Wire effects

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H01L2924/386

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

Current Industry

H01L2924/386Wire effects

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Methods of calibrating an ultrasonic characteristic on a wire bondi...
- Patent number 12,113,043
- Issue date Oct 8, 2024
- Kulicke and Soffa Industries, Inc.
- Jon W. Brunner
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device package having multi-layer molding compound an...
- Patent number 11,961,778
- Issue date Apr 16, 2024
- Western Digital Technologies, Inc.
- Shenghua Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor module with laser-welded leadframe
- Patent number 11,749,633
- Issue date Sep 5, 2023
- Hitachi Energy Switzerland AG
- Niko Pavlicek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit (IC) device including a force mitigation system...
- Patent number 11,682,642
- Issue date Jun 20, 2023
- Microchip Technology Incorporated
- Justin Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Scribe seals and methods of making
- Patent number 11,069,627
- Issue date Jul 20, 2021
- Texas Instruments Incorporated
- Thomas D. Bonifield
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit (IC) device including a force mitigation system...
- Patent number 10,896,888
- Issue date Jan 19, 2021
- Microchip Technology Incorporated
- Justin Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bond clamp design and lead frame capable of engaging with same
- Patent number 10,861,777
- Issue date Dec 8, 2020
- Texas Instruments Incorporated
- Yuh-Harng Chien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Screening methodology to eliminate wire sweep in bond and assembly...
- Patent number 10,605,850
- Issue date Mar 31, 2020
- International Business Machines Corporation
- Stephen Peter Ayotte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Face down dual sided chip scale memory package
- Patent number 10,366,934
- Issue date Jul 30, 2019
- Micron Technology, Inc.
- Chan Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plastic-packaged semiconductor device having wires with polymerized...
- Patent number 10,199,348
- Issue date Feb 5, 2019
- Texas Instruments Incorporated
- Rongwei Zhang
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Remapped packaged extracted die with 3D printed bond connections
- Patent number 10,147,660
- Issue date Dec 4, 2018
- Global Circuits Innovations, Inc.
- Erick Merle Spory
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 10,128,172
- Issue date Nov 13, 2018
- RENESAS ELECTRONICS CORPORATION
- Yuichiro Ikeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D printed hermetic package assembly and method
- Patent number 10,128,161
- Issue date Nov 13, 2018
- Global Circuit Innovations, Inc.
- Erick Merle Spory
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level chip scale semiconductor package
- Patent number 10,109,564
- Issue date Oct 23, 2018
- NXP B.V.
- Roelf Groenhuis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring board
- Patent number 10,080,292
- Issue date Sep 18, 2018
- Shinko Electric Industries Co., Ltd.
- Junji Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with coated bonding wires and fabrication met...
- Patent number 10,037,936
- Issue date Jul 31, 2018
- Mediatek Inc.
- Shiann-Tsong Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Isolator with reduced susceptibility to parasitic coupling
- Patent number 9,960,671
- Issue date May 1, 2018
- Avago Technologies General IP (Singapore) Pte. Ltd.
- Dominique Ho
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Method and apparatus for printing integrated circuit bond connections
- Patent number 9,935,028
- Issue date Apr 3, 2018
- Global Circuit Innovations Incorporated
- Erick Merle Spory
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including a first internal circuit, a second i...
- Patent number 9,917,037
- Issue date Mar 13, 2018
- RENESAS ELECTRONICS CORPORATION
- Yuichiro Ikeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit with printed bond connections
- Patent number 9,824,948
- Issue date Nov 21, 2017
- Global Circuit Innovations Incorporated
- Erick Merle Spory
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding wire for semiconductor devices
- Patent number 9,812,421
- Issue date Nov 7, 2017
- Nippon Steel & Sumikin Materials Co., Ltd.
- Tomohiro Uno
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multiple bond via arrays of different wire heights on a same substrate
- Patent number 9,728,527
- Issue date Aug 8, 2017
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Corrosion-resistant copper bonds to aluminum
- Patent number 9,646,950
- Issue date May 9, 2017
- Texas Instruments Incorporated
- Kejun Zeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip rotated at an angle mounted on die pad region
- Patent number 9,633,931
- Issue date Apr 25, 2017
- Rohm Co., Ltd.
- Hirotoshi Usui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit substrate interconnect
- Patent number 9,536,753
- Issue date Jan 3, 2017
- Texas Instruments Incorporated
- Yohei Koto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Screening methodology to eliminate wire sweep in bond and assembly...
- Patent number 9,470,740
- Issue date Oct 18, 2016
- International Business Machines Corporation
- Stephen Peter Ayotte
- G01 - MEASURING TESTING
Information Patent Grant
Multiple die in a face down package
- Patent number 9,466,587
- Issue date Oct 11, 2016
- Tessera, Inc.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip package assembly with improved bond wire separation
- Patent number 9,431,364
- Issue date Aug 30, 2016
- Cypess Semiconductor Corporation
- Kiah Ling Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip and semiconductor package
- Patent number 9,418,960
- Issue date Aug 16, 2016
- Kabushiki Kaisha Toshiba
- Shohei Fukuda
