITH SPLIT TRACE FOR HIGH SPEED ROUTING
- Publication number 20220046790
- Publication date Feb 10, 2022
- DELL PRODUCTS, L.P.
- Sandor Farkas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FINE FEATURE FORMATION TECHNIQUES FOR PRINTED CIRCUIT BOARDS
- Publication number 20210352807
- Publication date Nov 11, 2021
- Intel Corporation
- ERIC LI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
BACKPLANE FOOTPRINT FOR HIGH SPEED, HIGH DENSITY ELECTRICAL CONNECTORS
- Publication number 20210329775
- Publication date Oct 21, 2021
- Amphenol Corporation
- Marc Robert Charbonneau
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MODULE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20210289624
- Publication date Sep 16, 2021
- Murata Manufacturing Co., Ltd.
- Yosuke MINO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
BACKPLANE FOOTPRINT FOR HIGH SPEED, HIGH DENSITY ELECTRICAL CONNECTORS
- Publication number 20210219420
- Publication date Jul 15, 2021
- Amphenol Corporation
- Marc Robert Charbonneau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electrically Conductive Film
- Publication number 20210204400
- Publication date Jul 1, 2021
- GENTHERM GMBH
- Martin Schaetzle
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Component Carrier With Electrically Reliable Bridge With Sufficient...
- Publication number 20210161012
- Publication date May 27, 2021
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Ismadi Bin Ismail
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTI-LAYERED CIRCUIT BOARD
- Publication number 20210136926
- Publication date May 6, 2021
- Avary Holding (Shenzhen) Co., Limited.
- ZHI GUO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONDUCTIVE PATTERN
- Publication number 20210089151
- Publication date Mar 25, 2021
- DONGWOO FINE-CHEM CO., LTD
- Byung Hoon SONG
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
TRANSMISSION LINE AND MOUNTING STRUCTURE THEREOF
- Publication number 20210029822
- Publication date Jan 28, 2021
- Murata Manufacturing Co., Ltd.
- Kuniaki YOSUI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD HAVING A DIFFERENTIAL PAIR ROUTING TOPOLOGY W...
- Publication number 20200404774
- Publication date Dec 24, 2020
- INFINERA CORPORATION
- Aneesh Kachroo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Varying width along a single conductor Conductors or pads having different widths

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Transmission module, electronic unit, and electronic device

Backplane footprint for high speed, high density electrical connectors

Electrically conductive film

Differential circuit board and semiconductor light emitting device

Printed circuit board and display device including the same

Fine feature formation techniques for printed circuit boards

Backplane footprint for high speed, high density electrical connectors

Information handling system with split trace for high speed routing

Dual trace thickness for single layer routing

Backplane footprint for high speed, high density electrical connectors

Electrically conductive film

Semiconductor device and display device

Bump-on-trace design for enlarge bump-to-trace distance

Ceramic electronic component

Ceramic electronic component

Flexible circuit board

Printed wiring board

Impedance matching within a signal transmission channel

Backplane footprint for high speed, high density electrical connectors

Semiconductor device and display device

Metal base circuit board and method of manufacturing the metal base...

Component carrier with electrically reliable bridge with sufficient...

Light source module

Functional panel, method for manufacturing the same and terminal

Electronic circuit board and electronic circuit device

Land for surface mounted component

Electrically conductive film

Input device with reinforcement plate and wider grounding wire

Conductive pattern

Detection device and display device with detection function

Patents Applicationslast 30 patents

MULTILAYER BOARD, MULTILAYER BOARD MODULE, AND ELECTRONIC DEVICE

Core Resonance Suppression in Signal Integrity Optimized Package

PRINTED WIRING BOARD

WIRING BOARD AND MANUFACTURING METHOD FOR THE SAME

CIRCUIT BOARD

WIRING BOARD, ELECTRONIC COMPONENT STORAGE PACKAGE, AND ELECTRONIC...

WIRING CIRCUIT BOARD

BACKPLANE FOOTPRINT FOR HIGH SPEED, HIGH DENSITY ELECTRICAL CONNECTORS

CIRCUIT BOARD

DUAL TRACE THICKNESS FOR SINGLE LAYER ROUTING

Bump-on-Trace Design for Enlarge Bump-to-Trace Distance

CIRCUIT BOARD

BACKPLANE FOOTPRINT FOR HIGH SPEED, HIGH DENSITY ELECTRICAL CONNECTORS

ELECTRONIC CIRCUIT AND CIRCUIT BOARD

IMPEDANCE MATCHING WITHIN A SIGNAL TRANSMISSION CHANNEL

ELECTRICALLY CONDUCTIVE FILM

WIRING BOARD AND METHOD FOR MANUFACTURING WIRING BOARD

PRINTED CIRCUIT BOARD AND DISPLAY DEVICE INCLUDING THE SAME

DIFFERENTIAL CIRCUIT BOARD AND SEMICONDUCTOR LIGHT EMITTING DEVICE

INFORMATION HANDLING SYSTEM WITH SPLIT TRACE FOR HIGH SPEED ROUTING

FINE FEATURE FORMATION TECHNIQUES FOR PRINTED CIRCUIT BOARDS

BACKPLANE FOOTPRINT FOR HIGH SPEED, HIGH DENSITY ELECTRICAL CONNECTORS

MODULE AND METHOD OF MANUFACTURING THE SAME

BACKPLANE FOOTPRINT FOR HIGH SPEED, HIGH DENSITY ELECTRICAL CONNECTORS

Electrically Conductive Film

Component Carrier With Electrically Reliable Bridge With Sufficient...

MULTI-LAYERED CIRCUIT BOARD

CONDUCTIVE PATTERN

TRANSMISSION LINE AND MOUNTING STRUCTURE THEREOF

PRINTED CIRCUIT BOARD HAVING A DIFFERENTIAL PAIR ROUTING TOPOLOGY W...