Via connected to metal substrate

Industry

CPC
H05K2201/09554

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

Current Industry

H05K2201/09554Via connected to metal substrate

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Circuit board with rigid portion and flexible portion having connec...
- Patent number 12,185,456
- Issue date Dec 31, 2024
- First Hi-tec Enterprise Co., Ltd.
- Min-Lin Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board
- Patent number 12,156,329
- Issue date Nov 26, 2024
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Seong Ho Choi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flexible printed circuit
- Patent number 11,197,371
- Issue date Dec 7, 2021
- WUHAN TIANMA MICRO-ELECTRONICS CO., LTD.
- Xiang Huang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Carrier substrate, package, and method of manufacture
- Patent number 10,777,457
- Issue date Sep 15, 2020
- Ubotic Company Limited
- Ming-Wa Tam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cooling component carrier material by carbon structure within diele...
- Patent number 10,736,222
- Issue date Aug 4, 2020
- AT&S Austria Technologies & Systemtechnik Aktiengesellschaft
- Jonathan Silvano de Sousa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board assembly and method for producing same
- Patent number 10,237,971
- Issue date Mar 19, 2019
- Fujikura Ltd.
- Ryotaro Takagi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Selective segment via plating process and structure
- Patent number 9,867,290
- Issue date Jan 9, 2018
- Multek Technologies Limited
- Kwan Pen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Selective segment via plating process and structure
- Patent number 9,763,327
- Issue date Sep 12, 2017
- Multek Technologies Limited
- Kwan Pen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board, circuit and method for producing a circuit
- Patent number 9,648,742
- Issue date May 9, 2017
- Auto-Kabel Management GmbH
- Wacim Tazarine
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Suspension board assembly sheet with circuits and method for manufa...
- Patent number 9,451,704
- Issue date Sep 20, 2016
- Nitto Denko Corporation
- Terukazu Ihara
- G11 - INFORMATION STORAGE
Information Patent Grant
Method of manufacturing a wiring board having via structures
- Patent number 9,107,314
- Issue date Aug 11, 2015
- Fujitsu Limited
- Hideaki Yoshimura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board and method for manufacturing the same
- Patent number 8,866,027
- Issue date Oct 21, 2014
- Sumitomo Electric Industries, Ltd.
- Yoshio Oka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ground vias for enhanced preamp heat release in hard disk drives
- Patent number 8,730,684
- Issue date May 20, 2014
- Nitto Denko Corporation
- Alex Cayaban
- G11 - INFORMATION STORAGE
Information Patent Grant
Wired circuit board
- Patent number 8,669,479
- Issue date Mar 11, 2014
- Nitto Denko Corporation
- Jun Ishii
- G11 - INFORMATION STORAGE
Information Patent Grant
Multi-layer circuit assembly and process for preparing the same
- Patent number 8,598,467
- Issue date Dec 3, 2013
- PPG Industries Chio, Inc.
- Kevin C. Olson
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Low impedance, high bandwidth disk drive suspension circuit
- Patent number 8,553,364
- Issue date Oct 8, 2013
- Magnecomp Corporation
- Christopher Schreiber
- G11 - INFORMATION STORAGE
Information Patent Grant
Metal core circuit element mounting board
- Patent number 8,436,250
- Issue date May 7, 2013
- Sanyo Electric Co., Ltd.
- Kouji Takahashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of forming solid blind vias through the dielectric coating o...
- Patent number 8,409,982
- Issue date Apr 2, 2013
- PPG Industries Ohio, Inc.
- Kevin C. Olson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate for suspension
- Patent number 8,399,774
- Issue date Mar 19, 2013
- Dai Nippon Printing Co., Ltd.
- Yoichi Hitomi
- G11 - INFORMATION STORAGE
Information Patent Grant
Suspension board with circuit
- Patent number 8,395,055
- Issue date Mar 12, 2013
- Nitto Denko Corporation
- Hirotoshi Iguchi
- G11 - INFORMATION STORAGE
Information Patent Grant
Resilient flying lead and terminus for disk drive suspension
- Patent number 8,395,866
- Issue date Mar 12, 2013
- Magnecomp Corporation
- Christopher Schreiber
- G11 - INFORMATION STORAGE
Information Patent Grant
Circuit device
- Patent number 8,363,419
- Issue date Jan 29, 2013
- Sanyo Electric Co., LTD
- Yoh Takano
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit-on-foil process for manufacturing a laminated semiconductor...
- Patent number 8,322,030
- Issue date Dec 4, 2012
- Amkor Technology, Inc.
- Ronald Patrick Huemoeller
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multi-level circuit substrate fabrication method
- Patent number 8,316,536
- Issue date Nov 27, 2012
- Amkor Technology, Inc.
- Ronald Patrick Huemoeller
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board with improved via design
- Patent number 8,258,411
- Issue date Sep 4, 2012
- PPG Industries Ohio, Inc.
- Alan E. Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wired circuit board
- Patent number 8,247,700
- Issue date Aug 21, 2012
- Nitto Denko Corporation
- Jun Ishii
- G11 - INFORMATION STORAGE
Information Patent Grant
Production method of suspension board with circuit
- Patent number 8,236,186
- Issue date Aug 7, 2012
- Nitto Denko Corporation
- Aya Mizushima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ground vias for enhanced preamp heat release in hard disk drives
- Patent number 8,233,287
- Issue date Jul 31, 2012
- Nitto Denko Corporation
- Alex Cayaban
- G11 - INFORMATION STORAGE
Information Patent Grant
Power semiconductor module
- Patent number 8,154,114
- Issue date Apr 10, 2012
- Infineon Technologies AG
- Reinhold Bayerer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of forming a circuit board with improved via design
- Patent number 8,141,245
- Issue date Mar 27, 2012
- PPG Industries Ohio, Inc.