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Semiconductor device and a manufacturing method thereof
- Patent number 9,396,971
- Issue date Jul 19, 2016
- Renesas Electronics Corporation
- Yukihiro Sato
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHODS OF CALIBRATING AN ULTRASONIC CHARACTERISTIC ON A WIRE BONDI...
- Publication number 20240404986
- Publication date Dec 5, 2024
- KULICKE AND SOFFA INDUSTRIES, INC.
- Jon W. Brunner
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240312950
- Publication date Sep 19, 2024
- RENESAS ELECTRONICS CORPORATION
- Takaya HOSHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT SUBSTRATE HAVING IMPROVED BONDING STRUCTURE
- Publication number 20240188215
- Publication date Jun 6, 2024
- TONG HSING ELECTRONIC INDUSTRIES, LTD.
- LI-CHUN HUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BONDS FOR GALVANIC ISOLATION DEVICE
- Publication number 20240113155
- Publication date Apr 4, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Jeffrey Alan West
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE
- Publication number 20240047336
- Publication date Feb 8, 2024
- Siliconware Precision Industries Co., Ltd.
- Ching-Chih Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STACK STRUCTURE
- Publication number 20240030190
- Publication date Jan 25, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC
- Honglong SHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT HAVING A ROUTABLE LEADFRAME
- Publication number 20230411170
- Publication date Dec 21, 2023
- TEXAS INSTRUMENTS INCORPORATED
- BRADLEY GLASSCOCK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF DETERMINING A SEQUENCE FOR CREATING A PLURALITY OF WIRE...
- Publication number 20230260960
- Publication date Aug 17, 2023
- Kulicke and Soffa Industries, Inc.
- Basil Milton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF CALIBRATING AN ULTRASONIC CHARACTERISTIC ON A WIRE BONDI...
- Publication number 20230154888
- Publication date May 18, 2023
- KULICKE AND SOFFA INDUSTRIES, INC.
- Jon W. Brunner
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor Device Package Having Multi-Layer Molding Compound an...
- Publication number 20230101826
- Publication date Mar 30, 2023
- Western Digital Technologies, Inc.
- Shenghua Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power Semiconductor Module with Laser-Welded Leadframe
- Publication number 20220406745
- Publication date Dec 22, 2022
- Hitachi Energy Switzerland AG
- Niko Pavlicek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR CHIP
- Publication number 20220328444
- Publication date Oct 13, 2022
- Fuji Electric Co., Ltd.
- Akio YAMANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit (IC) Device Including A Force Mitigation System...
- Publication number 20200411462
- Publication date Dec 31, 2020
- MICROCHIP TECHNOLOGY INCORPORATED
- Justin Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT (IC) DEVICE INCLUDING A FORCE MITIGATION SYSTEM...
- Publication number 20190287936
- Publication date Sep 19, 2019
- MICROCHIP TECHNOLOGY INCORPORATED
- Justin Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BOND CLAMP DESIGN AND LEAD FRAME CAPABLE OF ENGAGING WITH SAME
- Publication number 20190206769
- Publication date Jul 4, 2019
- TEXAS INSTRUMENTS INCORPORATED
- Yuh-Harng CHIEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20190051583
- Publication date Feb 14, 2019
- RENESAS ELECTRONICS CORPORATION
- Yuichiro IKEDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20180308812
- Publication date Oct 25, 2018
- Toyota Jidosha Kabushiki Kaisha
- Naoya TAKE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20180204788
- Publication date Jul 19, 2018
- RENESAS ELECTRONICS CORPORATION
- Yuichiro IKEDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD CARRIER STRUCTURE AND PACKAGES FORMED THEREFROM WITHOUT DIE AT...
- Publication number 20180047588
- Publication date Feb 15, 2018
- EoPlex Limited
- Philip E ROGREN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD
- Publication number 20180014407
- Publication date Jan 11, 2018
- Shinko Electric Industries Co., Ltd.
- Junji SATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20170309551
- Publication date Oct 26, 2017
- RENESAS ELECTRONICS CORPORATION
- Yuichiro IKEDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
- Publication number 20160372441
- Publication date Dec 22, 2016
- Fujitsu Limited
- Hiroshi Kobayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING WIRE FOR SEMICONDUCTOR DEVICES
- Publication number 20160315063
- Publication date Oct 27, 2016
- NIPPON STEEL & SUMIKIN MATERIALS CO., LTD.
- Tomohiro UNO
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
ISOLATOR WITH REDUCED SUSCEPTIBILITY TO PARASITIC COUPLING
- Publication number 20160190918
- Publication date Jun 30, 2016
- Dominique Ho
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
CORROSION-RESISTANT COPPER BONDS TO ALUMINUM
- Publication number 20160181225
- Publication date Jun 23, 2016
- TEXAS INSTRUMENTS INCORPORATED
- Kejun Zeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BONDING DEVICE AND METHOD OF ELIMINATING DEFECTIVE BONDING WIRE
- Publication number 20160079198
- Publication date Mar 17, 2016
- Siliconware Precision Industries Co., Ltd.
- Wei-Sheng Lin
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Multiple bond via arrays of different wire heights on a same substrate
- Publication number 20160049390
- Publication date Feb 18, 2016
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
- Publication number 20150380342
- Publication date Dec 31, 2015
- RENESAS ELECTRONICS CORPORATION
- Tomoya KASHIWAZAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE
- Publication number 20150332990
- Publication date Nov 19, 2015
- Rohm Co., Ltd.
- Hirotoshi Usui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BONDING METHOD EMPLOYING TWO SCRUB SETTINGS
- Publication number 20150279810
- Publication date Oct 1, 2015
- Boh Kid Wong
- H01 - BASIC ELECTRIC ELEMENTS

