Wafer-level processed structures

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H01L27/14632

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L27/00Devices consisting of a plurality of semiconductor or other solid state components formed in or on a common substrate

Current Industry

H01L27/14632Wafer-level processed structures

Industries

Patents Grantslast 30 patents

Information Patent Grant
Reliable semiconductor packages
- Patent number 12,166,050
- Issue date Dec 10, 2024
- UTAC HEADQUARTERS PTD. LTD.
- Jeffrey Punzalan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same, and elec...
- Patent number 12,166,061
- Issue date Dec 10, 2024
- Sony Group Corporation
- Taku Umebayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Imaging system with selective readout for visible-infrared image ca...
- Patent number 12,142,625
- Issue date Nov 12, 2024
- OmniVision Technologies, Inc.
- Keiji Mabuchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method for manufacturing semiconductor pa...
- Patent number 12,132,063
- Issue date Oct 29, 2024
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Masami Suzuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor with actively cooled sensor array
- Patent number 12,119,285
- Issue date Oct 15, 2024
- Microsoft Technology Licensing, LLC
- Minseok Oh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solid-state imaging device including groove with recessed and proje...
- Patent number 12,107,106
- Issue date Oct 1, 2024
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Tomohiko Baba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dark-current inhibiting image sensor and method
- Patent number 12,107,107
- Issue date Oct 1, 2024
- OmniVision Technologies, Inc.
- Yifei Du
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
LIDAR sensor using compound semiconductor materials for mobile device
- Patent number 12,107,108
- Issue date Oct 1, 2024
- Aeluma, Inc.
- Jonathan Klamkin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same, and elec...
- Patent number RE50134
- Issue date Sep 17, 2024
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Shogo Ono
Information Patent Grant
Imaging device including a photoelectric converter and a capacitive...
- Patent number 12,080,732
- Issue date Sep 3, 2024
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Masashi Murakami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packaging method and semiconductor package device
- Patent number 12,074,183
- Issue date Aug 27, 2024
- TONGFU MICROELECTRONICS CO., LTD.
- Guoqing Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solid-state imaging apparatus
- Patent number 12,062,681
- Issue date Aug 13, 2024
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Tomoki Kurose
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solid-state imaging device, electronic apparatus, and method for pr...
- Patent number 12,062,680
- Issue date Aug 13, 2024
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Koichi Igarashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor-based chemical detection device
- Patent number 12,038,406
- Issue date Jul 16, 2024
- Life Technologies Corporation
- Kim L. Johnson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing deep trench isolation grid structure
- Patent number 12,040,339
- Issue date Jul 16, 2024
- Shanghai Huali Microelectronics Corporation
- Xiaofeng Xia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device contact pad and method of contact pad fabrication
- Patent number 12,034,027
- Issue date Jul 9, 2024
- OmniVision Technologies, Inc.
- Hui Zang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solid-state imaging device
- Patent number 12,034,016
- Issue date Jul 9, 2024
- Samsung Electronics Co., Ltd.
- Masaki Funaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and related methods
- Patent number 12,034,028
- Issue date Jul 9, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Shou-Chian Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating hybrid bonded structure
- Patent number 12,021,103
- Issue date Jun 25, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Bo-Tsung Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing a thermal infrared sensor array in a vacuum-fi...
- Patent number 11,988,561
- Issue date May 21, 2024
- Heimann Sensor GmbH
- Jörg Schieferdecker
- G01 - MEASURING TESTING
Information Patent Grant
Color filter array, imagers and systems having same, and methods of...
- Patent number 11,990,491
- Issue date May 21, 2024
- Loriston Ford
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and manufacturing method thereof
- Patent number 11,990,494
- Issue date May 21, 2024
- Powertech Technology Inc.
- Shang-Yu Chang Chien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multiple deep trench isolation (MDTI) structure for CMOS image sensor
- Patent number 11,984,465
- Issue date May 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei Chuang Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process to release silicon stress in forming CMOS image sensor
- Patent number 11,978,753
- Issue date May 7, 2024
- OmniVision Technologies, Inc.
- Yuanliang Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device image sensor
- Patent number 11,978,756
- Issue date May 7, 2024
- STMicroelectronics (Crolles 2) SAS
- Francois Roy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solid-state imaging apparatus having output circuit unit for output...
- Patent number 11,973,091
- Issue date Apr 30, 2024
- Sony Corporation
- Harumi Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming chip package with second opening surrounding fir...
- Patent number 11,973,095
- Issue date Apr 30, 2024
- Xintec Inc.
- Kuei-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dam of image sensor module having sawtooth pattern and inclined sur...
- Patent number 11,973,098
- Issue date Apr 30, 2024
- OmniVision Technologies, Inc.
- Wei-Feng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image pickup apparatus, endoscope, and method of manufacturing imag...
- Patent number 11,955,498
- Issue date Apr 9, 2024
- Olympus Corporation
- Mitsuru Hagihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Charge release layer to remove charge carriers from dielectric grid...
- Patent number 11,948,962
- Issue date Apr 2, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ching-Chung Su
