wherein the thickness of the dielectric plays an important role

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H05K2201/0191

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

Current Industry

H05K2201/0191wherein the thickness of the dielectric plays an important role

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Flexible wiring board
- Patent number 12,185,458
- Issue date Dec 31, 2024
- Murata Manufacturing Co., Ltd.
- Ryo Asai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Heat-dissipating circuit board, heat-dissipating member, and produc...
- Patent number 12,177,972
- Issue date Dec 24, 2024
- NOF Corporation
- Toshinobu Fujimura
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
High-frequency circuit and communication module
- Patent number 12,171,059
- Issue date Dec 17, 2024
- Mitsubishi Electric Corporation
- Nobuo Ohata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bent laminated printed circuit board
- Patent number 12,108,524
- Issue date Oct 1, 2024
- Murata Manufacturing Co., Ltd.
- Toshikazu Harada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flexible circuit board
- Patent number 12,101,879
- Issue date Sep 24, 2024
- LG Innotek Co., Ltd
- Jun Young Lim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Laminated glass structures for electronic devices and electronic de...
- Patent number 12,076,971
- Issue date Sep 3, 2024
- Corning Incorporated
- Jin Su Kim
- B32 - LAYERED PRODUCTS
Information Patent Grant
Differential circuit board and semiconductor light emitting device
- Patent number 12,082,336
- Issue date Sep 3, 2024
- Lumentum Japan, Inc.
- Koichiro Adachi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board
- Patent number 12,004,296
- Issue date Jun 4, 2024
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Jin Uk Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Protection tape for printed circuit board and display device includ...
- Patent number 11,987,031
- Issue date May 21, 2024
- Samsung Display Co., Ltd.
- Jun Namkung
- B32 - LAYERED PRODUCTS
Information Patent Grant
Flexible laminated board and multilayer circuit board
- Patent number 11,985,762
- Issue date May 14, 2024
- UBE EXSYMO CO., LTD.
- Eisuke Tachibana
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Grant
Circuit board structure and manufacturing method thereof
- Patent number 11,943,877
- Issue date Mar 26, 2024
- Unimicron Technology Corp.
- Wen-Yu Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for forming through-hole, and substrate for flexible printed...
- Patent number 11,856,695
- Issue date Dec 26, 2023
- Nippon Mektron, Ltd.
- Toshihiro Higashira
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Metal-clad laminate, printed circuit board, and method for manufact...
- Patent number 11,840,047
- Issue date Dec 12, 2023
- Taiwan Union Technology Corporation
- Shi-Ing Huang
- B32 - LAYERED PRODUCTS
Information Patent Grant
Thermally conductive board
- Patent number 11,778,739
- Issue date Oct 3, 2023
- Polytronics Technology Corp.
- Kuo Hsun Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible circuit board
- Patent number 11,744,014
- Issue date Aug 29, 2023
- LG Innotek Co., Ltd
- Jun Young Lim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Asymmetric board
- Patent number 11,711,890
- Issue date Jul 25, 2023
- Jun Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board and method for manufacturing the same
- Patent number 11,617,263
- Issue date Mar 28, 2023
- Avary Holding (Shenzhen) Co., Limited.
- Lin-Jie Gao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate with antenna, and antenna module
- Patent number 11,605,873
- Issue date Mar 14, 2023
- Murata Manufacturing Co., Ltd.
- Yoshitaka Echikawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible circuit board, display panel, and insulating film
- Patent number 11,564,315
- Issue date Jan 24, 2023
- WUHAN TIANMA MICRO-ELECTRONICS CO., LTD.
- Di Liu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board assembly
- Patent number 11,464,113
- Issue date Oct 4, 2022
- LG Magna e-Powertrain Co., Ltd.
- Jonggyu Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board and method of manufacturing the same
- Patent number 11,430,725
- Issue date Aug 30, 2022
- Shinko Electric Industries Co., Ltd.
- Noriyoshi Shimizu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fluororesin base material, printed wiring board, and circuit module
- Patent number 11,364,714
- Issue date Jun 21, 2022
- SUMITOMO ELECTRIC PRINTED CIRCUITS, INC.
- Satoshi Kiya
- B32 - LAYERED PRODUCTS
Information Patent Grant
Black liquid-crystal polymer film and multilayer board
- Patent number 11,365,353
- Issue date Jun 21, 2022
- Murata Manufacturing Co., Ltd.
- Yoshimasa Nishi
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Wiring substrate and component built-in wiring substrate
- Patent number 11,363,719
- Issue date Jun 14, 2022
- Ibiden Co., Ltd.
- Hiroyasu Noto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Formable transparent conductive films with metal nanowires
- Patent number 11,343,911
- Issue date May 24, 2022
- C3 Nano, Inc.
- Yu Kambe
- F21 - LIGHTING
Information Patent Grant
Multilayer laminate and method for producing multilayer printed wir...
- Patent number 11,285,700
- Issue date Mar 29, 2022
- Mitsui Mining & Smelting Co., Ltd.
- Yoshihiro Yoneda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of printed board
- Patent number 11,212,913
- Issue date Dec 28, 2021
- Murata Manufacturing Co., Ltd.
- Toshikazu Harada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flexible circuit board
- Patent number 11,202,367
- Issue date Dec 14, 2021
- LG Innotek Co., Ltd
- Jun Young Lim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Conductor arrangement and production method
- Patent number 11,195,639
- Issue date Dec 7, 2021
- Michael Wortberg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component built-in wiring board and method for manufactu...
