Wire connectors; Manufacturing methods related thereto

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto

Current Industry

H01L24/42Wire connectors; Manufacturing methods related thereto

Industries

Patents Grantslast 30 patents

Information Patent Grant
Method and system of forming integrated circuit
- Patent number 12,009,260
- Issue date Jun 11, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Ka Fai Chang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
System, method, and computer program product for predicting pin pla...
- Patent number 11,829,852
- Issue date Nov 28, 2023
- Cadence Design Systems, Inc.
- Sai Bhushan
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Voltage generators with charge pumps for switch circuits
- Patent number 11,689,202
- Issue date Jun 27, 2023
- Skyworks Solutions, Inc.
- Florinel G. Balteanu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal spreading management of 3D stacked integrated circuits
- Patent number 11,626,395
- Issue date Apr 11, 2023
- Intel Corporation
- Robert L. Sankman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertical bond-wire stacked chip-scale package with application-spec...
- Patent number 11,538,746
- Issue date Dec 27, 2022
- Intel Corporation
- Zhicheng Ding
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wide-bandgap semiconductor device including gate fingers between bo...
- Patent number 11,245,007
- Issue date Feb 8, 2022
- Infineon Technologies AG
- Dethard Peters
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Control circuitry for silicon-on-insulator chip
- Patent number 11,190,182
- Issue date Nov 30, 2021
- Skyworks Solutions, Inc.
- Florinel G. Balteanu
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Thermal spreading management of 3D stacked integrated circuits
- Patent number 11,127,727
- Issue date Sep 21, 2021
- Intel Corporation
- Robert L. Sankman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method of the same
- Patent number 11,121,056
- Issue date Sep 14, 2021
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chien-Mao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having singular wire bond on bonding pads
- Patent number 11,056,465
- Issue date Jul 6, 2021
- Intel Corporation
- Yi Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solid-state image pickup device and electronic apparatus to increas...
- Patent number 10,986,292
- Issue date Apr 20, 2021
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Kenji Mishima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Coated wire
- Patent number 10,960,498
- Issue date Mar 30, 2021
- Heraeus Materials Singapore Pte., Ltd.
- Il Tae Kang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatuses and methods for drivers with reduced noise
- Patent number 10,896,720
- Issue date Jan 19, 2021
- Micron Technology, Inc.
- Kazuyuki Morishige
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
DRAM memory chips quick optical erasure
- Patent number 10,872,655
- Issue date Dec 22, 2020
- Goran Krilic
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor vertical wire bonding structure and method
- Patent number 10,854,476
- Issue date Dec 1, 2020
- SJ Semiconductor (Jiangyin) Corporation
- Han Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sensor package structure
- Patent number 10,825,851
- Issue date Nov 3, 2020
- KINGPAK TECHNOLOGY INC.
- Sheng Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip chip bonding onto a photonic integrated circuit
- Patent number 10,816,740
- Issue date Oct 27, 2020
- Elenion Technologies, LLC
- Ari Novack
- G02 - OPTICS
Information Patent Grant
Method and system of forming integrated circuit
- Patent number 10,811,316
- Issue date Oct 20, 2020
- Taiwan Semiconductor Manufacturing Company Ltd.
- Ka Fai Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
IGBT module assembly
- Patent number 10,811,333
- Issue date Oct 20, 2020
- Gree Electric Appliances, Inc. of Zhuhai
- Jing Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Touch panel, method for fabricating the same, and touch device
- Patent number 10,705,668
- Issue date Jul 7, 2020
- BOE Technology Group Co., Ltd.
- Wang Li
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor apparatus, ignition device for internal combustion en...
- Patent number 10,651,113
- Issue date May 12, 2020
- Mitsubishi Electric Corporation
- Kazuhiro Nishimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power converter
- Patent number 10,600,716
- Issue date Mar 24, 2020
- Toyota Jidosha Kabushiki Kaisha
- Yoshihiro Kida
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Three-level I-type inverter and semiconductor module
- Patent number 10,541,624
- Issue date Jan 21, 2020
- Mitsubishi Electric Corporation
- Masaaki Ishino
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Semiconductor device
- Patent number 10,535,577
- Issue date Jan 14, 2020
- Denso Corporation
- Hiroshi Ishino
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Apparatuses and methods for drivers with reduced noise
- Patent number 10,522,208
- Issue date Dec 31, 2019
- Micron Technology, Inc.
- Kazuyuki Morishige
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Embedded wire bond wires
- Patent number 10,490,528
- Issue date Nov 26, 2019
- Invensas Corporation
- Ashok S. Prabhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interposer substrate and method for manufacturing the same
- Patent number 10,475,765
- Issue date Nov 12, 2019
- PHOENIX PIONEER TECHNOLOGY CO., LTD.
- Shih-Ping Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding pad structure of a semiconductor device
- Patent number 10,461,050
- Issue date Oct 29, 2019
- Fuji Electric Co., Ltd.
- Hidekazu Tanisawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Igniter
- Patent number 10,443,557
- Issue date Oct 15, 2019
- Denso Corporation
- Motoo Yamaguchi
- F02 - COMBUSTION ENGINES HOT-GAS OR COMBUSTION-PRODUCT ENGINE PLANTS
Information Patent Grant
Combined source and base contact for a field effect transistor
