wherein the bump connectors are provided as prepeg

Follow

Industry

CPC
H01L2021/60255

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR

Current Industry

H01L2021/60255wherein the bump connectors are provided as prepeg

Industries

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Dummy flip chip bumps for reducing stress
- Patent number 10,734,347
- Issue date Aug 4, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sheng-Yu Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dummy flip chip bumps for reducing stress
- Patent number 10,290,600
- Issue date May 14, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sheng-Yu Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method for manufacturing the same
- Patent number 9,978,716
- Issue date May 22, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chih-Chiang Tsao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dummy flip chip bumps for reducing stress
- Patent number 9,711,477
- Issue date Jul 18, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sheng-Yu Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating a wafer level package
- Patent number 9,704,790
- Issue date Jul 11, 2017
- Micron Technology, Inc.
- Tieh-Chiang Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dummy flip chip bumps for reducing stress
- Patent number 9,287,234
- Issue date Mar 15, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sheng-Yu Wu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE, AND SEMICONDUCTOR PA...
- Publication number 20240128171
- Publication date Apr 18, 2024
- Samsung Electronics Co., Ltd.
- Junwoo Myung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Dummy Flip Chip Bumps for Reducing Stress
- Publication number 20190259724
- Publication date Aug 22, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sheng-Yu Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20170317054
- Publication date Nov 2, 2017
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Chiang TSAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Dummy Flip Chip Bumps for Reducing Stress
- Publication number 20170309588
- Publication date Oct 26, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sheng-Yu Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Dummy Flip Chip Bumps for Reducing Stress
- Publication number 20150004751
- Publication date Jan 1, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sheng-Yu Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Dummy Flip Chip Bumps for Reducing Stress
- Publication number 20130043583
- Publication date Feb 21, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sheng-Yu Wu
- H01 - BASIC ELECTRIC ELEMENTS