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
BACK SIDE ILLUMINATED IMAGE SENSOR WITH REDUCED SIDEWALL-INDUCED LE...
- Publication number 20240421177
- Publication date Dec 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shuang-Ji Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR APPARATUS
- Publication number 20240413187
- Publication date Dec 12, 2024
- Sony Semiconductor Solutions Corporation
- Chihiro ARAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR AND MANUFATURING METHOD THEREOF
- Publication number 20240405037
- Publication date Dec 5, 2024
- Samsung Electronics Co., Ltd.
- Gyunha Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTOELECTRONIC DEVICE HAVING A PHOTODIODE INCLUDING A QUANTUM DOT M...
- Publication number 20240395847
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Hao LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SENSOR PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240395950
- Publication date Nov 28, 2024
- TONG HSING ELECTRONIC INDUSTRIES, LTD.
- JUI-HUNG HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGING DEVICE INCLUDING A PHOTOELECTRIC CONVERTER AND A CAPACITIVE...
- Publication number 20240387570
- Publication date Nov 21, 2024
- Panasonic Intellectual Property Management Co., Ltd.
- MASASHI MURAKAMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL SENSOR PACKAGE AND A METHOD FOR FORMING THE SAME
- Publication number 20240387577
- Publication date Nov 21, 2024
- STATS ChipPAC Pte Ltd.
- HyunKyu LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT DETECTION DEVICE AND ELECTRONIC DEVICE
- Publication number 20240379715
- Publication date Nov 14, 2024
- Sony Semiconductor Solutions Corporation
- Satoe MIYATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STILTED PAD STRUCTURE
- Publication number 20240379716
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sin-Yao Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED SEMICONDUCTOR STRUCTURE
- Publication number 20240363668
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME, AND ELEC...
- Publication number 20240363666
- Publication date Oct 31, 2024
- SONY GROUP CORPORATION
- Taku Umebayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEEP TRENCH CAPACITOR STRUCTURE AND METHODS OF FORMATION
- Publication number 20240363652
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chao-Hsuan CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED STRUCTURE OF OPTOELECTRONIC ELEMENT AND CIRCUIT, AND INT...
- Publication number 20240339485
- Publication date Oct 10, 2024
- Taiwan-Asia Semiconductor Corporation
- Di-Bao WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE PICKUP UNIT, ENDOSCOPE, AND METHOD FOR MANUFACTURING IMAGE PI...
- Publication number 20240334035
- Publication date Oct 3, 2024
- OLYMPUS MEDICAL SYSTEMS CORP.
- Takuro SUYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND RELATED METHODS
- Publication number 20240313021
- Publication date Sep 19, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Shou-Chian HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING HYBRID BONDED STRUCTURE
- Publication number 20240313026
- Publication date Sep 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Bo-Tsung TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLID-STATE IMAGING DEVICE AND METHOD FOR MANUFACTURING SOLID-STATE...
- Publication number 20240297195
- Publication date Sep 5, 2024
- Kabushiki Kaisha Toshiba
- Masao TAKAHASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, SOLID-STATE IMAGING DEVICE, AND METHOD FOR MA...
- Publication number 20240297197
- Publication date Sep 5, 2024
- Sony Semiconductor Solutions Corporation
- Takahiro KAMEI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLID-STATE IMAGING APPARATUS HAVING OUTPUT CIRCUIT UNIT FOR OUTPUT...
- Publication number 20240290801
- Publication date Aug 29, 2024
- SONY GROUP CORPORATION
- Harumi TANAKA
- G01 - MEASURING TESTING
Information Patent Application
COLOR FILTER ARRAY, IMAGERS AND SYSTEMS HAVING SAME, AND METHODS OF...
- Publication number 20240274631
- Publication date Aug 15, 2024
- Lodestar Licensing Group LLC
- Loriston Ford
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR AND ELECTRONIC SYSTEM INCLUDING THE SAME
- Publication number 20240258354
- Publication date Aug 1, 2024
- Samsung Electronics Co., Ltd.
- Jungsan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ACTIVE PIXEL SENSOR AND METHOD FOR FABRICATING AN ACTIVE PIXEL SENSOR
- Publication number 20240234463
- Publication date Jul 11, 2024
- INFINEON TECHNOLOGIES AG
- Stefano PARASCANDOLA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME, AND ELEC...
- Publication number 20240234468
- Publication date Jul 11, 2024
- SONY GROUP CORPORATION
- Taku Umebayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLID-STATE IMAGING APPARATUS, MANUFACTURING METHOD THEREOF, AND EL...
- Publication number 20240222410
- Publication date Jul 4, 2024
- Sony Semiconductor Solutions Corporation
- HIROKI OOMORI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor-Based Chemical Detection Device
- Publication number 20240201127
- Publication date Jun 20, 2024
- Life Technologies Corporation
- Kim L. JOHNSON
- C12 - BIOCHEMISTRY BEER SPIRITS WINE VINEGAR MICROBIOLOGY ENZYMOLOGY MUTATION...
Information Patent Application
SHALLOW TRENCH TEXTURED REGIONS AND ASSOCIATED METHODS
- Publication number 20240204033
- Publication date Jun 20, 2024
- SiOnyx, LLC.
- Homayoon HADDAD
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLID-STATE IMAGE PICKUP APPARATUS AND IMAGE PICKUP SYSTEM
- Publication number 20240194715
- Publication date Jun 13, 2024
- Canon Kabushiki Kaisha
- Nobuyuki Endo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGING DEVICE
- Publication number 20240186352
- Publication date Jun 6, 2024
- Sony Semiconductor Solutions Corporation
- Yoshiaki MASUDA
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Zero Thermal Gradient Camera Core And Method For Making The Same
- Publication number 20240187758
- Publication date Jun 6, 2024
- T-SMART PTE, LTD
- Bryan Patmon
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
THREE-LAYERED STACKED IMAGE SENSOR AND METHOD OF MANUFACTURING THE...
- Publication number 20240178259
- Publication date May 30, 2024
- SAMSUNG ELECTRONICS CO,. LTD.
- Doowon KWON
- H01 - BASIC ELECTRIC ELEMENTS

