Wire-like arrangements or pins or rods

Industry

CPC
H01L23/49

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/49Wire-like arrangements or pins or rods

Industries

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Lead frame for improving adhesive fillets on semiconductor die corners
- Patent number 12,170,240
- Issue date Dec 17, 2024
- STMicroelectronics, Inc.
- Rennier Rodriguez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out wafer level package structure
- Patent number 12,170,242
- Issue date Dec 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic substrate stacking
- Patent number 12,170,252
- Issue date Dec 17, 2024
- International Business Machines Corporation
- Lei Shan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming package structure
- Patent number 12,170,236
- Issue date Dec 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Hao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dielectric anchors for anchoring a conductive pillar
- Patent number 12,170,243
- Issue date Dec 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Lung Yuan Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal-free frame design for silicon bridges for semiconductor packages
- Patent number 12,170,253
- Issue date Dec 17, 2024
- Intel Corporation
- Dae-Woo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of fabricating the same
- Patent number 12,170,259
- Issue date Dec 17, 2024
- Samsung Electronics Co., Ltd.
- Ju Bin Seo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of manufacturing the same
- Patent number 12,170,260
- Issue date Dec 17, 2024
- JMJ KOREA CO., LTD.
- Yun Hwa Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages and methods of forming same
- Patent number 12,170,274
- Issue date Dec 17, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shin-Puu Jeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated high voltage electronic device with high relative permit...
- Patent number 12,170,164
- Issue date Dec 17, 2024
- Texas Instruments Incorporated
- Enis Tuncer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory system
- Patent number 12,169,644
- Issue date Dec 17, 2024
- Kioxia Corporation
- Manabu Matsumoto
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor apparatus with inspection terminals
- Patent number 12,171,061
- Issue date Dec 17, 2024
- Seiko Epson Corporation
- Kyosuke Shibata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and inspection method
- Patent number 12,169,216
- Issue date Dec 17, 2024
- Rohm Co., Ltd.
- Tsuyoshi Tachi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 12,170,237
- Issue date Dec 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wensen Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded metal insulator metal structure
- Patent number 12,170,241
- Issue date Dec 17, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Feng-Wei Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor component and method for producing a power semi...
- Patent number 12,165,950
- Issue date Dec 10, 2024
- Vitesco Technologies GmbH
- Christina Quest-Matt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,165,960
- Issue date Dec 10, 2024
- Rohm Co., Ltd.
- Hiroaki Matsubara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate, semiconductor device package and method of manufacturing...
- Patent number 12,165,963
- Issue date Dec 10, 2024
- Advanced Semiconductor Engineering, Inc.
- Cheng-Lin Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method of manufacturing the same
- Patent number 12,165,978
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shih-Ting Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and methods of manufacturing
- Patent number 12,165,980
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package using cavity substrate and manufacturing methods
- Patent number 12,165,986
- Issue date Dec 10, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Young Do Kweon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,165,991
- Issue date Dec 10, 2024
- Samsung Electronics Co., Ltd.
- Yeongkwon Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of manufacturing
- Patent number 12,166,025
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chang-Yi Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacture
- Patent number 12,165,941
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor light emitting device and method for manufacturing th...
- Patent number 12,166,162
- Issue date Dec 10, 2024
- Rohm Co., Ltd.
- Masahiko Kobayakawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molded silicon on passive package
- Patent number 12,165,956
- Issue date Dec 10, 2024
- Apple Inc.
- Kumar Nagarajan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,165,957
- Issue date Dec 10, 2024
- Rohm Co., Ltd.
- Minoru Akutsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure
- Patent number 12,165,961
- Issue date Dec 10, 2024
- Mediatek Inc.
- Hsing-Chih Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component carrier with embedded interposer laterally between electr...
- Patent number 12,165,964
- Issue date Dec 10, 2024
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Minwoo Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with electromagnetic interference shielding
- Patent number 12,165,989
- Issue date Dec 10, 2024
- Texas Instruments Incorporated
