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H01L2924/04563

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

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H01L2924/04563WC

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Patents Grantslast 30 patents

Information Patent Grant
Silicon carbide devices and methods for manufacturing the same
- Patent number 11,282,805
- Issue date Mar 22, 2022
- Infineon Technologies AG
- Michael Roesner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,804,237
- Issue date Oct 13, 2020
- Denso Corporation
- Kazuhiko Sugiura
- B22 - CASTING POWDER METALLURGY

Patents Applicationslast 30 patents

Information Patent Application
Silicon Carbide Devices and Methods for Manufacturing the Same
- Publication number 20190295981
- Publication date Sep 26, 2019
- Michael Roesner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20190214360
- Publication date Jul 11, 2019
- DENSO CORPORATION
- Kazuhiko SUGIURA
- H01 - BASIC ELECTRIC ELEMENTS