Vertically mounted

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CPC
H05K2201/10454

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

Current Industry

H05K2201/10454Vertically mounted

Industries

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Patents Grantslast 30 patents

Information Patent Grant
High speed network device with orthogonal pluggable optics modules
- Patent number 12,158,627
- Issue date Dec 3, 2024
- Arista Networks, Inc.
- Adam Hemp
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connection system for printed circuit board
- Patent number 12,085,764
- Issue date Sep 10, 2024
- Senko Advanced Components, Inc.
- Benjamin Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate with buried component and manufacture method thereof
- Patent number 11,792,939
- Issue date Oct 17, 2023
- Unimicron Technology Corp.
- Yu-Shen Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Sensor device for measuring current in electrical circuit
- Patent number 11,785,708
- Issue date Oct 10, 2023
- Keysight Technologies, Inc.
- Ryo Takeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertical embedded component in a printed circuit board blind hole
- Patent number 11,696,409
- Issue date Jul 4, 2023
- Intel Corporation
- Tin Poay Chuah
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
3D electrical integration using component carrier edge connections...
- Patent number 11,626,357
- Issue date Apr 11, 2023
- FormFactor, Inc.
- Roy J. Henson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mounting structure for heater element, method for mounting heater e...
- Patent number 11,574,852
- Issue date Feb 7, 2023
- Fuji Electric Co., Ltd.
- Shun Fukuchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical package assembly and mobile terminal
- Patent number 11,552,201
- Issue date Jan 10, 2023
- VIVO MOBILE COMMUNICATION CO., LTD.
- Wanglai Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Voltage regulator module
- Patent number 11,439,017
- Issue date Sep 6, 2022
- Delta Electronics, Inc.
- Yahong Xiong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical assembly
- Patent number 11,266,008
- Issue date Mar 1, 2022
- FUDING PRECISION COMPONENTS (SHENZHEN) CO., LTD.
- Heng-Kang Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated device package
- Patent number 11,083,089
- Issue date Aug 3, 2021
- Analog Devices International Unlimited Company
- Teik Tiong Toong
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Resin molded substrate and mounting structure for capacitor
- Patent number 10,984,949
- Issue date Apr 20, 2021
- FANUC CORPORATION
- Yuuki Inoue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Voltage regulator module
- Patent number 10,973,127
- Issue date Apr 6, 2021
- Delta Electronics, Inc.
- Yahong Xiong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Antenna base for fixing an antenna body on a casing, antenna struct...
- Patent number 10,957,974
- Issue date Mar 23, 2021
- Wistron Corporation
- Chung-Ta Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connecting arrangement and corresponding method for mounting an ele...
- Patent number 10,905,010
- Issue date Jan 26, 2021
- Robert Bosch GmbH
- Helmut Seiband
- G01 - MEASURING TESTING
Information Patent Grant
Mainboard for POS terminal
- Patent number 10,765,004
- Issue date Sep 1, 2020
- POSBANK CO., LTD.
- Dong Uk Eun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component-embedded substrate and method for manufacturing component...
- Patent number 10,709,020
- Issue date Jul 7, 2020
- Murata Manufacturing Co., Ltd.
- Kuniaki Yosui
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Vertical module and perpendicular pin array interconnect for stacke...
- Patent number 10,602,612
- Issue date Mar 24, 2020
- Apple Inc.
- Lan H. Hoang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Inter-chip alignment
- Patent number 10,410,989
- Issue date Sep 10, 2019
- University of Notre Dame du Lac
- Douglas C. Hall
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device mounting structure, backlight device, and moun...
- Patent number 10,129,977
- Issue date Nov 13, 2018
- Nichia Corporation