- Jie Chen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED CIRCUIT PACKAGE WITH ELECTRO-OPTICAL INTERCONNECT CIRCUITRY
- Publication number 20240418951
- Publication date Dec 19, 2024
- Intel Corporation
- Peng Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FULLY MOLDED STRUCTURE WITH MULTI-HEIGHT COMPONENTS COMPRISING BACK...
- Publication number 20240421017
- Publication date Dec 19, 2024
- Deca Technologies USA, Inc.
- Clifford Sandstrom
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE WITH REDISTRIBUTION LAYER PLATE FORMED VIA TEMPO...
- Publication number 20240421019
- Publication date Dec 19, 2024
- MICROCHIP TECHNOLOGY INCORPORATED
- Mankit Lam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240421022
- Publication date Dec 19, 2024
- ROHM CO., LTD.
- Hirokatsu UMEGAMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240421034
- Publication date Dec 19, 2024
- Samsung Electronics Co., LTD
- Byungho KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MANAGEMENT INTEGRATED CIRCUIT WITH BLEED CIRCUIT CONTROL
- Publication number 20240421699
- Publication date Dec 19, 2024
- Lodestar Licensing Group LLC
- Matthew David Rowley
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240421143
- Publication date Dec 19, 2024
- Samsung Electronics Co., Ltd.
- Dongjoo CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE ATTACH SURFACE COPPER LAYER WITH PROTECTIVE LAYER FOR MICROELEC...
- Publication number 20240421045
- Publication date Dec 19, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Christopher Daniel Manack
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR MODULE
- Publication number 20240421049
- Publication date Dec 19, 2024
- ROHM CO., LTD.
- Takeshi OKAMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-CHIP OR MULTI-CHIPLET FAN-OUT DEVICE FOR LAMINATE AND LEADFRA...
- Publication number 20240421051
- Publication date Dec 19, 2024
- Deca Technologies USA, Inc.
- Timothy L. OLSON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SMT PACKAGES AND SMT SUBSTRATES INCLUDED IN SMT PACKAGES
- Publication number 20240421057
- Publication date Dec 19, 2024
- Samsung Electronics Co., Ltd.
- Jinhyung Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240421058
- Publication date Dec 19, 2024
- Samsung Electronics Co., Ltd.
- Minkyu KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING SUBSTRATE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20240421093
- Publication date Dec 19, 2024
- Samsung Electronics Co., Ltd.
- Youngbae Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE UNIT, CHIP PACKAGE STACK MODULE, AND METHOD OF MANUFAC...
- Publication number 20240421137
- Publication date Dec 19, 2024
- Walton Advanced Engineering, Inc
- HONG-CHI YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH SELECTION STRUCTURE AND METHOD FOR FABRIC...
- Publication number 20240422906
- Publication date Dec 19, 2024
- NANYA TECHNOLOGY CORPORATION
- Hsih-Yang CHIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICE WITH VERTICAL VIA PIN
- Publication number 20240421042
- Publication date Dec 19, 2024
- Intel Corporation
- Jung Kyu Chae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240421046
- Publication date Dec 19, 2024
- Kabushiki Kaisha Toshiba
- Yoshiki ENDO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240421048
- Publication date Dec 19, 2024
- ROHM CO., LTD.
- Koki TANIZAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240421095
- Publication date Dec 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Hung Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240421103
- Publication date Dec 19, 2024
- Advanced Semiconductor Engineering, Inc.
- Chia Hsiu HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INKJET PRINTING DEDICATED TEST PINS
- Publication number 20240421105
- Publication date Dec 19, 2024
- QUALCOMM Incorporated
- Aniket PATIL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF ELECTRONIC PACKAGE AND ELECTRONIC PACKAGE
- Publication number 20240421124
- Publication date Dec 19, 2024
- VIA TECHNOLOGIES, INC.
- Wen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240421031
- Publication date Dec 19, 2024
- InnoLux Corporation
- Te-Hsun LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-CHIP OR MULTI-CHIPLET FAN-OUT DEVICE FOR LAMINATE AND LEADFRA...
- Publication number 20240421052
- Publication date Dec 19, 2024
- Deca Technologies USA, Inc.
- Timothy L. OLSON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240421056
- Publication date Dec 19, 2024
- Samsung Electronics Co., Ltd.
- Jae-Min Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20240421060
- Publication date Dec 19, 2024
- Innolux Corporation
- Kuo-Jung Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLUGGABLE INTERCONNECTS USING GLASS CORES OF INTEGRATED CIRCUIT PAC...
- Publication number 20240421062
- Publication date Dec 19, 2024
- Intel Corporation
- Tolga Acikalin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...
- Publication number 20240421127
- Publication date Dec 19, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Yi Seul Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240421132
- Publication date Dec 19, 2024
- DENSO CORPORATION
- Shingo TSUCHIMOCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP TESTING STRUCTURE AND CHIP TESTING METHOD
- Publication number 20240418771
- Publication date Dec 19, 2024
- HYGON INFORMATION TECHNOLOGY CO., LTD.
- Xiaodi Xue
- H01 - BASIC ELECTRIC ELEMENTS

