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wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
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H01L2224/83192
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ELECTRICITY
H01
Electric elements
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L2224/00
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
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H01L2224/83192
wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
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last 30 patents
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Manufacturing method and electronic module with new routing possibi...
Patent number
RE49970
Issue date
May 14, 2024
IMBERATEK, LLC
Antti Kivikero
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Patent Grant
Semiconductor device and manufacturing method thereof
Patent number
11,961,742
Issue date
Apr 16, 2024
Amkor Technology Singapore Holding Pte Ltd.
Jong Sik Paek
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Semiconductor device and manufacturing method thereof
Patent number
11,948,808
Issue date
Apr 2, 2024
Amkor Technology Singapore Holding Pte Ltd.
Dong Jin Kim
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Package structures and method of forming the same
Patent number
11,948,862
Issue date
Apr 2, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Die attached leveling control by metal stopper bumps
Patent number
11,923,331
Issue date
Mar 5, 2024
Wei-Jhih Mao
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Adhesive bonding composition and electronic components prepared fro...
Patent number
11,901,331
Issue date
Feb 13, 2024
Immunolight, LLC
Zakaryae Fathi
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Semiconductor package with routing patch and conductive interconnec...
Patent number
11,901,335
Issue date
Feb 13, 2024
Amkor Technology Singapore Holding Pte Ltd.
Michael Kelly
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Method of producing semiconductor devices and corresponding semicon...
Patent number
11,887,921
Issue date
Jan 30, 2024
STMicroelectronics S.r.l.
Andrea Albertinetti
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Semiconductor device
Patent number
11,862,598
Issue date
Jan 2, 2024
Rohm Co., Ltd.
Katsuhiko Yoshihara
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Micro device arrangement in donor substrate
Patent number
11,854,783
Issue date
Dec 26, 2023
VueReal Inc.
Gholamreza Chaji
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Semiconductor device and manufacturing method thereof
Patent number
11,837,569
Issue date
Dec 5, 2023
Kioxia Corporation
Yoshiharu Okada
H01 - BASIC ELECTRIC ELEMENTS
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Display device having connection unit
Patent number
11,830,802
Issue date
Nov 28, 2023
Samsung Display Co., Ltd.
Myongsoo Oh
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Display module and manufacturing method thereof
Patent number
11,817,414
Issue date
Nov 14, 2023
Samsung Electronics Co., Ltd.
Won Choi
H01 - BASIC ELECTRIC ELEMENTS
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Semiconductor element bonding structure, method for producing semic...
Patent number
11,810,885
Issue date
Nov 7, 2023
Waseda University
Kohei Tatsumi
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Circuit board structure and method for manufacturing a circuit boar...
Patent number
11,792,941
Issue date
Oct 17, 2023
IMBERATEK, LLC
Risto Tuominen
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Mass transfer device and mass transfer method
Patent number
11,784,159
Issue date
Oct 10, 2023
CHONGQING KONKA PHOTOELECTRIC TECHNOLOGY RESEARCH INSTITUTE CO., LTD.
Jan-hsiang Yang
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Light emitting diode display with redundancy scheme
Patent number
11,778,842
Issue date
Oct 3, 2023
Apple Inc.
Andreas Bibl
G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
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Patent Grant
Semiconductor device
Patent number
11,769,715
Issue date
Sep 26, 2023
Kabushiki Kaisha Toshiba
Masanari Seki
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Low cost package warpage solution
Patent number
11,764,080
Issue date
Sep 19, 2023
Intel Corporation
Omkar G. Karhade
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Method for the manufacture of integrated devices including a die fi...
Patent number
11,756,916
Issue date
Sep 12, 2023
STMicroelectronics S.r.l.