- Takuya Nakabayashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Light-emitting module, light-emitting device and method of making l...
- Patent number 10,090,448
- Issue date Oct 2, 2018
- Rohm Co., Ltd.
- Yuki Tanuma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer ceramic electronic component and board for mounting the...
- Patent number 9,978,514
- Issue date May 22, 2018
- Samsung Electro-Mechanics Co., Ltd.
- Byung Woo Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electric meter base level printed circuit board
- Patent number 9,885,743
- Issue date Feb 6, 2018
- Itron, Inc.
- David Nelson Makinson
- G01 - MEASURING TESTING
Information Patent Grant
Printed circuit board with compact groups of devices
- Patent number 9,743,522
- Issue date Aug 22, 2017
- Apple Inc.
- Xingqun Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Small footprint semiconductor package
- Patent number 9,666,557
- Issue date May 30, 2017
- Infineon Technologies AG
- Tian San Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device comprising a capacitor in a holder for a circuit...
- Patent number 9,497,877
- Issue date Nov 15, 2016
- SMA Solar Technology AG
- Eberhard Janssen
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Coefficient of thermal expansion compensating compliant component
- Patent number 9,357,634
- Issue date May 31, 2016
- Kemet Electronics Corporation
- John E. McConnell
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Backlight unit and liquid crystal display comprising the same
- Patent number 9,341,764
- Issue date May 17, 2016
- Samsung Display Co., Ltd.
- Rae Young Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer ceramic electronic component and board for mounting the...
- Patent number 9,336,944
- Issue date May 10, 2016
- Samsung Electro-Mechanics Co., Ltd.
- Wi Heon Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic part and electronic control unit
- Patent number 9,224,563
- Issue date Dec 29, 2015
- Denso Corporation
- Toru Itabashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC PACKAGE MODULE AND METHOD FOR FABRICATION OF THE SAME
- Publication number 20250056730
- Publication date Feb 13, 2025
- USI Science and Technology (Shenzhen) Co., Ltd.
- MING CHANG TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH SPEED NETWORK DEVICE WITH ORTHOGONAL PLUGGABLE OPTICS MODULES
- Publication number 20250044536
- Publication date Feb 6, 2025
- Arista Networks, Inc.
- Andreas Bechtolsheim
- G02 - OPTICS
Information Patent Application
Electronic Device
- Publication number 20240162637
- Publication date May 16, 2024
- SEIKO EPSON CORPORATION
- Hitoshi UENO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH SPEED NETWORK DEVICE WITH ORTHOGONAL PLUGGABLE OPTICS MODULES
- Publication number 20230305247
- Publication date Sep 28, 2023
- Arista Networks, Inc.
- Adam Hemp
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE WITH BURIED COMPONENT AND MANUFACTURE METHOD THEREOF
- Publication number 20230058180
- Publication date Feb 23, 2023
- Unimicron Technology Corp.
- Yu-Shen Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
3D electrical integration using component carrier edge connections...
- Publication number 20210375733
- Publication date Dec 2, 2021
- Roy J. Henson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOUNTING STRUCTURE FOR HEATER ELEMENT, METHOD FOR MOUNTING HEATER E...
- Publication number 20210327784
- Publication date Oct 21, 2021
- Fuji Electric Co., Ltd.
- Shun FUKUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VOLTAGE REGULATOR MODULE
- Publication number 20210204408
- Publication date Jul 1, 2021
- DELTA ELECTRONICS, INC.
- Yahong Xiong
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
RESIN MOLDED SUBSTRATE AND MOUNTING STRUCTURE FOR CAPACITOR
- Publication number 20200227206
- Publication date Jul 16, 2020
- FANUC CORPORATION
- Yuuki INOUE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRICAL ASSEMBLY
- Publication number 20200120790
- Publication date Apr 16, 2020
- FU DING PRECISION COMPONENT (SHEN ZHEN) CO., LTD.
- HENG-KANG WU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
VOLTAGE REGULATOR MODULE