- Kevin C. Olson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Single Layer Capacitor
- Publication number 20240234038
- Publication date Jul 11, 2024
- KYOCERA AVX Components Corporation
- Ronald S. Demcko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Single Layer Capacitor
- Publication number 20240136123
- Publication date Apr 25, 2024
- KYOCERA AVX Components Corporation
- Ronald S. Demcko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING CIRCUIT BOARD
- Publication number 20240008178
- Publication date Jan 4, 2024
- Nitto Denko Corporation
- Shusaku SHIBATA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20230397330
- Publication date Dec 7, 2023
- Samsung Electro-Mechanics Co., Ltd.
- Seong Ho Choi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING CIRCUIT BOARD AND METHOD OF PRODUCING THE SAME
- Publication number 20230133282
- Publication date May 4, 2023
- Nitto Denko Corporation
- Takahiro IKEDA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Flexible Printed Circuit
- Publication number 20210185813
- Publication date Jun 17, 2021
- Wuhan Tianma Micro-Electronics Co., Ltd.
- Xiang HUANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CARRIER SUBSTRATE, PACKAGE, AND METHOD OF MANUFACTURE
- Publication number 20190103313
- Publication date Apr 4, 2019
- Ubotic Company Limited
- Ming-Wa TAM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SELECTIVE SEGMENT VIA PLATING PROCESS AND STRUCTURE
- Publication number 20160278207
- Publication date Sep 22, 2016
- Multek Technologies Ltd.
- Kwan Pen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20150364405
- Publication date Dec 17, 2015
- Shinko Electric Industries Co., Ltd.
- Yuji Kunimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING A VIA STRUCTURE USING A DOUBLE-SIDE LASER PROCESS
- Publication number 20150257281
- Publication date Sep 10, 2015
- Marvell World Trade Ltd.
- Huahung Kao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Substrate Design for Semiconductor Packages and Method of Forming Same
- Publication number 20150235915
- Publication date Aug 20, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Min Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EBG STRUCTURE, SEMICONDUCTOR DEVICE, AND CIRCUIT BOARD
- Publication number 20150084167
- Publication date Mar 26, 2015
- KABUSHIKI KAISHA TOSHIBA
- Tadahiro SASAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUSPENSION BOARD ASSEMBLY SHEET WITH CIRCUITS AND METHOD FOR MANUFA...
- Publication number 20140126169
- Publication date May 8, 2014
- Nitto Denko Corporation
- Terukazu IHARA
- G11 - INFORMATION STORAGE
Information Patent Application
METHOD OF MANUFACTURING WIRING BOARD, WIRING BOARD, AND VIA STRUCTURE
- Publication number 20130240259
- Publication date Sep 19, 2013
- Fujitsu Limited
- Hideaki YOSHIMURA
- G01 - MEASURING TESTING
Information Patent Application
WIRED CIRCUIT BOARD
- Publication number 20130133939
- Publication date May 30, 2013
- Nitto Denko Corporation
- Jun ISHII
- G11 - INFORMATION STORAGE
Information Patent Application
GROUND VIAS FOR ENHANCED PREAMP HEAT RELEASE IN HARD DISK DRIVES
- Publication number 20120291260
- Publication date Nov 22, 2012
- Nitto Denko Corporation
- Alex CAYABAN
- G11 - INFORMATION STORAGE
Information Patent Application
SUBSTRATE FOR SUSPENSION
- Publication number 20120090878
- Publication date Apr 19, 2012
- Dai Nippon Printing Co., Ltd.
- Yoichi Hitomi
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Multi-Layer Circuit Assembly And Process For Preparing The Same
- Publication number 20120031655
- Publication date Feb 9, 2012
- PPG INDUSTRIES OHIO, INC.
- Kevin C. Olson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF FORMING SOLID BLIND VIAS THROUGH THE DIELECTRIC COATING O...
- Publication number 20110266156
- Publication date Nov 3, 2011
- PPG INDUSTRIES OHIO, INC.
- Kevin C. Olson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HEAT DISSIPATING SUBSTRATE
- Publication number 20110088928
- Publication date Apr 21, 2011
- Chang Hyun LIM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DISK DRIVE SUSPENSION VIA FORMATION USING A TIE LAYER AND PRODUCT
- Publication number 20100230144
- Publication date Sep 16, 2010
- Magnecomp Corporation
- Christopher Schreiber
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Additive disk drive suspension manufacturing using tie layers for v...
- Publication number 20100230135
- Publication date Sep 16, 2010
- Magnecomp Corporation
- Christopher Schreiber
- G11 - INFORMATION STORAGE
Information Patent Application
MULTI-LAYERED INTERCONNECT STRUCTURE USING LIQUID CRYSTALLINE POLYM...
- Publication number 20100218891
- Publication date Sep 2, 2010
- International Business Machines Corporation
- Frank D. Egitto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT DEVICE
- Publication number 20100188059
- Publication date Jul 29, 2010
- Yoh Takano
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
- Publication number 20100116540
- Publication date May 13, 2010
- Nitto Denko Corporation
- Jun ISHII
- G11 - INFORMATION STORAGE
Information Patent Application
POWER SEMICONDUCTOR MODULE
- Publication number 20100065962
- Publication date Mar 18, 2010
- INFINEON TECHNOLOGIES AG
- Reinhold Bayerer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20100044094
- Publication date Feb 25, 2010
- Sumitomo Electric Industries, Ltd.
- Yoshio Oka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT ELEMENT MOUNTING BOARD, AND CIRCUIT DEVICE AND AIR CONDITIO...
- Publication number 20100012360
- Publication date Jan 21, 2010
- Kouji Takahashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Printed Circuit Board With Improved Via Design
- Publication number 20100012357
- Publication date Jan 21, 2010
- Alan E. Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PROCESS OF PACKAGE SUBSTRATE
- Publication number 20090314650
- Publication date Dec 24, 2009
- Subtron Technology Co. Ltd.
- Tzyy-Jang Tseng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Via connected to metal substrate