Michele Calabretta
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
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Patent Grant
Semiconductor bonding structures and methods
Patent number
11,749,535
Issue date
Sep 5, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
Meng-Tse Chen
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Semiconductor device
Patent number
11,735,505
Issue date
Aug 22, 2023
Kabushiki Kaisha Toshiba
Hidetoshi Kuraya
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Selective micro device transfer to receiver substrate
Patent number
11,735,545
Issue date
Aug 22, 2023
VueReal Inc.
Gholamreza Chaji
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Selective micro device transfer to receiver substrate
Patent number
11,735,547
Issue date
Aug 22, 2023
VueReal Inc.
Gholamreza Chaji
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Printed circuit film, display device, and method of fabricating pri...
Patent number
11,737,215
Issue date
Aug 22, 2023
Samsung Display Co., Ltd.
Dong Hyun Lee
G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
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Patent Grant
Selective micro device transfer to receiver substrate
Patent number
11,735,546
Issue date
Aug 22, 2023
VueReal Inc.
Gholamreza Chaji
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Selective micro device transfer to receiver substrate
Patent number
11,728,302
Issue date
Aug 15, 2023
VueReal Inc.
Gholamreza Chaji
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Methods for releasing ultra-small or ultra-thin discrete components...
Patent number
11,728,201
Issue date
Aug 15, 2023
Kulicke and Soffa Industries, Inc.
Val Marinov
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Selective micro device transfer to receiver substrate
Patent number
11,728,306
Issue date
Aug 15, 2023
VueReal Inc.
Gholamreza Chaji
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Light-emitting device, manufacturing method thereof and display mod...
Patent number
11,710,812
Issue date
Jul 25, 2023
Epistar Corporation
Min-Hsun Hsieh
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
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Patent Application
DIE ATTACHED LEVELING CONTROL BY METAL STOPPER BUMPS
Publication number
20240162183
Publication date
May 16, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Wei-Jhih Mao
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
COMPOSITE COMPONENT
Publication number
20240136268
Publication date
Apr 25, 2024
Murata Manufacturing Co., Ltd.
Yoshiaki SATAKE
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
SEMICONDUCTOR PACKAGE
Publication number
20240120354
Publication date
Apr 11, 2024
SAMSUNG ELECTRONICS CO,. LTD.
Kyong Soon CHO
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
METHOD OF PRODUCING SEMICONDUCTOR DEVICES AND CORRESPONDING SEMICON...
Publication number
20240120267
Publication date
Apr 11, 2024
STMicroelectronics S.r.l
Andrea ALBERTINETTI
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
DOCUMENT STRUCTURE FORMATION
Publication number
20240105669
Publication date
Mar 28, 2024
INFINEON TECHNOLOGIES AG
Jens Pohl
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
Semiconductor module having a double-sided heat dissipation structu...
Publication number
20240096720
Publication date
Mar 21, 2024
LX Semicon Co., Ltd.
Deog Soo KIM
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
THERMAL PERFORMANCE FOR RADIO FREQUENCY (RF) CHIP PACKAGES
Publication number
20240079371
Publication date
Mar 7, 2024
GLOBALFOUNDRIES U.S. Inc.
John C. MALINOWSKI
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE SAME
Publication number
20240055385
Publication date
Feb 15, 2024
WISTRON NEWEB CORPORATION
KUO-HUA HSIEH
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SYSTEMS AND METHODS FOR FABRICATING SILICON DIE STACKS FOR ELECTRON...
Publication number
20240047415
Publication date
Feb 8, 2024
NANO-X IMAGING LTD
Ukyo JEONG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND IMAGE SENSOR PACKAGE
Publication number
20240038795
Publication date
Feb 1, 2024
Samsung Electronics Co., Ltd.
Sang-Uk KIM
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
DIE ATTACHED LEVELING CONTROL BY METAL STOPPER BUMPS
Publication number
20240021567
Publication date
Jan 18, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Wei-Jhih Mao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CHIP PACKAGE WITH HEAT DISSIPATION PLATE AND MANUFACTURING METHOD T...
Publication number
20240006370
Publication date
Jan 4, 2024
STATS ChipPac Semiconductor (Jiangyin) Co., LTD.