- Patent number 10,446,497
- Issue date Oct 15, 2019
- Microchip Technology Incorporated
- Dan Grimm
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20230055505
- Publication date Feb 23, 2023
- Rohm Co., Ltd.
- Takara KOSAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230056682
- Publication date Feb 23, 2023
- Rohm Co., Ltd.
- Takara KOSAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20220367331
- Publication date Nov 17, 2022
- Samsung Electronics Co., Ltd.
- Sangwon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VOLTAGE GENERATORS WITH CHARGE PUMPS FOR SWITCH CIRCUITS
- Publication number 20220085808
- Publication date Mar 17, 2022
- Skyworks Solutions, Inc.
- Florinel G. Balteanu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL SPREADING MANAGEMENT OF 3D STACKED INTEGRATED CIRCUITS
- Publication number 20210398966
- Publication date Dec 23, 2021
- Intel Corporation
- Robert L. Sankman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND SYSTEM OF FORMING INTEGRATED CIRCUIT
- Publication number 20200402856
- Publication date Dec 24, 2020
- Taiwan Semiconductor Manufacturing company Ltd.
- KA FAI CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL SPREADING MANAGEMENT OF 3D STACKED INTEGRATED CIRCUITS
- Publication number 20200388603
- Publication date Dec 10, 2020
- Intel Corporation
- Robert L. Sankman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP CHIP BONDING ONTO A PHOTONIC INTEGRATED CIRCUIT
- Publication number 20200249405
- Publication date Aug 6, 2020
- Elenion Technologies, LLC
- ARI NOVACK
- G02 - OPTICS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME
- Publication number 20200243416
- Publication date Jul 30, 2020
- Taiwan Semiconductor Manufacturing company Ltd.
- CHIEN-MAO CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUSES AND METHODS FOR DRIVERS WITH REDUCED NOISE
- Publication number 20200105333
- Publication date Apr 2, 2020
- Micron Technology, Inc.
- Kazuyuki Morishige
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
INDUCTIVE COMPENSATION IN MEMORY SYSTEMS
- Publication number 20200065270
- Publication date Feb 27, 2020
- SANDISK TECHNOLOGIES LLC
- Md. Sayed Hossain Mobin
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
METHOD AND SYSTEM OF FORMING INTEGRATED CIRCUIT
- Publication number 20200051863
- Publication date Feb 13, 2020
- Taiwan Semiconductor Manufacturing company Ltd.
- KA FAI CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-LEVEL I-TYPE INVERTER AND SEMICONDUCTOR MODULE
- Publication number 20190267912
- Publication date Aug 29, 2019
- Mitsubishi Electric Corporation
- Masaaki ISHINO
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
TOUCH PANEL, METHOD FOR FABRICATING THE SAME, AND TOUCH DEVICE
- Publication number 20190265820
- Publication date Aug 29, 2019
- BOE TECHNOLOGY GROUP CO., LTD.
- Wang LI
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
DRAM MEMORY CHIPS QUICK OPTICAL ERASURE
- Publication number 20190206475
- Publication date Jul 4, 2019
- Goran Krilic
- G11 - INFORMATION STORAGE
Information Patent Application
SWITCHING UNIT FOR VOLTAGE INVERTER OR RECTIFIER
- Publication number 20190149064
- Publication date May 16, 2019
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- Guillaume Lefevre
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IGBT MODULE ASSEMBLY
- Publication number 20190131205
- Publication date May 2, 2019
- GREE ELECTRIC APPLIANCES, INC. OF ZHUHAI
- Jing Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20190088568
- Publication date Mar 21, 2019
- Denso Corporation
- Hiroshi ISHINO
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
PACKAGED INTEGRATED CIRCUIT HAVING STACKED DIE AND METHOD FOR THEREFOR
- Publication number 20190088576
- Publication date Mar 21, 2019
- NXP USA, Inc.
- LEO M. HIGGINS
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
SEMICONDUCTOR APPARATUS, IGNITION DEVICE FOR INTERNAL COMBUSTION EN...
- Publication number 20190080986
- Publication date Mar 14, 2019
- Mitsubishi Electric Corporation
- Kazuhiro NISHIMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERPOSER SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20190074260
- Publication date Mar 7, 2019
- PHOENIX PIONEER TECHNOLOGY CO., LTD.
- Shih-Ping Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM AND METHOD FOR CONTROLLING SWITCHING DEVICE IN POWER CONVERTER
- Publication number 20190028016
- Publication date Jan 24, 2019
- Semiconductor Components Industries, LLC
- Seung-Uk YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTO-REFLECTOR
- Publication number 20180366607
- Publication date Dec 20, 2018
- NEW JAPAN RADIO CO., LTD.
- Fumiaki OHNO
- G01 - MEASURING TESTING
Information Patent Application
POWER CONVERTER
- Publication number 20180337107
- Publication date Nov 22, 2018
- Toyota Jidosha Kabushiki Kaisha
- Yoshihiro KIDA
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
SOLID-STATE IMAGE PICKUP DEVICE, MANUFACTURING METHOD THEREOF, AND...
- Publication number 20180332245
- Publication date Nov 15, 2018
- Sony Semiconductor Solutions Corporation
- KENJI MISHIMA
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
IGNITER
- Publication number 20180320652
- Publication date Nov 8, 2018
- Motoo YAMAGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20180233571
- Publication date Aug 16, 2018
- Toyota Jidosha Kabushiki Kaisha
- Naoki AKIYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20180226362
- Publication date Aug 9, 2018
- RENESAS ELECTRONICS CORPORATION
- Shinji WATANABE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMALLY CONDUCTIVE COMPOSITION, SEMICONDUCTOR DEVICE, METHOD FOR...
- Publication number 20180194869
- Publication date Jul 12, 2018
- SUMITOMO BAKELITE CO., LTD.
- Yasuo SHIMOBE
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
OPTOELECTRONIC COMPONENT COMPRISING A CONVERSION ELEMENT, METHOD OF...
- Publication number 20180198034
- Publication date Jul 12, 2018
- Osram Opto Semiconductors GmbH
- David O'Brien
- H01 - BASIC ELECTRIC ELEMENTS

