Via fence

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CPC
H05K2201/09618

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

Current Industry

H05K2201/09618Via fence

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Module
- Patent number 12,193,162
- Issue date Jan 7, 2025
- Murata Manufacturing Co., Ltd.
- Yoshihito Otsubo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board with rigid portion and flexible portion having connec...
- Patent number 12,185,456
- Issue date Dec 31, 2024
- First Hi-tec Enterprise Co., Ltd.
- Min-Lin Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Protection of electronics in negative pressure wound therapy systems
- Patent number 12,127,333
- Issue date Oct 22, 2024
- Smith & Nephew PLC
- Ben Alan Askem
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Circuit board
- Patent number 12,063,737
- Issue date Aug 13, 2024
- LG Innotek Co., Ltd
- Hae Sik Kim
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Substrate integrated waveguide (SIW) including fences with wall str...
- Patent number 11,909,089
- Issue date Feb 20, 2024
- VAYYAR IMAGING LTD.
- Naftali Chayat
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer wiring substrate
- Patent number 11,871,513
- Issue date Jan 9, 2024
- Murata Manufacturing Co., Ltd.
- Masao Kondo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Protection of electronics in negative pressure wound therapy systems
- Patent number 11,800,638
- Issue date Oct 24, 2023
- Smith & Nephew PLC
- Ben Alan Askem
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board
- Patent number 11,778,741
- Issue date Oct 3, 2023
- LG Innotek Co., Ltd
- Yong Han Jeon
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Slotted vias for circuit boards
- Patent number 11,758,644
- Issue date Sep 12, 2023
- Dell Products L.P.
- Jason Pritchard
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Anodic aluminum oxide structure, probe head having same, and probe...
- Patent number 11,696,398
- Issue date Jul 4, 2023
- POINT ENGINEERING CO., LTD.
- Bum Mo Ahn
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Radio frequency (RF) system with RF isolation chambers and method o...
- Patent number 11,612,051
- Issue date Mar 21, 2023
- Lockheed Martin Corporation
- Andrew E. White
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Protection of electronics in negative pressure wound therapy systems
- Patent number 11,511,021
- Issue date Nov 29, 2022
- Smith & Nephew PLC
- Ben Alan Askem
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Printed circuit board including a substrate integrated waveguide ha...
- Patent number 11,450,937
- Issue date Sep 20, 2022
- VAYYAR IMAGING LTD.
- Naftali Chayat
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board with substrate-integrated waveguide transition
- Patent number 11,417,938
- Issue date Aug 16, 2022
- Texas Instruments Incorporated
- Meysam Moallem
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transmission line substrate and electronic device
- Patent number 11,387,016
- Issue date Jul 12, 2022
- Murata Manufacturing Co., Ltd.
- Takahiro Baba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer printed circuit board and electronic device including th...
- Patent number 11,362,697
- Issue date Jun 14, 2022
- Samsung Electronics Co., Ltd.
- Jinsu Heo
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Circuit board for a control device for a vehicle, method for produc...
- Patent number 11,240,946
- Issue date Feb 1, 2022
- Robert Bosch GmbH
- Stefan Balz
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer wiring substrate
- Patent number 11,240,912
- Issue date Feb 1, 2022
- Murata Manufacturing Co., Ltd.
- Masao Kondo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power supplies including shielded multilayer power transmission boards
- Patent number 11,129,275
- Issue date Sep 21, 2021
- Astec International Limited
- Prabou Ranganathan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Transmission line substrate and electronic device
- Patent number 11,037,701
- Issue date Jun 15, 2021
- Murata Manufacturing Co., Ltd.
- Takahiro Baba
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board, assembly and method of assembling
- Patent number 11,032,908
- Issue date Jun 8, 2021
- UOP LLC
- Sreenivasu Balusu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit via for KA satcom circuit boards
- Patent number 10,993,315
- Issue date Apr 27, 2021
- AvL Technologies, Inc.
- Ian J. Timmins
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Communication module packaging
- Patent number 10,952,312
- Issue date Mar 16, 2021
- II-VI DELAWARE, INC.
- Jianwei Mu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible substrate, flexible substrate-attached component, and manu...
- Patent number 10,869,395
- Issue date Dec 15, 2020
- Furukawa Electric Co., Ltd.
- Etsuji Katayama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board
- Patent number 10,856,406
- Issue date Dec 1, 2020
- Rohm Co., Ltd.
- Masashi Nagasato
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multichannel RF feedthroughs
- Patent number 10,845,553
- Issue date Nov 24, 2020
- II-VI Delaware Inc.
- Yan yang Zhao
- G02 - OPTICS
Information Patent Grant
Power supplies including shielded multilayer power transmission boards
- Patent number 10,798,818
- Issue date Oct 6, 2020
- Astec International Limited
- Prabou Ranganathan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device and electronic module
- Patent number 10,791,623
- Issue date Sep 29, 2020
- Shinko Electronic Industries Co., Ltd.
- Tomoharu Fujii
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Substrate, electronic device, and design support method of substrate
- Patent number 10,777,497
- Issue date Sep 15, 2020
- Fujitsu Limited
- Takahito Takemoto
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Electromagnetic interference shielding having a magnetically attrac...
- Patent number 10,736,246
- Issue date Aug 4, 2020
- Apple Inc.
- Jaejin Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