Wafer-level processed structures

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Reliable semiconductor packages

Semiconductor device and method of manufacturing the same, and elec...

Imaging system with selective readout for visible-infrared image ca...

Semiconductor package and method for manufacturing semiconductor pa...

Image sensor with actively cooled sensor array

Solid-state imaging device including groove with recessed and proje...

Dark-current inhibiting image sensor and method

LIDAR sensor using compound semiconductor materials for mobile device

Semiconductor device and method of manufacturing the same, and elec...

Imaging device including a photoelectric converter and a capacitive...

Semiconductor packaging method and semiconductor package device

Solid-state imaging apparatus

Solid-state imaging device, electronic apparatus, and method for pr...

Semiconductor-based chemical detection device

Method for manufacturing deep trench isolation grid structure

Semiconductor device contact pad and method of contact pad fabrication

Solid-state imaging device

Semiconductor package and related methods

Method for fabricating hybrid bonded structure

Method for producing a thermal infrared sensor array in a vacuum-fi...

Color filter array, imagers and systems having same, and methods of...

Package structure and manufacturing method thereof

Multiple deep trench isolation (MDTI) structure for CMOS image sensor

Process to release silicon stress in forming CMOS image sensor

Electronic device image sensor

Solid-state imaging apparatus having output circuit unit for output...

Method for forming chip package with second opening surrounding fir...

Dam of image sensor module having sawtooth pattern and inclined sur...

Image pickup apparatus, endoscope, and method of manufacturing imag...

Charge release layer to remove charge carriers from dielectric grid...

Patents Applicationslast 30 patents

BACK SIDE ILLUMINATED IMAGE SENSOR WITH REDUCED SIDEWALL-INDUCED LE...

SEMICONDUCTOR APPARATUS

IMAGE SENSOR AND MANUFATURING METHOD THEREOF

OPTOELECTRONIC DEVICE HAVING A PHOTODIODE INCLUDING A QUANTUM DOT M...

SENSOR PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

IMAGING DEVICE INCLUDING A PHOTOELECTRIC CONVERTER AND A CAPACITIVE...

OPTICAL SENSOR PACKAGE AND A METHOD FOR FORMING THE SAME

LIGHT DETECTION DEVICE AND ELECTRONIC DEVICE

STILTED PAD STRUCTURE

STACKED SEMICONDUCTOR STRUCTURE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME, AND ELEC...

DEEP TRENCH CAPACITOR STRUCTURE AND METHODS OF FORMATION

INTEGRATED STRUCTURE OF OPTOELECTRONIC ELEMENT AND CIRCUIT, AND INT...

IMAGE PICKUP UNIT, ENDOSCOPE, AND METHOD FOR MANUFACTURING IMAGE PI...

SEMICONDUCTOR PACKAGE AND RELATED METHODS

METHOD FOR FABRICATING HYBRID BONDED STRUCTURE

SOLID-STATE IMAGING DEVICE AND METHOD FOR MANUFACTURING SOLID-STATE...

SEMICONDUCTOR DEVICE, SOLID-STATE IMAGING DEVICE, AND METHOD FOR MA...

SOLID-STATE IMAGING APPARATUS HAVING OUTPUT CIRCUIT UNIT FOR OUTPUT...

COLOR FILTER ARRAY, IMAGERS AND SYSTEMS HAVING SAME, AND METHODS OF...

IMAGE SENSOR AND ELECTRONIC SYSTEM INCLUDING THE SAME

ACTIVE PIXEL SENSOR AND METHOD FOR FABRICATING AN ACTIVE PIXEL SENSOR

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME, AND ELEC...

SOLID-STATE IMAGING APPARATUS, MANUFACTURING METHOD THEREOF, AND EL...

Semiconductor-Based Chemical Detection Device

SHALLOW TRENCH TEXTURED REGIONS AND ASSOCIATED METHODS

SOLID-STATE IMAGE PICKUP APPARATUS AND IMAGE PICKUP SYSTEM

IMAGING DEVICE

Zero Thermal Gradient Camera Core And Method For Making The Same

THREE-LAYERED STACKED IMAGE SENSOR AND METHOD OF MANUFACTURING THE...