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Circuit board with rigid portion and flexible portion having connec...

Printed circuit board

Flexible printed circuit

Carrier substrate, package, and method of manufacture

Cooling component carrier material by carbon structure within diele...

Wiring board assembly and method for producing same

Selective segment via plating process and structure

Selective segment via plating process and structure

Printed circuit board, circuit and method for producing a circuit

Suspension board assembly sheet with circuits and method for manufa...

Method of manufacturing a wiring board having via structures

Printed wiring board and method for manufacturing the same

Ground vias for enhanced preamp heat release in hard disk drives

Wired circuit board

Multi-layer circuit assembly and process for preparing the same

Low impedance, high bandwidth disk drive suspension circuit

Metal core circuit element mounting board

Method of forming solid blind vias through the dielectric coating o...

Substrate for suspension

Suspension board with circuit

Resilient flying lead and terminus for disk drive suspension

Circuit device

Circuit-on-foil process for manufacturing a laminated semiconductor...

Multi-level circuit substrate fabrication method

Printed circuit board with improved via design

Wired circuit board

Production method of suspension board with circuit

Ground vias for enhanced preamp heat release in hard disk drives

Power semiconductor module

Method of forming a circuit board with improved via design

Patents Applicationslast 30 patents

Single Layer Capacitor

Single Layer Capacitor

WIRING CIRCUIT BOARD

PRINTED CIRCUIT BOARD

WIRING CIRCUIT BOARD AND METHOD OF PRODUCING THE SAME

Flexible Printed Circuit

CARRIER SUBSTRATE, PACKAGE, AND METHOD OF MANUFACTURE

SELECTIVE SEGMENT VIA PLATING PROCESS AND STRUCTURE

WIRING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME

METHOD FOR FORMING A VIA STRUCTURE USING A DOUBLE-SIDE LASER PROCESS

Substrate Design for Semiconductor Packages and Method of Forming Same

EBG STRUCTURE, SEMICONDUCTOR DEVICE, AND CIRCUIT BOARD

SUSPENSION BOARD ASSEMBLY SHEET WITH CIRCUITS AND METHOD FOR MANUFA...

METHOD OF MANUFACTURING WIRING BOARD, WIRING BOARD, AND VIA STRUCTURE

WIRED CIRCUIT BOARD

GROUND VIAS FOR ENHANCED PREAMP HEAT RELEASE IN HARD DISK DRIVES

SUBSTRATE FOR SUSPENSION

Multi-Layer Circuit Assembly And Process For Preparing The Same

METHOD OF FORMING SOLID BLIND VIAS THROUGH THE DIELECTRIC COATING O...

HEAT DISSIPATING SUBSTRATE

DISK DRIVE SUSPENSION VIA FORMATION USING A TIE LAYER AND PRODUCT

Additive disk drive suspension manufacturing using tie layers for v...

MULTI-LAYERED INTERCONNECT STRUCTURE USING LIQUID CRYSTALLINE POLYM...

CIRCUIT DEVICE

PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

POWER SEMICONDUCTOR MODULE

PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

CIRCUIT ELEMENT MOUNTING BOARD, AND CIRCUIT DEVICE AND AIR CONDITIO...

Printed Circuit Board With Improved Via Design

PROCESS OF PACKAGE SUBSTRATE