Wafer level processing

Industry

CPC
H01L27/14687

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L27/00Devices consisting of a plurality of semiconductor or other solid state components formed in or on a common substrate

Current Industry

H01L27/14687Wafer level processing

Industries

Patents Grantslast 30 patents

Information Patent Grant
Manufacturing process for semiconductor optical device for lidar se...
- Patent number 12,199,132
- Issue date Jan 14, 2025
- AURORA OPERATIONS, INC.
- Lei Wang
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 12,191,313
- Issue date Jan 7, 2025
- Semiconductor Energy Laboratory Co., Ltd.
- Shunpei Yamazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 12,191,191
- Issue date Jan 7, 2025
- Taiwan Semiconductor Manufacturing Company Ltd.
- Min-Ying Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
CMOS image sensor having indented photodiode structure
- Patent number 12,191,327
- Issue date Jan 7, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chia-Yu Wei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Increased optical path for long wavelength light by grating structure
- Patent number 12,170,302
- Issue date Dec 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yun-Wei Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reliable semiconductor packages
- Patent number 12,166,050
- Issue date Dec 10, 2024
- UTAC HEADQUARTERS PTD. LTD.
- Jeffrey Punzalan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same, and elec...
- Patent number 12,166,061
- Issue date Dec 10, 2024
- Sony Group Corporation
- Taku Umebayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with microlens layer and camera including the...
- Patent number 12,159,891
- Issue date Dec 3, 2024
- Canon Kabushiki Kaisha
- Kazuo Kokumai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure
- Patent number 12,154,927
- Issue date Nov 26, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Yen-Ting Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Member for solid-state image pickup device and method for manufactu...
- Patent number 12,142,629
- Issue date Nov 12, 2024
- Canon Kabushiki Kaisha
- Nobuyuki Endo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Eye gesture tracking
- Patent number 12,141,351
- Issue date Nov 12, 2024
- Artilux, Inc.
- Yun-Chung Na
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor package and method for manufacturing semiconductor pa...
- Patent number 12,132,063
- Issue date Oct 29, 2024
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Masami Suzuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor with actively cooled sensor array
- Patent number 12,119,285
- Issue date Oct 15, 2024
- Microsoft Technology Licensing, LLC
- Minseok Oh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated photodetector with direct binning pixel
- Patent number 12,111,261
- Issue date Oct 8, 2024
- Quantum-Si Incorporated
- Jonathan M. Rothberg
- C12 - BIOCHEMISTRY BEER SPIRITS WINE VINEGAR MICROBIOLOGY ENZYMOLOGY MUTATION...
Information Patent Grant
LIDAR sensor using compound semiconductor materials for mobile device
- Patent number 12,107,108
- Issue date Oct 1, 2024
- Aeluma, Inc.
- Jonathan Klamkin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Anti-flare semiconductor packages and related methods
- Patent number 12,107,102
- Issue date Oct 1, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Shou-Chian Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
BSI chip with backside alignment mark
- Patent number 12,094,997
- Issue date Sep 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih Wei Sung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same, and elec...
- Patent number RE50134
- Issue date Sep 17, 2024
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Shogo Ono
Information Patent Grant
Deep trench isolations and methods of forming the same
- Patent number 12,087,801
- Issue date Sep 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Hsien Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packaging method and semiconductor package device
- Patent number 12,074,183
- Issue date Aug 27, 2024
- TONGFU MICROELECTRONICS CO., LTD.
- Guoqing Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solid-state image pickup device
- Patent number 12,068,351
- Issue date Aug 20, 2024
- Canon Kabushiki Kaisha
- Mineo Shimotsusa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3-side buttable stitched image sensor
- Patent number 12,061,420
- Issue date Aug 13, 2024
- IMASENIC ADVANCED IMAGING S.L.
- Renato Turchetta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solid-state imaging device, electronic apparatus, and method for pr...
- Patent number 12,062,680
- Issue date Aug 13, 2024
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Koichi Igarashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Anti-flare semiconductor packages and related methods
- Patent number 12,051,711
- Issue date Jul 30, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Shou-Chian Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing deep trench isolation grid structure
- Patent number 12,040,339
- Issue date Jul 16, 2024
- Shanghai Huali Microelectronics Corporation
- Xiaofeng Xia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device contact pad and method of contact pad fabrication
- Patent number 12,034,027
- Issue date Jul 9, 2024
- OmniVision Technologies, Inc.
- Hui Zang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solid-state imaging device
- Patent number 12,034,016
- Issue date Jul 9, 2024
- Samsung Electronics Co., Ltd.
- Masaki Funaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and related methods
- Patent number 12,034,028
- Issue date Jul 9, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Shou-Chian Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating hybrid bonded structure
- Patent number 12,021,103
- Issue date Jun 25, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Bo-Tsung Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of image pickup apparatus for endoscope, image...
- Patent number 12,015,045
- Issue date Jun 18, 2024
- Olympus Corporation
- Noriyuki Fujimori