Wire connectors; Manufacturing methods related thereto

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method and system of forming integrated circuit

System, method, and computer program product for predicting pin pla...

Voltage generators with charge pumps for switch circuits

Thermal spreading management of 3D stacked integrated circuits

Vertical bond-wire stacked chip-scale package with application-spec...

Wide-bandgap semiconductor device including gate fingers between bo...

Control circuitry for silicon-on-insulator chip

Thermal spreading management of 3D stacked integrated circuits

Semiconductor device and manufacturing method of the same

Semiconductor package having singular wire bond on bonding pads

Solid-state image pickup device and electronic apparatus to increas...

Coated wire

Apparatuses and methods for drivers with reduced noise

DRAM memory chips quick optical erasure

Semiconductor vertical wire bonding structure and method

Sensor package structure

Flip chip bonding onto a photonic integrated circuit

Method and system of forming integrated circuit

IGBT module assembly

Touch panel, method for fabricating the same, and touch device

Semiconductor apparatus, ignition device for internal combustion en...

Power converter

Three-level I-type inverter and semiconductor module

Semiconductor device

Apparatuses and methods for drivers with reduced noise

Embedded wire bond wires

Interposer substrate and method for manufacturing the same

Bonding pad structure of a semiconductor device

Igniter

Combined source and base contact for a field effect transistor

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE

VOLTAGE GENERATORS WITH CHARGE PUMPS FOR SWITCH CIRCUITS

THERMAL SPREADING MANAGEMENT OF 3D STACKED INTEGRATED CIRCUITS

METHOD AND SYSTEM OF FORMING INTEGRATED CIRCUIT

THERMAL SPREADING MANAGEMENT OF 3D STACKED INTEGRATED CIRCUITS

FLIP CHIP BONDING ONTO A PHOTONIC INTEGRATED CIRCUIT

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME

APPARATUSES AND METHODS FOR DRIVERS WITH REDUCED NOISE

INDUCTIVE COMPENSATION IN MEMORY SYSTEMS

METHOD AND SYSTEM OF FORMING INTEGRATED CIRCUIT

THREE-LEVEL I-TYPE INVERTER AND SEMICONDUCTOR MODULE

TOUCH PANEL, METHOD FOR FABRICATING THE SAME, AND TOUCH DEVICE

DRAM MEMORY CHIPS QUICK OPTICAL ERASURE

SWITCHING UNIT FOR VOLTAGE INVERTER OR RECTIFIER

IGBT MODULE ASSEMBLY

SEMICONDUCTOR DEVICE

PACKAGED INTEGRATED CIRCUIT HAVING STACKED DIE AND METHOD FOR THEREFOR

SEMICONDUCTOR APPARATUS, IGNITION DEVICE FOR INTERNAL COMBUSTION EN...

INTERPOSER SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME

SYSTEM AND METHOD FOR CONTROLLING SWITCHING DEVICE IN POWER CONVERTER

OPTO-REFLECTOR

POWER CONVERTER

SOLID-STATE IMAGE PICKUP DEVICE, MANUFACTURING METHOD THEREOF, AND...

IGNITER

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

THERMALLY CONDUCTIVE COMPOSITION, SEMICONDUCTOR DEVICE, METHOD FOR...

OPTOELECTRONIC COMPONENT COMPRISING A CONVERSION ELEMENT, METHOD OF...