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ELECTRICITY
H01
Electric elements
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L27/00
Devices consisting of a plurality of semiconductor or other solid state components formed in or on a common substrate
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H01L27/14687
Wafer level processing
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Patents Grants
last 30 patents
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Patent Grant
Solid-state imaging apparatus having output circuit unit for output...
Patent number
11,973,091
Issue date
Apr 30, 2024
Sony Corporation
Harumi Tanaka
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for forming chip package with second opening surrounding fir...
Patent number
11,973,095
Issue date
Apr 30, 2024
Xintec Inc.
Kuei-Wei Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Dam of image sensor module having sawtooth pattern and inclined sur...
Patent number
11,973,098
Issue date
Apr 30, 2024
OmniVision Technologies, Inc.
Wei-Feng Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Charge release layer to remove charge carriers from dielectric grid...
Patent number
11,948,962
Issue date
Apr 2, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Ching-Chung Su
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor packaging method and semiconductor package device
Patent number
11,948,960
Issue date
Apr 2, 2024
TONGFU MICROELECTRONICS CO., LTD.
Guoqing Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Manufacturing method of image pickup apparatus for endoscope, image...
Patent number
11,943,522
Issue date
Mar 26, 2024
Olympus Corporation
Jumpei Yoneyama
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Solid-state image pickup apparatus and image pickup system
Patent number
11,942,501
Issue date
Mar 26, 2024
Canon Kabushiki Kaisha
Nobuyuki Endo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Pixel structure of stacked image sensor and preparation method thereof
Patent number
11,942,505
Issue date
Mar 26, 2024
Shanghai IC R&D Center Co., Ltd.
Chen Li
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Image sensor device
Patent number
11,935,907
Issue date
Mar 19, 2024
ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
Rajesh Katkar
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor epitaxial wafer and method of producing semiconductor...
Patent number
11,935,745
Issue date
Mar 19, 2024
Sumco Corporation
Ryosuke Okuyama
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Stacked devices and methods of fabrication
Patent number
11,916,054
Issue date
Feb 27, 2024
ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
Paul M. Enquist
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Dielectric film for semiconductor fabrication
Patent number
11,901,295
Issue date
Feb 13, 2024
Taiwan Semiconductor Manufacturing Co., Ltd
Cheng-Yi Wu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package and method of fabricating the same
Patent number
11,901,385
Issue date
Feb 13, 2024
Samsung Electronics Co, Ltd.
Byoungrim Seo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Device over photodetector pixel sensor
Patent number
11,901,388
Issue date
Feb 13, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Jhy-Jyi Sze
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Back side illuminated image sensor with reduced sidewall-induced le...
Patent number
11,901,396
Issue date
Feb 13, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Shuang-Ji Tsai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Dual facing BSI image sensors with wafer level stacking
Patent number
11,894,408
Issue date
Feb 6, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Ping-Yin Liu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor image sensor device
Patent number
11,881,493
Issue date
Jan 23, 2024
United Microelectronics Corp.
Ming-Shing Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package with dams
Patent number
11,881,494
Issue date
Jan 23, 2024
UTAC HEADQUARTERS PTE. LTD.
Jeffrey Punzalan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Multilevel semiconductor device and structure with image sensors an...
Patent number
11,869,915
Issue date
Jan 9, 2024
Monolithic 3D Inc.
Zvi Or-Bach
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for manufacturing a sensor device with a buried deep trench...
Patent number
11,869,919
Issue date
Jan 9, 2024
Infineon Technologies Dresden GmbH & Co. KG
Magali Glemet
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Curved imaging sensor package with architected substrate
Patent number
11,862,653
Issue date
Jan 2, 2024
HRL Laboratories, LLC
Mark O'Masta
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Trench isolation structure for image sensors
Patent number
11,862,654
Issue date
Jan 2, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Cheng Yu Huang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and manufacturing method, and electronic appli...
