Wedge

Industry

CPC
H01L2224/78313

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/78313Wedge

Industries

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Wire bonding apparatus
- Patent number 10,896,892
- Issue date Jan 19, 2021
- Fuji Electric Co., Ltd.
- Fumihiko Momose
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Systems and methods of operating wire bonding machines including cl...
- Patent number 10,763,236
- Issue date Sep 1, 2020
- Kulicke and Soffa Industries, Inc.
- Peter J. Klaerner
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device
- Patent number 10,504,822
- Issue date Dec 10, 2019
- Rohm Co., Ltd.
- Shoji Yasunaga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wedge bonding component
- Patent number 10,147,701
- Issue date Dec 4, 2018
- KYOCERA Corporation
- Hidekazu Shigeyoshi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing wire bonding structure, wire bonding struc...
- Patent number 10,115,699
- Issue date Oct 30, 2018
- Rohm Co., Ltd.
- Kazuya Ikoma
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wire-bonding apparatus and method of manufacturing semiconductor de...
- Patent number 9,793,236
- Issue date Oct 17, 2017
- Shinkawa Ltd.
- Naoki Sekine
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device
- Patent number 9,613,883
- Issue date Apr 4, 2017
- Rohm Co., Ltd.
- Shoji Yasunaga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bonding structure of semiconductor device and wire bonding method
- Patent number 9,379,085
- Issue date Jun 28, 2016
- Rohm Co., Ltd.
- Ryuji Tsubaki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor arrangement, semiconductor module, and method for con...
- Patent number 9,196,562
- Issue date Nov 24, 2015
- Infineon Technologies AG
- Dirk Siepe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device with bimetallic interface element for wire bonding
- Patent number 9,184,150
- Issue date Nov 10, 2015
- STMicroelectronics S.R.L.
- Giuseppe Cristaldi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mixed wire semiconductor lead frame package
- Patent number 9,087,827
- Issue date Jul 21, 2015
- Infineon Technologies AG
- Jenny Ong Wai Lian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor device, method of manufacturing the device and...
- Patent number 9,059,003
- Issue date Jun 16, 2015
- NIPPON MICROMETAL CORPORATION
- Kohei Tatsumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image-assisted system for adjusting a bonding tool
- Patent number 8,777,086
- Issue date Jul 15, 2014
- ASM Technology Singapore Pte. Ltd.
- Jiang Wen Deng
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ultrasonic bonding systems and methods of using the same
- Patent number 8,746,537
- Issue date Jun 10, 2014
- Orthodyne Electronics Corporation
- Christoph B. Luechinger
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Joint quality inspection and joint quality inspection method
- Patent number 8,714,015
- Issue date May 6, 2014
- Toyota Jidosha Kabushiki Kaisha
- Nami Matsui
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of forming a semiconductor device with a contact pad on a sl...
- Patent number 8,674,511
- Issue date Mar 18, 2014
- Toyota Jidosha Kabushiki Kaisha
- Masaru Senoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wedge bonder and a method of cleaning a wedge bonder
- Patent number 8,657,181
- Issue date Feb 25, 2014
- ASM Technology Singapore Pte. Ltd.
- Chi Wah Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connection element for a semiconductor component and method for pro...
- Patent number 8,581,371
- Issue date Nov 12, 2013
- Infineon Technologies AG
- Khalil Hosseini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device equipped with bonding wires and manufacturing...
- Patent number 8,531,013
- Issue date Sep 10, 2013
- Casio Computer Co., Ltd.
- Teiji Shindo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding device, ultrasonic transducer, and bonding method
- Patent number 8,434,659
- Issue date May 7, 2013
- Hesse & Knipps GmbH
- Hans-Juergen Hesse
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and wire bonding method
- Patent number 8,432,015
- Issue date Apr 30, 2013
- Toyota Jidosha Kabushiki Kaisha
- Hiroaki Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating a high-temperature compatible power semicondu...
- Patent number 8,309,395
- Issue date Nov 13, 2012
- Infineon Technologies AG
- Reinhold Bayerer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical bond connection system
- Patent number 8,181,845
- Issue date May 22, 2012
- Robert Bosch GmbH
- Manfred Reinold
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Semiconductor device
- Patent number 8,169,087
- Issue date May 1, 2012
- Toyota Jidosha Kabushiki Kaisha
- Masaru Senoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module arrangement
- Patent number 8,164,176
- Issue date Apr 24, 2012
- Infineon Technologies AG
- Dirk Siepe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cutting blade for a wire bonding system
- Patent number 8,141,765
- Issue date Mar 27, 2012
- Orthodyne Electronics Corporation
- Theodore J. Copperthite
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Aluminum bump bonding for fine aluminum wire
- Patent number 8,138,081
- Issue date Mar 20, 2012
- Fairchild Semiconductor Corporation
- Adams Zhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including first substrate having plurality of...
- Patent number 8,110,907
- Issue date Feb 7, 2012
- Elpida Memory, Inc.
- Masahiro Yamaguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mixed wire semiconductor lead frame package
- Patent number 8,105,932
- Issue date Jan 31, 2012
- Infineon Technologies AG
- Jenny Ong Wai Lian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming an inlay substrate having an antenna wire
- Patent number 8,091,208
- Issue date Jan 10, 2012
- David Finn
