Wire and TAB connectors

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H01L2224/73229

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/73229Wire and TAB connectors

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Patents Grantslast 30 patents

Information Patent Grant
Mounting structures for integrated device packages
- Patent number 11,127,716
- Issue date Sep 21, 2021
- Analog Devices International Unlimited Company
- Rigan McGeehan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with integrated shunt resistor
- Patent number 10,950,509
- Issue date Mar 16, 2021
- Infineon Technologies AG
- Rainald Sander
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Radio frequency (RF) devices
- Patent number 10,147,698
- Issue date Dec 4, 2018
- NXP USA, INC.
- Lakshminarayan Viswanathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible circuit leads in packaging for radio frequency devices
- Patent number 9,824,995
- Issue date Nov 21, 2017
- NXP USA, INC.
- Lakshminarayan Viswanathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ground arch for wirebond ball grid arrays
- Patent number 7,217,997
- Issue date May 15, 2007
- NXP B.V.
- Chris Wyland
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device free from short-circuit due to resin pressure...
- Patent number 5,731,962
- Issue date Mar 24, 1998
- NEC Corporation
- Tomoo Imura
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MOUNTING STRUCTURES FOR INTEGRATED DEVICE PACKAGES
- Publication number 20190319011
- Publication date Oct 17, 2019
- Analog Devices Global Unlimited Company
- Rigan McGeehan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLEXIBLE CIRCUIT LEADS IN PACKAGING FOR RADIO FREQUENCY DEVICES AND...
- Publication number 20180019222
- Publication date Jan 18, 2018
- NXP USA, Inc.
- LAKSHMINARAYAN VISWANATHAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES WITH MULTILAYER FLEX INTERCONNECT STRUCTURES
- Publication number 20140353830
- Publication date Dec 4, 2014
- FREESCALE SEMICONDUCTOR, INC.
- Burton J. Carpenter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Ground arch for wirebond ball grid arrays
- Publication number 20060180916
- Publication date Aug 17, 2006
- Koninklijke Philips Electronics N.V.
- Chris Wyland
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
High density interconnect power and ground strap and method therefor
- Publication number 20060049505
- Publication date Mar 9, 2006
- Koninklijke Philips Electronics N.V.
- Chris Wyland
- H01 - BASIC ELECTRIC ELEMENTS