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H01L27/14632
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ELECTRICITY
H01
Electric elements
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L27/00
Devices consisting of a plurality of semiconductor or other solid state components formed in or on a common substrate
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H01L27/14632
Wafer-level processed structures
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Patents Grants
last 30 patents
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Patent Grant
Process to release silicon stress in forming CMOS image sensor
Patent number
11,978,753
Issue date
May 7, 2024
OmniVision Technologies, Inc.
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electronic device image sensor
Patent number
11,978,756
Issue date
May 7, 2024
STMicroelectronics (Crolles 2) SAS
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Solid-state imaging apparatus having output circuit unit for output...
Patent number
11,973,091
Issue date
Apr 30, 2024
Sony Corporation
Harumi Tanaka
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for forming chip package with second opening surrounding fir...
Patent number
11,973,095
Issue date
Apr 30, 2024
Xintec Inc.
Kuei-Wei Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Dam of image sensor module having sawtooth pattern and inclined sur...
Patent number
11,973,098
Issue date
Apr 30, 2024
OmniVision Technologies, Inc.
Wei-Feng Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Image pickup apparatus, endoscope, and method of manufacturing imag...
Patent number
11,955,498
Issue date
Apr 9, 2024
Olympus Corporation
Mitsuru Hagihara
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Charge release layer to remove charge carriers from dielectric grid...
Patent number
11,948,962
Issue date
Apr 2, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Ching-Chung Su
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor packaging method and semiconductor package device
Patent number
11,948,960
Issue date
Apr 2, 2024
TONGFU MICROELECTRONICS CO., LTD.
Guoqing Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Multilayer light detecting device and electronic apparatus
Patent number
11,948,833
Issue date
Apr 2, 2024
Sony Group Corporation
Masaki Okamoto
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Solid-state image pickup apparatus and image pickup system
Patent number
11,942,501
Issue date
Mar 26, 2024
Canon Kabushiki Kaisha
Nobuyuki Endo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Pixel structure of stacked image sensor and preparation method thereof
Patent number
11,942,505
Issue date
Mar 26, 2024
Shanghai IC R&D Center Co., Ltd.
Chen Li
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Shallow trench textured regions and associated methods
Patent number
11,929,382
Issue date
Mar 12, 2024
SiOnyx, Inc.
Homayoon Haddad
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Stacked devices and methods of fabrication
Patent number
11,916,054
Issue date
Feb 27, 2024
ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
Paul M. Enquist
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Device over photodetector pixel sensor
Patent number
11,901,388
Issue date
Feb 13, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Jhy-Jyi Sze
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Back side illuminated image sensor with reduced sidewall-induced le...
Patent number
11,901,396
Issue date
Feb 13, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Shuang-Ji Tsai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor image sensor device
Patent number
11,881,493
Issue date
Jan 23, 2024
United Microelectronics Corp.
Ming-Shing Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package with dams
Patent number
11,881,494
Issue date
Jan 23, 2024
UTAC HEADQUARTERS PTE. LTD.
Jeffrey Punzalan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for manufacturing a sensor device with a buried deep trench...
Patent number
11,869,919
Issue date
Jan 9, 2024
Infineon Technologies Dresden GmbH & Co. KG
Magali Glemet
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Curved imaging sensor package with architected substrate
Patent number
11,862,653
Issue date
Jan 2, 2024
HRL Laboratories, LLC
Mark O'Masta
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Trench isolation structure for image sensors
Patent number
11,862,654
Issue date
Jan 2, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Cheng Yu Huang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and manufacturing method, and electronic appli...
Patent number
11,862,656
Issue date
Jan 2, 2024
Sony Group Corporation
Jun Ogi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Solid-state imaging device and manufacturing method therefor
Patent number
11,843,886
Issue date
Dec 12, 2023
Canon Kabushiki Kaisha
Mineo Shimotsusa
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit having vertical routing to bond pads
Patent number
11,837,623
Issue date
Dec 5, 2023
Raytheon Company
Eric Miller
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Solid-state imaging device and electronic apparatus
Patent number
11,838,662
Issue date
Dec 5, 2023
SONY SEMICONDUCTOR SOLUTIONS CORPORATION
Keisuke Hatano
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Solid-state imaging element, production method thereof, and electro...
Patent number
11,839,094
Issue date
Dec 5, 2023
Sony Group Corporation
Tetsuji Yamaguchi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Solid-state imaging device, method of manufacturing the same, and e...
Patent number
11,832,463
Issue date
Nov 28, 2023
Sony Group Corporation
Tetsuji Yamaguchi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of forming backside illuminated image sensor device with shi...
Patent number
11,810,939
Issue date
Nov 7, 2023
Taiwan Semiconductor Manufacturing Co., Ltd
Volume Chien
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Image sensor device having a first lens and a second lens over the...
Patent number
11,791,356
Issue date
Oct 17, 2023
Taiwan Semiconductor Manufacturing Company, Ltd
Shih-Hsun Hsu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method of fabricating the same
Patent number
11,791,367
Issue date
Oct 17, 2023
Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.
Fan Yang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method of manufacturing the same, and elec...
Patent number
11,764,243
Issue date
Sep 19, 2023
Sony Corporation
Taku Umebayashi
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
FILM ADHESIVE, ELECTRONIC COMPONENT USING THE SAME, AND METHOD OF P...
Publication number
20240141216
Publication date
May 2, 2024
FURUKAWA ELECTRIC CO., LTD.
Koyuki SAKAI
C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information
Patent Application
SOLID-STATE IMAGING DEVICE AND ELECTRONIC APPARATUS
Publication number
20240147091
Publication date
May 2, 2024
Sony Semiconductor Solutions Corporation
Keisuke HATANO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ACTIVE PIXEL SENSOR AND METHOD FOR FABRICATING AN ACTIVE PIXEL SENSOR
Publication number
20240136380
Publication date
Apr 25, 2024
INFINEON TECHNOLOGIES AG
Stefano PARASCANDOLA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
IMAGING SYSTEM WITH SELECTIVE READOUT FOR VISIBLE-INFRARED IMAGE CA...