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR MANUFACTURING WIRE BONDING STRUCTURE, WIRE BONDING STRUC...
- Publication number 20170062381
- Publication date Mar 2, 2017
- Kazuya IKOMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE-BONDING APPARATUS AND METHOD OF MANUFACTURING SEMICONDUCTOR DE...
- Publication number 20150249063
- Publication date Sep 3, 2015
- SHINKAWA LTD.
- NAOKI SEKINE
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
POWER SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING THE DEVICE AND...
- Publication number 20140327018
- Publication date Nov 6, 2014
- Kohei Tatsumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20140312514
- Publication date Oct 23, 2014
- Shoji Yasunaga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF ASSEMBLING SAME
- Publication number 20140246767
- Publication date Sep 4, 2014
- Peng Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20140231926
- Publication date Aug 21, 2014
- Rohm Co., Ltd.
- Keiji Okumura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BONDING MACHINE AND METHOD FOR TESTING WIRE BOND CONNECTIONS
- Publication number 20140103096
- Publication date Apr 17, 2014
- Hanmin Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ULTRASONIC BONDING SYSTEMS AND METHODS OF USING THE SAME
- Publication number 20140048584
- Publication date Feb 20, 2014
- Orthodyne Electronics Corporation
- Christoph B. Luechinger
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WEDGE BONDER AND A METHOD OF CLEANING A WEDGE BONDER
- Publication number 20130341377
- Publication date Dec 26, 2013
- Chi Wah CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE-ASSISTED SYSTEM FOR ADJUSTING A BONDING TOOL
- Publication number 20130277413
- Publication date Oct 24, 2013
- ASM Technology Singapore Pte Ltd
- Jiang Wen DENG
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRECISION RIBBON RESISTANCE WELDING SYSTEM
- Publication number 20130248496
- Publication date Sep 26, 2013
- PACESETTER, INC.
- Reza Imani
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRE LOOP FORMING SYSTEMS AND METHODS OF USING THE SAME
- Publication number 20130200134
- Publication date Aug 8, 2013
- Orthodyne Electronics Corporation
- Jonathan Michael Byars
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
BONDING WEDGE
- Publication number 20130119117
- Publication date May 16, 2013
- Invensas Corporation
- Scott McGrath
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
RIBBON BONDING TOOLS AND METHODS OF USING THE SAME
- Publication number 20130119111
- Publication date May 16, 2013
- Orthodyne Electronics Corporation
- Mark A. Delsman
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20130034955
- Publication date Feb 7, 2013
- Toyota Jidosha Kabushiki Kaisha
- Masaru Senoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MIXED WIRE SEMICONDUCTOR LEAD FRAME PACKAGE
- Publication number 20120091568
- Publication date Apr 19, 2012
- INFINEON TECHNOLOGIES AG
- Jenny Ong Wai Lian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR FORMING ASYMMETRICAL ENCAPSULANT BEADS ON WIRE BONDS
- Publication number 20120048185
- Publication date Mar 1, 2012
- SILVERBROOK RESEARCH PTY LTD
- Susan Williams
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT ASSEMBLY HAVING PROFILED ENCAPSULATED BONDS
- Publication number 20120018905
- Publication date Jan 26, 2012
- SILVERBROOK RESEARCH PTY LTD
- Kia Silverbrook
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
JOINT QUALITY INSPECTION APPARATUS AND JOINT QUALITY INSPECTION METHOD
- Publication number 20120011934
- Publication date Jan 19, 2012
- TOYOTA JIDOSHA KABUSHIKI KAISHA
- Nami Matsui
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor Arrangement, Semiconductor Module, and Method for Con...
- Publication number 20110316160
- Publication date Dec 29, 2011
- INFINEON TECHNOLOGIES AG
- Dirk Siepe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE EQUIPPED WITH BONDING WIRES AND MANUFACTURING...
- Publication number 20110304031
- Publication date Dec 15, 2011
- CASIO COMPUTER CO., LTD.
- Teiji SHINDO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RIBBON BONDING TOOLS AND METHODS OF USING THE SAME
- Publication number 20110290859
- Publication date Dec 1, 2011
- Orthodyne Electronics Corporation
- Mark A. Delsman
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
BONDING DEVICE, ULTRASONIC TRANSDUCER, AND BONDING METHOD
- Publication number 20110266329
- Publication date Nov 3, 2011
- HESSE & KNIPPS GMBH
- Hans-Juergen Hesse
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
CUTTING BLADE FOR A WIRE BONDING SYSTEM
- Publication number 20110266331
- Publication date Nov 3, 2011
- Orthodyne Electronics Corporation
- Theodore J. Copperthite
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
TRANSDUCER OF AN ULTRASONIC BONDER
- Publication number 20110259939
- Publication date Oct 27, 2011
- F & K Delvotec Bondtechnik GmbH
- Farhad Farassat
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRE BONDING STRUCTURE OF SEMICONDUCTOR DEVICE AND WIRE BONDING METHOD
- Publication number 20110241224
- Publication date Oct 6, 2011
- ROHM CO., LTD.
- Ryuji TSUBAKI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRICAL BOND CONNECTION SYSTEM
- Publication number 20110121059
- Publication date May 26, 2011
- Manfred Reinold
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME
- Publication number 20110073921
- Publication date Mar 31, 2011
- Renesas Electronics Corporation
- Hideaki TAMIMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING A HIGH-TEMPERATURE COMPATIBLE POWER SEMICONDU...
- Publication number 20110070695
- Publication date Mar 24, 2011
- INFINEON TECHNOLOGIES AG
- Reinhold Bayerer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP-CHIP PACKAGE STRUCTURE WITH BLOCK BUMPS AND THE WEDGE BONDING...
- Publication number 20110031302
- Publication date Feb 10, 2011
- GREAT TEAM BACKEND FOUNDRY INC.
- CHUNG HSING TZU
- H01 - BASIC ELECTRIC ELEMENTS