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
IMAGE SENSOR WITH ACTIVELY COOLED SENSOR ARRAY
- Publication number 20250022771
- Publication date Jan 16, 2025
- Microsoft Technology Licensing, LLC
- Minseok OH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR DEVICE, EQUIPMENT, AND METHOD OF MANUFACTURING IMAGE S...
- Publication number 20250022893
- Publication date Jan 16, 2025
- Sony Semiconductor Solutions Corporation
- MASAMI SUZUKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL SEMICONDUCTOR PACKAGE AND METHOD FOR PRODUCING OPTICAL SEMI...
- Publication number 20250022901
- Publication date Jan 16, 2025
- Hamamatsu Photonics K.K.
- Nao INOUE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Pixel Structures in Image Sensors
- Publication number 20250006762
- Publication date Jan 2, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Chieh CHUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANTI-FLARE SEMICONDUCTOR PACKAGES AND RELATED METHODS
- Publication number 20240429255
- Publication date Dec 26, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Shou-Chian HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR FORMING A BACK SIDE FILM STACK AND PACKAGE STRUCTURES T...
- Publication number 20240429260
- Publication date Dec 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chuan-Cheng Tsou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TWO-WAY OPTICAL SENSOR PACKAGE AND A METHOD FOR FORMING THE SAME
- Publication number 20240421172
- Publication date Dec 19, 2024
- STATS ChipPAC Pte Ltd.
- BumRyul MAENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACK SIDE ILLUMINATED IMAGE SENSOR WITH REDUCED SIDEWALL-INDUCED LE...
- Publication number 20240421177
- Publication date Dec 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shuang-Ji Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CMOS IMAGING SENSOR STRUCTURE AND MANUFACTURING METHOD THEREFOR
- Publication number 20240413175
- Publication date Dec 12, 2024
- Shanghai IC R&D Center Co., Ltd.
- Xiaoxu KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Optical Sensor Integration
- Publication number 20240413189
- Publication date Dec 12, 2024
- Artilux, Inc.
- Yun-Chung Na
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR APPARATUS
- Publication number 20240413187
- Publication date Dec 12, 2024
- Sony Semiconductor Solutions Corporation
- Chihiro ARAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR AND MANUFATURING METHOD THEREOF
- Publication number 20240405037
- Publication date Dec 5, 2024
- Samsung Electronics Co., Ltd.
- Gyunha Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTOELECTRONIC DEVICE HAVING A PHOTODIODE INCLUDING A QUANTUM DOT M...
- Publication number 20240395847
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Hao LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL SENSOR PACKAGE AND A METHOD FOR FORMING THE SAME
- Publication number 20240387577
- Publication date Nov 21, 2024
- STATS ChipPAC Pte Ltd.
- HyunKyu LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS TO ENHANCE SEMICONDUCTOR DEVICE MANUFACTURING
- Publication number 20240387601
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yao-Ren KUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLID-STATE IMAGE PICKUP DEVICE
- Publication number 20240387592
- Publication date Nov 21, 2024
- Canon Kabushiki Kaisha
- Mineo Shimotsusa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240387242
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- MIN-YING TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT DETECTION DEVICE AND ELECTRONIC DEVICE
- Publication number 20240379715
- Publication date Nov 14, 2024
- Sony Semiconductor Solutions Corporation
- Satoe MIYATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STILTED PAD STRUCTURE
- Publication number 20240379716
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sin-Yao Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR WITH DIFFUSION BARRIER STRUCTURE
- Publication number 20240379692
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Hung Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME, AND ELEC...
- Publication number 20240363666
- Publication date Oct 31, 2024
- SONY GROUP CORPORATION
- Taku Umebayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VERTICALLY STACKED LIGHT SENSORS
- Publication number 20240363672
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsiang-Lin Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEEP TRENCH ISOLATIONS AND METHODS OF FORMING THE SAME
- Publication number 20240363671
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Cheng-Hsien Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BSI CHIP WITH BACKSIDE ALIGNMENT MARK
- Publication number 20240363791
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih Wei Sung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANTI-FLARE SEMICONDUCTOR PACKAGES AND RELATED METHODS
- Publication number 20240355850
- Publication date Oct 24, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Shou-Chian HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYMMETRIC BOND SIGNAL INTEGRITY PRESERVATION STRUCTURE AND METHOD
- Publication number 20240347576
- Publication date Oct 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hao-Lin Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED STRUCTURE OF OPTOELECTRONIC ELEMENT AND CIRCUIT, AND INT...
- Publication number 20240339485
- Publication date Oct 10, 2024
- Taiwan-Asia Semiconductor Corporation
- Di-Bao WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND RELATED METHODS
- Publication number 20240313021
- Publication date Sep 19, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Shou-Chian HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING HYBRID BONDED STRUCTURE
- Publication number 20240313026
- Publication date Sep 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Bo-Tsung TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLID-STATE IMAGING DEVICE AND MANUFACTURING METHOD FOR SOLID-STATE...
- Publication number 20240304648
- Publication date Sep 12, 2024
- Sony Semiconductor Solutions Corporation
- NAOKI YAMASHITA
- H01 - BASIC ELECTRIC ELEMENTS