Patent number
11,862,656
Issue date
Jan 2, 2024
Sony Group Corporation
Jun Ogi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Back-illuminated sensor and a method of manufacturing a sensor usin...
Patent number
11,848,350
Issue date
Dec 19, 2023
KLA Corporation
Abbas Haddadi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
CMOS image sensor having indented photodiode structure
Patent number
11,843,007
Issue date
Dec 12, 2023
Taiwan Semiconductor Manufacturing Company, Ltd
Chia-Yu Wei
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Member for solid-state image pickup device and method for manufactu...
Patent number
11,843,023
Issue date
Dec 12, 2023
Canon Kabushiki Kaisha
Nobuyuki Endo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Solid-state imaging device and electronic apparatus
Patent number
11,838,662
Issue date
Dec 5, 2023
SONY SEMICONDUCTOR SOLUTIONS CORPORATION
Keisuke Hatano
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Solid-state imaging element, production method thereof, and electro...
Patent number
11,839,094
Issue date
Dec 5, 2023
Sony Group Corporation
Tetsuji Yamaguchi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electrical interconnection of image sensor package
Patent number
11,830,903
Issue date
Nov 28, 2023
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Shou-Chian Hsu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Solid-state imaging device, manufacturing method thereof, and elect...
Patent number
11,830,906
Issue date
Nov 28, 2023
SONY SEMICONDUCTOR SOLUTIONS CORPORATION
Shinya Yamakawa
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
FILM ADHESIVE, ELECTRONIC COMPONENT USING THE SAME, AND METHOD OF P...
Publication number
20240141216
Publication date
May 2, 2024
FURUKAWA ELECTRIC CO., LTD.
Koyuki SAKAI
C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information
Patent Application
SOLID-STATE IMAGING DEVICE, MANUFACTURING METHOD THEREOF, AND ELECT...
Publication number
20240145522
Publication date
May 2, 2024
Sony Semiconductor Solutions Corporation
SHINYA YAMAKAWA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SOLID-STATE IMAGING DEVICE AND ELECTRONIC APPARATUS
Publication number
20240147091
Publication date
May 2, 2024
Sony Semiconductor Solutions Corporation
Keisuke HATANO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SOLID-STATE IMAGING DEVICE
Publication number
20240105754
Publication date
Mar 28, 2024
Kabushiki Kaisha Toshiba
Yuexing ZHENG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SENSOR ASSEMBLY AND METHOD FOR FORMING THE SAME
Publication number
20240096920
Publication date
Mar 21, 2024
STATS ChipPAC Pte Ltd.
MyungHo JUNG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SOLID-STATE IMAGING DEVICE PACKAGE MANUFACTURING METHOD AND SOLID-S...
Publication number
20240088180
Publication date
Mar 14, 2024
Kaneka Corporation
Kenta KURODA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MEMBER FOR SOLID-STATE IMAGE PICKUP DEVICE AND METHOD FOR MANUFACTU...
Publication number
20240088196
Publication date
Mar 14, 2024
Canon Kabushiki Kaisha
Nobuyuki Endo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PHOTOELECTRIC CONVERSION APPARATUS, DEVICE, AND METHOD FOR MANUFACT...
Publication number
20240088190
Publication date
Mar 14, 2024
Canon Kabushiki Kaisha
Takuya Hara
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
STACKED DEVICES AND METHODS OF FABRICATION
Publication number
20240088120
Publication date
Mar 14, 2024
ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
Paul M. Enquist
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
3D CMOS IMAGE SENSOR STRUCTURE AND METHOD OF FABRICATING THE SAME
Publication number
20240072083
Publication date
Feb 29, 2024
Powerchip Semiconductor Manufacturing Corporation
Chih-Ping Chung
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
Publication number
20240072097
Publication date
Feb 29, 2024
UNITED MICROELECTRONICS CORP.
Po-Kuang Hsieh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Back-Illuminated Sensor And A Method Of Manufacturing A Sensor Usin...