- Publication number 20200113057
- Publication date Apr 9, 2020
- Delta Electronics, Inc.
- Yahong Xiong
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
Mainboard for POS Terminal
- Publication number 20190380205
- Publication date Dec 12, 2019
- Dong Uk EUN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
VERTICAL EMBEDDED COMPONENT IN A PRINTED CIRCUIT BOARD BLIND HOLE
- Publication number 20190208643
- Publication date Jul 4, 2019
- Intel Corporation
- Tin Poay CHUAH
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMPONENT-EMBEDDED SUBSTRATE AND METHOD FOR MANUFACTURING COMPONENT...
- Publication number 20190037702
- Publication date Jan 31, 2019
- Murata Manufacturing Co., Ltd.
- Kuniaki YOSUI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR COMPONENT AND METHOD OF PRODUCING A SEMICONDUCTOR COM...
- Publication number 20180249578
- Publication date Aug 30, 2018
- Osram Opto Semiconductors GmbH
- Frank Singer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRICAL DEVICES AND METHODS FOR MANUFACTURING SAME
- Publication number 20150296623
- Publication date Oct 15, 2015
- Presidio Components, Inc.
- Hung Van Trinh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Small Footprint Semiconductor Package
- Publication number 20140353766
- Publication date Dec 4, 2014
- Tian San Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER CERAMIC ELECTRONIC COMPONENT AND BOARD FOR MOUNTING THE...
- Publication number 20140318845
- Publication date Oct 30, 2014
- Samsung Electro-Mechanics Co., Ltd.
- Wi Heon KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYERED CERAMIC ELECTRONIC COMPONENT AND BOARD FOR MOUNTING TH...
- Publication number 20140318841
- Publication date Oct 30, 2014
- Samsung Electro-Mechanics Co., Ltd.
- Eung Soo KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER CERAMIC ELECTRONIC COMPONENT AND BOARD FOR MOUNTING THE...
- Publication number 20140311789
- Publication date Oct 23, 2014
- Samsung Electro-Mechanics Co., Ltd.
- Byung Woo HAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD STRUCTURE HAVING ELECTRONIC COMPONENTS EMBEDDED THERE...
- Publication number 20140247570
- Publication date Sep 4, 2014
- Doau-Tzu Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC PART AND ELECTRONIC CONTROL UNIT
- Publication number 20140240942
- Publication date Aug 28, 2014
- Murata Manufacturing Co., Ltd.
- Toru ITABASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electric Meter Base Level Printed Circuit Board
- Publication number 20140167738
- Publication date Jun 19, 2014
- Itron, Inc.
- David Nelson Makinson
- G01 - MEASURING TESTING
Information Patent Application
ELECTRONIC DEVICE COMPRISING A CAPACITOR IN A HOLDER FOR A CIRCUIT...
- Publication number 20140160704
- Publication date Jun 12, 2014
- SMA Solar Technology AG
- Eberhard Janssen
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
Electronic Assembly with Three Dimensional Inkjet Printed Traces
- Publication number 20140127856
- Publication date May 8, 2014
- TEXAS INSTRUMENTS INCORPORATED
- Matthew David Romig
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Printed circuit board with compact groups of devices
- Publication number 20140085850
- Publication date Mar 27, 2014
- Xingqun Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CO-SUPPORT COMPONENT AND MICROELECTRONIC ASSEMBLY
- Publication number 20140055970
- Publication date Feb 27, 2014
- Invensas Corporation
- Richard Dewitt Crisp
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic Assembly With Three Dimensional Inkjet Printed Traces
- Publication number 20140054795
- Publication date Feb 27, 2014
- TEXAS INSTRUMENTS INCORPORATED
- Matthew David Romig
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT EMITTING DEVICE, LIGHT EMITTING MODULE, AND METHOD FOR MANUFA...
- Publication number 20130320381
- Publication date Dec 5, 2013
- KABUSHIKI KAISHA TOSHIBA
- Akihiro KOJIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COEFFICIENT OF THERMAL EXPANSION COMPENSATING COMPLIANT COMPONENT
- Publication number 20130284501
- Publication date Oct 31, 2013
- Kemet Electronics Corporation
- John E. McConnell
- H01 - BASIC ELECTRIC ELEMENTS