- Patent number 11,160,168
- Issue date Oct 26, 2021
- Ibiden Co., Ltd.
- Yusuke Tanaka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
FLEXIBLE CIRCUIT BOARD
- Publication number 20240414842
- Publication date Dec 12, 2024
- LG Innotek Co., Ltd.
- Jun Young LIM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND ELECTRONIC DEVICE INCLUDING THE SAME
- Publication number 20240357741
- Publication date Oct 24, 2024
- Samsung Electronics Co., Ltd.
- Yeonkyung CHUNG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PROTECTION TAPE FOR PRINTED CIRCUIT BOARD AND DISPLAY DEVICE INCLUD...
- Publication number 20240300208
- Publication date Sep 12, 2024
- SAMSUNG DISPLAY CO., LTD.
- Jun NAMKUNG
- B32 - LAYERED PRODUCTS
Information Patent Application
HEAT-DISSIPATING CIRCUIT BOARD, HEAT-DISSIPATING MEMBER, AND PRODUC...
- Publication number 20240268022
- Publication date Aug 8, 2024
- NOF Corporation
- Toshinobu FUJIMURA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240179829
- Publication date May 30, 2024
- Unimicron Technology Corp.
- Chun Hung KUO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING CIRCUIT BOARD
- Publication number 20240023237
- Publication date Jan 18, 2024
- Nitto Denko Corporation
- Rihito FUKUSHIMA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD
- Publication number 20230403787
- Publication date Dec 14, 2023
- LG Innotek Co., Ltd.
- Seong Hwan IM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD
- Publication number 20230309217
- Publication date Sep 28, 2023
- TORAY INDUSTRIES, INC.
- Ryutaro IKEDA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20230240023
- Publication date Jul 27, 2023
- Unimicron Technology Corp.
- Wen-Yu Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD
- Publication number 20230199954
- Publication date Jun 22, 2023
- Avary Holding (Shenzhen) Co., Limited.
- LIN-JIE GAO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATE AND SEMICONDUCTOR LASER
- Publication number 20230113274
- Publication date Apr 13, 2023
- ams-OSRAM International GmbH
- Daniel Dietze
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLEXIBLE WIRING BOARD
- Publication number 20230073700
- Publication date Mar 9, 2023
- Murata Manufacturing Co., Ltd.
- Ryo ASAI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electronic Control Unit
- Publication number 20220400560
- Publication date Dec 15, 2022
- Hitachi Astemo, Ltd.
- Tomohiro FUKUDA
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
ASYMMETRIC BOARD
- Publication number 20220386455
- Publication date Dec 1, 2022
- SHENZHEN KINWONG ELECTRONIC CO., LTD.
- Jun WANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20220338348
- Publication date Oct 20, 2022
- Avary Holding (Shenzhen) Co., Limited.
- LIN-JIE GAO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLEXIBLE CIRCUIT BOARD, DISPLAY PANEL, AND INSULATING FILM
- Publication number 20220256696
- Publication date Aug 11, 2022
- WUHAN TIANMA MICRO-ELECTRONICS CO.,LTD.
- Di LIU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DISPLAY DEVICE INCLUDING FORMABLE TRANSPARENT CONDUCTIVE FILMS WITH...
- Publication number 20220256694
- Publication date Aug 11, 2022
- C3 Nano, Inc.
- Yu Kambe
- F21 - LIGHTING
Information Patent Application
THERMALLY CONDUCTIVE BOARD
- Publication number 20220201856
- Publication date Jun 23, 2022
- POLYTRONICS TECHNOLOGY CORP.
- KUO HSUN CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIFFERENTIAL CIRCUIT BOARD AND SEMICONDUCTOR LIGHT EMITTING DEVICE
- Publication number 20220087007
- Publication date Mar 17, 2022
- Lumentum Japan, Inc.
- Koichiro ADACHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF PRINTED BOARD
- Publication number 20220087011
- Publication date Mar 17, 2022
- MURATA MANUFACTURING CO., LTD.
- Toshikazu HARADA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HIGH-FREQUENCY CIRCUIT AND COMMUNICATION MODULE
- Publication number 20210410269
- Publication date Dec 30, 2021
- Mitsubishi Electric Corporation
- Nobuo OHATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THIN CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
- Publication number 20210392758
- Publication date Dec 16, 2021
- Avary Holding (Shenzhen) Co., Limited.
- HSIAO-TING HSU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING SUBSTRATE AND COMPONENT BUILT-IN WIRING SUBSTRATE
- Publication number 20210282266
- Publication date Sep 9, 2021
- IBIDEN CO., LTD.
- Hiroyasu NOTO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Conductor Arrangement and Production Method
- Publication number 20210202130
- Publication date Jul 1, 2021
- LISA DRAXLMAIER GMBH
- Michael WORTBERG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL-CLAD LAMINATE, PRINTED CIRCUIT BOARD, AND METHOD FOR MANUFACT...
- Publication number 20210060900
- Publication date Mar 4, 2021
- Taiwan Union Technology Corporation
- Shi-Ing HUANG
- B32 - LAYERED PRODUCTS
Information Patent Application
FLEXIBLE CIRCUIT BOARD
- Publication number 20200413527
- Publication date Dec 31, 2020
- ADVANCED CONNECTEK INC.
- Min-Lung Chien
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATE WITH ANTENNA, AND ANTENNA MODULE
- Publication number 20200343618
- Publication date Oct 29, 2020
- MURATA MANUFACTURING CO., LTD.
- Yoshitaka ECHIKAWA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Circuit Board with Improved Thermal, Moisture Resistance, and Elect...
- Publication number 20200288570
- Publication date Sep 10, 2020
- OSI Electronics, Inc.
- Robert Jung
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD ASSEMBLY
- Publication number 20200267841
- Publication date Aug 20, 2020
- LG ELECTRONICS INC.
- Jonggyu Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND METHOD FOR PROCESSING A PRINTED CIRCUIT B...
- Publication number 20200260576
- Publication date Aug 13, 2020
- Vitesco Technologies GMBH
- Christian LAMMEL
- H01 - BASIC ELECTRIC ELEMENTS