ZELONG YU
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
LIGHT EMITTING DIODE DISPLAY WITH REDUNDANCY SCHEME
Publication number
20240008298
Publication date
Jan 4, 2024
Apple Inc.
Andreas Bibl
G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information
Patent Application
IMAGING ELEMENT PACKAGE, METHOD OF MANUFACTURING THE SAME, AND ELEC...
Publication number
20230420404
Publication date
Dec 28, 2023
Sony Semiconductor Solutions Corporation
Yuji HARA
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
POWER MODULE FOR HIGH-FREQUENCY USE AND METHOD FOR MANUFACTURING TH...
Publication number
20230411334
Publication date
Dec 21, 2023
BOARDTEK ELECTRONICS CORPORATION
CHIEN-CHENG LEE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
POWER MODULE
Publication number
20230395555
Publication date
Dec 7, 2023
HYUNDAI MOBIS CO., LTD.
Se Min PARK
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Setting Up Ultra-Small or Ultra-Thin Discrete Components for Easy A...
Publication number
20230377936
Publication date
Nov 23, 2023
Kulicke and Soffa Industries, Inc.
Val Marinov
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
IMAGE SENSOR PACKAGING STRUCTURES AND RELATED METHODS
Publication number
20230378209
Publication date
Nov 23, 2023
Semiconductor Components Industries, LLC
Chee Peng NEO
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
LOW COST PACKAGE WARPAGE SOLUTION
Publication number
20230369071
Publication date
Nov 16, 2023
Intel Corporation
Omkar G. Karhade
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES AND CORRESPONDING SEM...
Publication number
20230369279
Publication date
Nov 16, 2023
STMicroelectronics S.r.l
Thomas GOTTARDI
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
PACKAGE COMPRISING A SUBSTRATE WITH A BUMP PAD INTERCONNECT COMPRIS...
Publication number
20230352390
Publication date
Nov 2, 2023
QUALCOMM Incorporated
Chin-Kwan KIM
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
STENCIL MASK AND STENCIL PRINTING METHOD
Publication number
20230337369
Publication date
Oct 19, 2023
STATS ChipPAC Pte Ltd.
KyoWang KOO
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
SEMICONDUCTOR DEVICE, AND PRODUCTION METHOD FOR SEMICONDUCTOR DEVICE
Publication number
20230268311
Publication date
Aug 24, 2023
Rohm Co., Ltd.
Koshun SAITO
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
Packaged Electronic Device With Film Isolated Power Stack
Publication number
20230268253
Publication date
Aug 24, 2023
TEXAS INSTRUMENTS INCORPORATED
Tianyi Luo
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
IC CHIP MOUNTING DEVICE AND IC CHIP MOUNTING METHOD
Publication number
20230223376
Publication date
Jul 13, 2023
SATO HOLDINGS KABUSHIKI KAISHA
Yoshimitsu MAEDA
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
Publication number
20230207432
Publication date
Jun 29, 2023
ROHM CO., LTD.
Motoharu Haga
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
METHOD FOR MANUFACTURING DOUBLE-SIDED COOLING TYPE POWER MODULE AND...
Publication number
20230187403
Publication date
Jun 15, 2023
Hyundai Motor Company
Kyoung-Kook Hong
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
DEVICE INCLUDING SEMICONDUCTOR CHIPS AND METHOD FOR PRODUCING SUCH...
Publication number
20230170319
Publication date
Jun 1, 2023
INFINEON TECHNOLOGIES AG
Petteri PALM
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
Publication number
20230115289
Publication date
Apr 13, 2023
Mitsubishi Electric Corporation
Koji YAMAZAKI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR USING A BUFFER SHEET
Publication number
20230095879
Publication date
Mar 30, 2023
Showa Denko Materials Co., Ltd.
Yuta Koseki
H01 - BASIC ELECTRIC ELEMENTS