Vertically mounted

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

High speed network device with orthogonal pluggable optics modules

Connection system for printed circuit board

Substrate with buried component and manufacture method thereof

Sensor device for measuring current in electrical circuit

Vertical embedded component in a printed circuit board blind hole

3D electrical integration using component carrier edge connections...

Mounting structure for heater element, method for mounting heater e...

Optical package assembly and mobile terminal

Voltage regulator module

Electrical assembly

Integrated device package

Resin molded substrate and mounting structure for capacitor

Voltage regulator module

Antenna base for fixing an antenna body on a casing, antenna struct...

Connecting arrangement and corresponding method for mounting an ele...

Mainboard for POS terminal

Component-embedded substrate and method for manufacturing component...

Vertical module and perpendicular pin array interconnect for stacke...

Inter-chip alignment

Semiconductor device mounting structure, backlight device, and moun...

Light-emitting module, light-emitting device and method of making l...

Multilayer ceramic electronic component and board for mounting the...

Electric meter base level printed circuit board

Printed circuit board with compact groups of devices

Small footprint semiconductor package

Electronic device comprising a capacitor in a holder for a circuit...

Coefficient of thermal expansion compensating compliant component

Backlight unit and liquid crystal display comprising the same

Multilayer ceramic electronic component and board for mounting the...

Electronic part and electronic control unit

Patents Applicationslast 30 patents

ELECTRONIC PACKAGE MODULE AND METHOD FOR FABRICATION OF THE SAME

HIGH SPEED NETWORK DEVICE WITH ORTHOGONAL PLUGGABLE OPTICS MODULES

Electronic Device

HIGH SPEED NETWORK DEVICE WITH ORTHOGONAL PLUGGABLE OPTICS MODULES

SUBSTRATE WITH BURIED COMPONENT AND MANUFACTURE METHOD THEREOF

3D electrical integration using component carrier edge connections...

MOUNTING STRUCTURE FOR HEATER ELEMENT, METHOD FOR MOUNTING HEATER E...

VOLTAGE REGULATOR MODULE

RESIN MOLDED SUBSTRATE AND MOUNTING STRUCTURE FOR CAPACITOR

ELECTRICAL ASSEMBLY

VOLTAGE REGULATOR MODULE

Mainboard for POS Terminal

VERTICAL EMBEDDED COMPONENT IN A PRINTED CIRCUIT BOARD BLIND HOLE

COMPONENT-EMBEDDED SUBSTRATE AND METHOD FOR MANUFACTURING COMPONENT...

SEMICONDUCTOR COMPONENT AND METHOD OF PRODUCING A SEMICONDUCTOR COM...

ELECTRICAL DEVICES AND METHODS FOR MANUFACTURING SAME

Small Footprint Semiconductor Package

MULTILAYER CERAMIC ELECTRONIC COMPONENT AND BOARD FOR MOUNTING THE...

MULTILAYERED CERAMIC ELECTRONIC COMPONENT AND BOARD FOR MOUNTING TH...

MULTILAYER CERAMIC ELECTRONIC COMPONENT AND BOARD FOR MOUNTING THE...

CIRCUIT BOARD STRUCTURE HAVING ELECTRONIC COMPONENTS EMBEDDED THERE...

ELECTRONIC PART AND ELECTRONIC CONTROL UNIT

Electric Meter Base Level Printed Circuit Board

ELECTRONIC DEVICE COMPRISING A CAPACITOR IN A HOLDER FOR A CIRCUIT...

Electronic Assembly with Three Dimensional Inkjet Printed Traces

Printed circuit board with compact groups of devices

CO-SUPPORT COMPONENT AND MICROELECTRONIC ASSEMBLY

Electronic Assembly With Three Dimensional Inkjet Printed Traces

LIGHT EMITTING DEVICE, LIGHT EMITTING MODULE, AND METHOD FOR MANUFA...

COEFFICIENT OF THERMAL EXPANSION COMPENSATING COMPLIANT COMPONENT