wherein the thickness of the dielectric plays an important role

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Flexible wiring board

Heat-dissipating circuit board, heat-dissipating member, and produc...

High-frequency circuit and communication module

Bent laminated printed circuit board

Flexible circuit board

Laminated glass structures for electronic devices and electronic de...

Differential circuit board and semiconductor light emitting device

Printed circuit board

Protection tape for printed circuit board and display device includ...

Flexible laminated board and multilayer circuit board

Circuit board structure and manufacturing method thereof

Method for forming through-hole, and substrate for flexible printed...

Metal-clad laminate, printed circuit board, and method for manufact...

Thermally conductive board

Flexible circuit board

Asymmetric board

Circuit board and method for manufacturing the same

Substrate with antenna, and antenna module

Flexible circuit board, display panel, and insulating film

Printed circuit board assembly

Wiring board and method of manufacturing the same

Fluororesin base material, printed wiring board, and circuit module

Black liquid-crystal polymer film and multilayer board

Wiring substrate and component built-in wiring substrate

Formable transparent conductive films with metal nanowires

Multilayer laminate and method for producing multilayer printed wir...

Manufacturing method of printed board

Flexible circuit board

Conductor arrangement and production method

Electronic component built-in wiring board and method for manufactu...

Patents Applicationslast 30 patents

FLEXIBLE CIRCUIT BOARD

PRINTED CIRCUIT BOARD AND ELECTRONIC DEVICE INCLUDING THE SAME

PROTECTION TAPE FOR PRINTED CIRCUIT BOARD AND DISPLAY DEVICE INCLUD...

HEAT-DISSIPATING CIRCUIT BOARD, HEAT-DISSIPATING MEMBER, AND PRODUC...

CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF

WIRING CIRCUIT BOARD

CIRCUIT BOARD

WIRING BOARD

CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF

CIRCUIT BOARD

SUBSTRATE AND SEMICONDUCTOR LASER

FLEXIBLE WIRING BOARD

Electronic Control Unit

ASYMMETRIC BOARD

CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME

FLEXIBLE CIRCUIT BOARD, DISPLAY PANEL, AND INSULATING FILM

DISPLAY DEVICE INCLUDING FORMABLE TRANSPARENT CONDUCTIVE FILMS WITH...

THERMALLY CONDUCTIVE BOARD

DIFFERENTIAL CIRCUIT BOARD AND SEMICONDUCTOR LIGHT EMITTING DEVICE

MANUFACTURING METHOD OF PRINTED BOARD

HIGH-FREQUENCY CIRCUIT AND COMMUNICATION MODULE

THIN CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

WIRING SUBSTRATE AND COMPONENT BUILT-IN WIRING SUBSTRATE

Conductor Arrangement and Production Method

METAL-CLAD LAMINATE, PRINTED CIRCUIT BOARD, AND METHOD FOR MANUFACT...

FLEXIBLE CIRCUIT BOARD

SUBSTRATE WITH ANTENNA, AND ANTENNA MODULE

Circuit Board with Improved Thermal, Moisture Resistance, and Elect...

PRINTED CIRCUIT BOARD ASSEMBLY

PRINTED CIRCUIT BOARD AND METHOD FOR PROCESSING A PRINTED CIRCUIT B...