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Wire bonding apparatus

Systems and methods of operating wire bonding machines including cl...

Semiconductor device

Wedge bonding component

Method for manufacturing wire bonding structure, wire bonding struc...

Wire-bonding apparatus and method of manufacturing semiconductor de...

Semiconductor device

Wire bonding structure of semiconductor device and wire bonding method

Semiconductor arrangement, semiconductor module, and method for con...

Electronic device with bimetallic interface element for wire bonding

Mixed wire semiconductor lead frame package

Power semiconductor device, method of manufacturing the device and...

Image-assisted system for adjusting a bonding tool

Ultrasonic bonding systems and methods of using the same

Joint quality inspection and joint quality inspection method

Method of forming a semiconductor device with a contact pad on a sl...

Wedge bonder and a method of cleaning a wedge bonder

Connection element for a semiconductor component and method for pro...

Semiconductor device equipped with bonding wires and manufacturing...

Bonding device, ultrasonic transducer, and bonding method

Semiconductor device and wire bonding method

Method of fabricating a high-temperature compatible power semicondu...

Electrical bond connection system

Semiconductor device

Semiconductor module arrangement

Cutting blade for a wire bonding system

Aluminum bump bonding for fine aluminum wire

Semiconductor device including first substrate having plurality of...

Mixed wire semiconductor lead frame package

Method of forming an inlay substrate having an antenna wire

Patents Applicationslast 30 patents

METHOD FOR MANUFACTURING WIRE BONDING STRUCTURE, WIRE BONDING STRUC...

WIRE-BONDING APPARATUS AND METHOD OF MANUFACTURING SEMICONDUCTOR DE...

POWER SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING THE DEVICE AND...

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD OF ASSEMBLING SAME

SEMICONDUCTOR DEVICE

WIRE BONDING MACHINE AND METHOD FOR TESTING WIRE BOND CONNECTIONS

ULTRASONIC BONDING SYSTEMS AND METHODS OF USING THE SAME

WEDGE BONDER AND A METHOD OF CLEANING A WEDGE BONDER

IMAGE-ASSISTED SYSTEM FOR ADJUSTING A BONDING TOOL

PRECISION RIBBON RESISTANCE WELDING SYSTEM

WIRE LOOP FORMING SYSTEMS AND METHODS OF USING THE SAME

BONDING WEDGE

RIBBON BONDING TOOLS AND METHODS OF USING THE SAME

SEMICONDUCTOR DEVICE

MIXED WIRE SEMICONDUCTOR LEAD FRAME PACKAGE

APPARATUS FOR FORMING ASYMMETRICAL ENCAPSULANT BEADS ON WIRE BONDS

ELECTRONIC COMPONENT ASSEMBLY HAVING PROFILED ENCAPSULATED BONDS

JOINT QUALITY INSPECTION APPARATUS AND JOINT QUALITY INSPECTION METHOD

Semiconductor Arrangement, Semiconductor Module, and Method for Con...

SEMICONDUCTOR DEVICE EQUIPPED WITH BONDING WIRES AND MANUFACTURING...

RIBBON BONDING TOOLS AND METHODS OF USING THE SAME

BONDING DEVICE, ULTRASONIC TRANSDUCER, AND BONDING METHOD

CUTTING BLADE FOR A WIRE BONDING SYSTEM

TRANSDUCER OF AN ULTRASONIC BONDER

WIRE BONDING STRUCTURE OF SEMICONDUCTOR DEVICE AND WIRE BONDING METHOD

ELECTRICAL BOND CONNECTION SYSTEM

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME

METHOD OF FABRICATING A HIGH-TEMPERATURE COMPATIBLE POWER SEMICONDU...

FLIP-CHIP PACKAGE STRUCTURE WITH BLOCK BUMPS AND THE WEDGE BONDING...