PROTECTION OF ELECTRONICS IN NEGATIVE PRESSURE WOUND THERAPY SYSTEMS
- Publication number 20250024590
- Publication date Jan 16, 2025
- Smith & Nephew PLC
- Ben Alan Askem
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD
- Publication number 20250016909
- Publication date Jan 9, 2025
- Sumitomo Electric Industries, Ltd.
- Shun IGARASHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
BURIED PATCH ANTENNA FOR LOW COST MMWAVE PHASED ARRAY DESIGN
- Publication number 20240405435
- Publication date Dec 5, 2024
- Jabil Inc.
- Ian Jeffery Timmins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SIGNAL PROCESSING BOARD AND IMAGE FORMING APPARATUS
- Publication number 20240107661
- Publication date Mar 28, 2024
- KYOCERA DOCUMENT SOLUTIONS INC.
- Shotaro Ikegami
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING SUBSTRATE
- Publication number 20240098897
- Publication date Mar 21, 2024
- IBIDEN CO., LTD.
- Yoshio MIZUTANI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PROTECTION OF ELECTRONICS IN NEGATIVE PRESSURE WOUND THERAPY SYSTEMS
- Publication number 20240080969
- Publication date Mar 7, 2024
- Smith & Nephew PLC
- Ben Alan Askem
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
ELECTRONIC DEVICE AND METHOD OF MANUFACTURING ELECTRONIC DEVICE
- Publication number 20240030580
- Publication date Jan 25, 2024
- Innolux Corporation
- Chen-Lin Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING CIRCUIT BOARD
- Publication number 20240008178
- Publication date Jan 4, 2024
- Nitto Denko Corporation
- Shusaku SHIBATA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLEXIBLE PRINTED WIRING BOARD AND ELECTRIC WIRING
- Publication number 20230354522
- Publication date Nov 2, 2023
- NIPPON MEKTRON, LTD.
- Shunsuke AOYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MAGNETIC ASSEMBLY
- Publication number 20230307170
- Publication date Sep 28, 2023
- Elytone Electronic Co. Ltd
- Hao-Te Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD
- Publication number 20230171882
- Publication date Jun 1, 2023
- LG Innotek Co., Ltd.
- Hae Sik KIM
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
PROTECTION OF ELECTRONICS IN NEGATIVE PRESSURE WOUND THERAPY SYSTEMS
- Publication number 20230164910
- Publication date May 25, 2023
- Smith & Nephew PLC
- Ben Alan Askem
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD
- Publication number 20230113302
- Publication date Apr 13, 2023
- LG Innotek Co., Ltd.
- Yong Han JEON
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MODULE
- Publication number 20230105635
- Publication date Apr 6, 2023
- Murata Manufacturing Co., Ltd.
- Yoshihito OTSUBO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MODULE
- Publication number 20230105809
- Publication date Apr 6, 2023
- Murata Manufacturing Co., Ltd.
- Yoshihito OTSUBO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MODULE
- Publication number 20230103130
- Publication date Mar 30, 2023
- Murata Manufacturing Co., Ltd.
- Yoshihito OTSUBO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HIGH-FREQUENCY CIRCUIT
- Publication number 20230019563
- Publication date Jan 19, 2023
- SUMITOMO ELECTRIC PRINTED CIRCUITS, INC.
- Koji NITTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD INCLUDING A SUBSTRATE INTEGRATED WAVEGUIDE HA...
- Publication number 20230011894
- Publication date Jan 12, 2023
- Vayyar Imaging Ltd.
- Naftali CHAYAT
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SLOTTED VIAS FOR CIRCUIT BOARDS
- Publication number 20220369452
- Publication date Nov 17, 2022
- Dell Products L.P.
- Jason PRITCHARD
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Component Carrier with Embedded High-Frequency Component and Integr...
- Publication number 20220299595
- Publication date Sep 22, 2022
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Michael Goessler
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DIELECTRIC SUBSTRATES AND WAVEGUIDES INTEGRATED THEREIN
- Publication number 20220200120
- Publication date Jun 23, 2022
- Vayyar Imaging Ltd.
- Naftali CHAYAT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Printed Circuit Board and Terminal
- Publication number 20210352803
- Publication date Nov 11, 2021
- Huawei Technologies Co., Ltd
- Liping Liu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ANODIC ALUMINUM OXIDE STRUCTURE, PROBE HEAD HAVING SAME, AND PROBE...
- Publication number 20210307160
- Publication date Sep 30, 2021
- Point Engineering Co., Ltd.
- Bum Mo AHN
- G01 - MEASURING TESTING
Information Patent Application
TRANSMISSION LINE SUBSTRATE AND ELECTRONIC DEVICE
- Publication number 20210249157
- Publication date Aug 12, 2021
- Murata Manufacturing Co., Ltd.
- Takahiro BABA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SPACE EFFICIENT LAYOUT OF PRINTED CIRCUIT BOARD POWER VIAS
- Publication number 20210059049
- Publication date Feb 25, 2021
- Dell Products L.P.
- Meng-Ru Tsai
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
POWER SUPPLIES INCLUDING SHIELDED MULTILAYER POWER TRANSMISSION BOARDS
- Publication number 20210007221
- Publication date Jan 7, 2021
- Astec International Limited
- Prabou RANGANATHAN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD, ASSEMBLY AND METHOD OF ASSEMBLING
- Publication number 20200389977
- Publication date Dec 10, 2020
- Honeywell International Inc.
- Sreenivasu Balusu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
VERTICAL TRANSITIONS FOR MICROWAVE AND MILLIMETER WAVE COMMUNICATIO...
- Publication number 20200303799
- Publication date Sep 24, 2020
- CommScope Technologies LLC
- Huan Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROMAGNETIC INTERFERENCE SHIELDING FOR A CIRCUIT BOARD
- Publication number 20200107476
- Publication date Apr 2, 2020
- Intel Corporation
- Jaejin Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYER PRINTED CIRCUIT BOARD AND ELECTRONIC DEVICE INCLUDING TH...
- Publication number 20200044679
- Publication date Feb 6, 2020
- Samsung Electronics Co., Ltd.
- Jinsu HEO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Module