Publication number
20240113146
Publication date
Apr 4, 2024
OMNIVISION TECHNOLOGIES, INC.
Keiji Mabuchi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SENSOR ASSEMBLY AND METHOD FOR FORMING THE SAME
Publication number
20240096920
Publication date
Mar 21, 2024
STATS ChipPAC Pte Ltd.
MyungHo JUNG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SOLID-STATE IMAGING DEVICE PACKAGE MANUFACTURING METHOD AND SOLID-S...
Publication number
20240088180
Publication date
Mar 14, 2024
Kaneka Corporation
Kenta KURODA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
STACKED DEVICES AND METHODS OF FABRICATION
Publication number
20240088120
Publication date
Mar 14, 2024
ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
Paul M. Enquist
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
IMAGE SENSOR PACKAGE AND METHOD OF FABRICATING THE SAME
Publication number
20240072084
Publication date
Feb 29, 2024
Samsung Electronics Co., Ltd.
Youngjae Choi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SOLID-STATE IMAGING DEVICE AND MANUFACTURING METHOD THEREFOR
Publication number
20240073562
Publication date
Feb 29, 2024
Canon Kabushiki Kaisha
Mineo Shimotsusa
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
Publication number
20240072097
Publication date
Feb 29, 2024
UNITED MICROELECTRONICS CORP.
Po-Kuang Hsieh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE, ELECTRONIC DEVICE, AND METHOD OF MANUFACTURI...
Publication number
20240063244
Publication date
Feb 22, 2024
Sony Semiconductor Solutions Corporation
TOSHIKI KOYAMA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED CIRCUIT HAVING VERTICAL ROUTING TO BOND PADS
Publication number
20240055466
Publication date
Feb 15, 2024
Raytheon Company
Eric Miller
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND FABRICATION METHOD THEREFOR
Publication number
20240055459
Publication date
Feb 15, 2024
Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.
Fan YANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MICRO SPECTRUM CHIP BASED ON UNITS OF RANDOM SHAPES
Publication number
20240047494
Publication date
Feb 8, 2024
TSINGHUA UNIVERSITY
Kaiyu Cui
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SOLID-STATE IMAGING ELEMENT, PRODUCTION METHOD THEREOF, AND ELECTRO...
Publication number
20240049484
Publication date
Feb 8, 2024
SONY GROUP CORPORATION
Tetsuji Yamaguchi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SOLID-STATE IMAGING DEVICE, METHOD OF MANUFACTURING THE SAME, AND E...
Publication number
20240032315
Publication date
Jan 25, 2024
SONY GROUP CORPORATION
Tetsuji Yamaguchi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
STACKED CHIP SCALE OPTICAL SENSOR PACKAGE
Publication number
20240030265
Publication date
Jan 25, 2024
Semiconductor Components Industries, LLC
Weng-Jin WU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
IMAGE SENSOR AND MANUFACTURING METHOD THEREOF
Publication number
20240021639
Publication date
Jan 18, 2024
VisEra Technologies Company Ltd.
Yi-Hua CHIU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGING STRUCTURE AND METHOD OF A PHOTOSENSITIVE MODULE
Publication number
20240021650
Publication date
Jan 18, 2024
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Ming-Yao CHEN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
TRENCH ISOLATION STRUCTURE FOR IMAGE SENSORS
Publication number
20240021644
Publication date
Jan 18, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Cheng Yu Huang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BACKSIDE ILLUMINATED IMAGE SENSOR DEVICE WITH SHIELDING LAYER AND F...
Publication number
20240021651
Publication date
Jan 18, 2024
Taiwan Semiconductor Manufacturing Co., Ltd.
Volume CHIEN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
IMAGING DEVICE, ELECTRONIC DEVICE, AND MANUFACTURING METHOD
Publication number
20240006450
Publication date
Jan 4, 2024
Sony Semiconductor Solutions Corporation
TOMOHIRO OHKUBO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR MODULE AND METHOD FOR MANUFACTURING THE SAME
Publication number
20240006439
Publication date
Jan 4, 2024
Sony Semiconductor Solutions Corporation
ATSUSHI TSUKADA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
FAN-OUT PACKAGE STRUCTURE OF IMAGE SENSING DEVICE AND MANUFACTURING...
Publication number
20230411419
Publication date
Dec 21, 2023
Powertech Technology Inc.
Ching-Chao LIN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR, AND CHIP BO...
Publication number
20230411435
Publication date
Dec 21, 2023
WUHAN XINXIN SEMICONDUCTOR MANUFACTURING CO., LTD.
Tian ZENG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING SAME
Publication number
20230402481
Publication date
Dec 14, 2023
Semiconductor Manufacturing International (Beijing) Corporation
Bingquan WANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THEREOF
Publication number
20230402474
Publication date
Dec 14, 2023
Rohm Co., Ltd.
Eiji KUWAHARA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
GERMANIUM-SILICON LIGHT SENSING APPARATUS
Publication number
20230395618
Publication date
Dec 7, 2023
Artilux, Inc.
Yun-Chung Na
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
HETEROGENEOUSLY SUBSTRATE-BONDED OPTICAL ASSEMBLY AND METHOD OF MAN...
Publication number
20230395632
Publication date
Dec 7, 2023
Egis Technology Inc.
BRUCE C. S. CHOU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE
Publication number
20230378232
Publication date
Nov 23, 2023
Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.
Fan YANG
H01 - BASIC ELECTRIC ELEMENTS