Wire effects

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Methods of calibrating an ultrasonic characteristic on a wire bondi...

Semiconductor device package having multi-layer molding compound an...

Power semiconductor module with laser-welded leadframe

Integrated circuit (IC) device including a force mitigation system...

Scribe seals and methods of making

Integrated circuit (IC) device including a force mitigation system...

Wire bond clamp design and lead frame capable of engaging with same

Screening methodology to eliminate wire sweep in bond and assembly...

Face down dual sided chip scale memory package

Plastic-packaged semiconductor device having wires with polymerized...

Remapped packaged extracted die with 3D printed bond connections

Semiconductor device and method for manufacturing the same

3D printed hermetic package assembly and method

Wafer level chip scale semiconductor package

Wiring board

Semiconductor package with coated bonding wires and fabrication met...

Isolator with reduced susceptibility to parasitic coupling

Method and apparatus for printing integrated circuit bond connections

Semiconductor device including a first internal circuit, a second i...

Integrated circuit with printed bond connections

Bonding wire for semiconductor devices

Multiple bond via arrays of different wire heights on a same substrate

Corrosion-resistant copper bonds to aluminum

Chip rotated at an angle mounted on die pad region

Circuit substrate interconnect

Screening methodology to eliminate wire sweep in bond and assembly...

Multiple die in a face down package

Multi-chip package assembly with improved bond wire separation

Semiconductor chip and semiconductor package

Semiconductor device and a manufacturing method thereof

Patents Applicationslast 30 patents

METHODS OF CALIBRATING AN ULTRASONIC CHARACTERISTIC ON A WIRE BONDI...

SEMICONDUCTOR DEVICE

CIRCUIT SUBSTRATE HAVING IMPROVED BONDING STRUCTURE

WIRE BONDS FOR GALVANIC ISOLATION DEVICE

ELECTRONIC PACKAGE

SEMICONDUCTOR STACK STRUCTURE

INTEGRATED CIRCUIT HAVING A ROUTABLE LEADFRAME

METHODS OF DETERMINING A SEQUENCE FOR CREATING A PLURALITY OF WIRE...

METHODS OF CALIBRATING AN ULTRASONIC CHARACTERISTIC ON A WIRE BONDI...

Semiconductor Device Package Having Multi-Layer Molding Compound an...

Power Semiconductor Module with Laser-Welded Leadframe

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR CHIP

Integrated Circuit (IC) Device Including A Force Mitigation System...

INTEGRATED CIRCUIT (IC) DEVICE INCLUDING A FORCE MITIGATION SYSTEM...

WIRE BOND CLAMP DESIGN AND LEAD FRAME CAPABLE OF ENGAGING WITH SAME

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

LEAD CARRIER STRUCTURE AND PACKAGES FORMED THEREFROM WITHOUT DIE AT...

WIRING BOARD

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

BONDING WIRE FOR SEMICONDUCTOR DEVICES

ISOLATOR WITH REDUCED SUSCEPTIBILITY TO PARASITIC COUPLING

CORROSION-RESISTANT COPPER BONDS TO ALUMINUM

WIRE BONDING DEVICE AND METHOD OF ELIMINATING DEFECTIVE BONDING WIRE

Multiple bond via arrays of different wire heights on a same substrate

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

PACKAGE

WIRE BONDING METHOD EMPLOYING TWO SCRUB SETTINGS