Wafer level processing

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Manufacturing process for semiconductor optical device for lidar se...

Semiconductor device and method for manufacturing the same

Semiconductor structure and manufacturing method thereof

CMOS image sensor having indented photodiode structure

Increased optical path for long wavelength light by grating structure

Reliable semiconductor packages

Semiconductor device and method of manufacturing the same, and elec...

Semiconductor device with microlens layer and camera including the...

Semiconductor structure

Member for solid-state image pickup device and method for manufactu...

Eye gesture tracking

Semiconductor package and method for manufacturing semiconductor pa...

Image sensor with actively cooled sensor array

Integrated photodetector with direct binning pixel

LIDAR sensor using compound semiconductor materials for mobile device

Anti-flare semiconductor packages and related methods

BSI chip with backside alignment mark

Semiconductor device and method of manufacturing the same, and elec...

Deep trench isolations and methods of forming the same

Semiconductor packaging method and semiconductor package device

Solid-state image pickup device

3-side buttable stitched image sensor

Solid-state imaging device, electronic apparatus, and method for pr...

Anti-flare semiconductor packages and related methods

Method for manufacturing deep trench isolation grid structure

Semiconductor device contact pad and method of contact pad fabrication

Solid-state imaging device

Semiconductor package and related methods

Method for fabricating hybrid bonded structure

Manufacturing method of image pickup apparatus for endoscope, image...

Patents Applicationslast 30 patents

IMAGE SENSOR WITH ACTIVELY COOLED SENSOR ARRAY

IMAGE SENSOR DEVICE, EQUIPMENT, AND METHOD OF MANUFACTURING IMAGE S...

OPTICAL SEMICONDUCTOR PACKAGE AND METHOD FOR PRODUCING OPTICAL SEMI...

Pixel Structures in Image Sensors

ANTI-FLARE SEMICONDUCTOR PACKAGES AND RELATED METHODS

METHODS FOR FORMING A BACK SIDE FILM STACK AND PACKAGE STRUCTURES T...

TWO-WAY OPTICAL SENSOR PACKAGE AND A METHOD FOR FORMING THE SAME

BACK SIDE ILLUMINATED IMAGE SENSOR WITH REDUCED SIDEWALL-INDUCED LE...

CMOS IMAGING SENSOR STRUCTURE AND MANUFACTURING METHOD THEREFOR

Optical Sensor Integration

SEMICONDUCTOR APPARATUS

IMAGE SENSOR AND MANUFATURING METHOD THEREOF

OPTOELECTRONIC DEVICE HAVING A PHOTODIODE INCLUDING A QUANTUM DOT M...

OPTICAL SENSOR PACKAGE AND A METHOD FOR FORMING THE SAME

METHOD AND APPARATUS TO ENHANCE SEMICONDUCTOR DEVICE MANUFACTURING

SOLID-STATE IMAGE PICKUP DEVICE

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

LIGHT DETECTION DEVICE AND ELECTRONIC DEVICE

STILTED PAD STRUCTURE

IMAGE SENSOR WITH DIFFUSION BARRIER STRUCTURE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME, AND ELEC...

VERTICALLY STACKED LIGHT SENSORS

DEEP TRENCH ISOLATIONS AND METHODS OF FORMING THE SAME

BSI CHIP WITH BACKSIDE ALIGNMENT MARK

ANTI-FLARE SEMICONDUCTOR PACKAGES AND RELATED METHODS

SYMMETRIC BOND SIGNAL INTEGRITY PRESERVATION STRUCTURE AND METHOD

INTEGRATED STRUCTURE OF OPTOELECTRONIC ELEMENT AND CIRCUIT, AND INT...

SEMICONDUCTOR PACKAGE AND RELATED METHODS

METHOD FOR FABRICATING HYBRID BONDED STRUCTURE

SOLID-STATE IMAGING DEVICE AND MANUFACTURING METHOD FOR SOLID-STATE...