Circuit board with rigid portion and flexible portion having connec...

Protection of electronics in negative pressure wound therapy systems

Circuit board

Substrate integrated waveguide (SIW) including fences with wall str...

Multilayer wiring substrate

Protection of electronics in negative pressure wound therapy systems

Circuit board

Slotted vias for circuit boards

Anodic aluminum oxide structure, probe head having same, and probe...

Radio frequency (RF) system with RF isolation chambers and method o...

Protection of electronics in negative pressure wound therapy systems

Printed circuit board including a substrate integrated waveguide ha...

Printed circuit board with substrate-integrated waveguide transition

Transmission line substrate and electronic device

Multilayer printed circuit board and electronic device including th...

Circuit board for a control device for a vehicle, method for produc...

Multilayer wiring substrate

Power supplies including shielded multilayer power transmission boards

Transmission line substrate and electronic device

Circuit board, assembly and method of assembling

Printed circuit via for KA satcom circuit boards

Communication module packaging

Flexible substrate, flexible substrate-attached component, and manu...

Printed wiring board

Multichannel RF feedthroughs

Power supplies including shielded multilayer power transmission boards

Electronic device and electronic module

Substrate, electronic device, and design support method of substrate

Electromagnetic interference shielding having a magnetically attrac...

Patents Applicationslast 30 patents

PROTECTION OF ELECTRONICS IN NEGATIVE PRESSURE WOUND THERAPY SYSTEMS

PRINTED WIRING BOARD

BURIED PATCH ANTENNA FOR LOW COST MMWAVE PHASED ARRAY DESIGN

SIGNAL PROCESSING BOARD AND IMAGE FORMING APPARATUS

WIRING SUBSTRATE

PROTECTION OF ELECTRONICS IN NEGATIVE PRESSURE WOUND THERAPY SYSTEMS

ELECTRONIC DEVICE AND METHOD OF MANUFACTURING ELECTRONIC DEVICE

WIRING CIRCUIT BOARD

FLEXIBLE PRINTED WIRING BOARD AND ELECTRIC WIRING

MAGNETIC ASSEMBLY

CIRCUIT BOARD

PROTECTION OF ELECTRONICS IN NEGATIVE PRESSURE WOUND THERAPY SYSTEMS

CIRCUIT BOARD

MODULE

MODULE

MODULE

HIGH-FREQUENCY CIRCUIT

PRINTED CIRCUIT BOARD INCLUDING A SUBSTRATE INTEGRATED WAVEGUIDE HA...

SLOTTED VIAS FOR CIRCUIT BOARDS

Component Carrier with Embedded High-Frequency Component and Integr...

DIELECTRIC SUBSTRATES AND WAVEGUIDES INTEGRATED THEREIN

Printed Circuit Board and Terminal

ANODIC ALUMINUM OXIDE STRUCTURE, PROBE HEAD HAVING SAME, AND PROBE...

TRANSMISSION LINE SUBSTRATE AND ELECTRONIC DEVICE

SPACE EFFICIENT LAYOUT OF PRINTED CIRCUIT BOARD POWER VIAS

POWER SUPPLIES INCLUDING SHIELDED MULTILAYER POWER TRANSMISSION BOARDS

CIRCUIT BOARD, ASSEMBLY AND METHOD OF ASSEMBLING

VERTICAL TRANSITIONS FOR MICROWAVE AND MILLIMETER WAVE COMMUNICATIO...

ELECTROMAGNETIC INTERFERENCE SHIELDING FOR A CIRCUIT BOARD

MULTILAYER PRINTED CIRCUIT BOARD AND ELECTRONIC DEVICE INCLUDING TH...