Wire-like arrangements or pins or rods

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Lead frame for improving adhesive fillets on semiconductor die corners

Fan-out wafer level package structure

Electronic substrate stacking

Method for forming package structure

Dielectric anchors for anchoring a conductive pillar

Metal-free frame design for silicon bridges for semiconductor packages

Semiconductor package and method of fabricating the same

Semiconductor package and method of manufacturing the same

Semiconductor packages and methods of forming same

Integrated high voltage electronic device with high relative permit...

Memory system

Semiconductor apparatus with inspection terminals

Semiconductor device and inspection method

Semiconductor structure and manufacturing method thereof

Embedded metal insulator metal structure

Power semiconductor component and method for producing a power semi...

Semiconductor device

Substrate, semiconductor device package and method of manufacturing...

Package structure and method of manufacturing the same

Semiconductor package and methods of manufacturing

Semiconductor package using cavity substrate and manufacturing methods

Semiconductor package

Semiconductor devices and methods of manufacturing

Semiconductor device and method of manufacture

Semiconductor light emitting device and method for manufacturing th...

Molded silicon on passive package

Semiconductor device

Semiconductor package structure

Component carrier with embedded interposer laterally between electr...

Semiconductor package with electromagnetic interference shielding

Patents Applicationslast 30 patents

INTEGRATED CIRCUIT PACKAGE WITH ELECTRO-OPTICAL INTERCONNECT CIRCUITRY

FULLY MOLDED STRUCTURE WITH MULTI-HEIGHT COMPONENTS COMPRISING BACK...

ELECTRONIC PACKAGE WITH REDISTRIBUTION LAYER PLATE FORMED VIA TEMPO...

SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE

POWER MANAGEMENT INTEGRATED CIRCUIT WITH BLEED CIRCUIT CONTROL

SEMICONDUCTOR PACKAGE

DIE ATTACH SURFACE COPPER LAYER WITH PROTECTIVE LAYER FOR MICROELEC...

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR MODULE

MULTI-CHIP OR MULTI-CHIPLET FAN-OUT DEVICE FOR LAMINATE AND LEADFRA...

SMT PACKAGES AND SMT SUBSTRATES INCLUDED IN SMT PACKAGES

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

WIRING SUBSTRATE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

CHIP PACKAGE UNIT, CHIP PACKAGE STACK MODULE, AND METHOD OF MANUFAC...

SEMICONDUCTOR DEVICE WITH SELECTION STRUCTURE AND METHOD FOR FABRIC...

INTEGRATED CIRCUIT DEVICE WITH VERTICAL VIA PIN

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE PACKAGE AND METHOD FOR MANUFACTURING THE SAME

INKJET PRINTING DEDICATED TEST PINS

MANUFACTURING METHOD OF ELECTRONIC PACKAGE AND ELECTRONIC PACKAGE

ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF

MULTI-CHIP OR MULTI-CHIPLET FAN-OUT DEVICE FOR LAMINATE AND LEADFRA...

SEMICONDUCTOR PACKAGE

ELECTRONIC DEVICE

PLUGGABLE INTERCONNECTS USING GLASS CORES OF INTEGRATED CIRCUIT PAC...

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...

SEMICONDUCTOR DEVICE

CHIP TESTING STRUCTURE AND CHIP TESTING METHOD