Publication number
20240063248
Publication date
Feb 22, 2024
KLA Corporation
Abbas Haddadi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CMOS IMAGE SENSOR HAVING INDENTED PHOTODIODE STRUCTURE
Publication number
20240063234
Publication date
Feb 22, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Chia-Yu Wei
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE, ELECTRONIC DEVICE, AND METHOD OF MANUFACTURI...
Publication number
20240063244
Publication date
Feb 22, 2024
Sony Semiconductor Solutions Corporation
TOSHIKI KOYAMA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND FABRICATION METHOD THEREFOR
Publication number
20240055459
Publication date
Feb 15, 2024
Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.
Fan YANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE...
Publication number
20240047503
Publication date
Feb 8, 2024
Sony Semiconductor Solutions Corporation
SUGURU SAITO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
IMAGE SENSOR GRID AND METHOD OF FABRICATION OF SAME
Publication number
20240047496
Publication date
Feb 8, 2024
Taiwan Semiconductor Manufacturing Co., Ltd.
Chin-Yu LIN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRICAL INTERCONNECTION OF IMAGE SENSOR PACKAGE
Publication number
20240047498
Publication date
Feb 8, 2024
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Shou-Chian HSU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SOLID-STATE IMAGING ELEMENT, PRODUCTION METHOD THEREOF, AND ELECTRO...
Publication number
20240049484
Publication date
Feb 8, 2024
SONY GROUP CORPORATION
Tetsuji Yamaguchi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
IMAGE SENSOR DEVICE
Publication number
20240038804
Publication date
Feb 1, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Yun-Wei CHENG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SOLID-STATE IMAGING DEVICE, METHOD OF MANUFACTURING THE SAME, AND E...
Publication number
20240032315
Publication date
Jan 25, 2024
SONY GROUP CORPORATION
Tetsuji Yamaguchi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
STACKED CHIP SCALE OPTICAL SENSOR PACKAGE
Publication number
20240030265
Publication date
Jan 25, 2024
Semiconductor Components Industries, LLC
Weng-Jin WU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
2D-Doped Surface Passivation Structure and Method of Manufacture
Publication number
20240030269
Publication date
Jan 25, 2024
California Institute of Technology
Michael E. Hoenk
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGING STRUCTURE AND METHOD OF A PHOTOSENSITIVE MODULE
Publication number
20240021650
Publication date
Jan 18, 2024
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Ming-Yao CHEN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED PHOTODETECTOR WITH DIRECT BINNING PIXEL
Publication number
20240019370
Publication date
Jan 18, 2024
Quantum-Si Incorporated
Jonathan M. Rothberg
C12 - BIOCHEMISTRY BEER SPIRITS WINE VINEGAR MICROBIOLOGY ENZYMOLOGY MUTATION...
Information
Patent Application
TRENCH ISOLATION STRUCTURE FOR IMAGE SENSORS
Publication number
20240021644
Publication date
Jan 18, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Cheng Yu Huang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
THROUGH-SUBSTRATE-VIA IN PHOTOSENSITIVE MODULE
Publication number
20240021649
Publication date
Jan 18, 2024
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Ming-Yao CHEN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BACKSIDE ILLUMINATED IMAGE SENSOR DEVICE WITH SHIELDING LAYER AND F...
Publication number
20240021651
Publication date
Jan 18, 2024
Taiwan Semiconductor Manufacturing Co., Ltd.
Volume CHIEN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR COLLECTIVE BENDING OF MICROELECTRONIC COMPONENTS INCLUDI...
Publication number
20240021744
Publication date
Jan 18, 2024
Commissariat A L'Energie Atomique et Aux Energies Alternatives
David HENRY
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
IMAGING DEVICE, ELECTRONIC DEVICE, AND MANUFACTURING METHOD
Publication number
20240006450
Publication date
Jan 4, 2024
Sony Semiconductor Solutions Corporation
TOMOHIRO OHKUBO
H01 - BASIC ELECTRIC ELEMENTS