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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

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H01L23/49Wire-like arrangements or pins or rods

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Dual die integrated circuit system in an integrated circuit package...
- Patent number 12,341,138
- Issue date Jun 24, 2025
- TDK-MICRONAS GMBH
- Paolo Marozzi
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor circuit structure with direct die heat removal structure
- Patent number 12,341,077
- Issue date Jun 24, 2025
- INVENTION AND COLLABORATION LABORATORY, INC.
- Chao-Chun Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring board and semiconductor device each having non-photosensitiv...
- Patent number 12,341,088
- Issue date Jun 24, 2025
- Shinko Electric Industries Co., Ltd.
- Hiroshi Taneda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging structure and power amplifier
- Patent number 12,341,480
- Issue date Jun 24, 2025
- Huawei Technologies Co., Ltd.
- Xiaomin Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip-on-film package, display panel, and display device
- Patent number 12,340,719
- Issue date Jun 24, 2025
- Samsung Display Co., Ltd.
- Hee-Kwon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device stack-up with bulk substrate material to mitig...
- Patent number 12,341,080
- Issue date Jun 24, 2025
- Intel Corporation
- Shrenik Kothari
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 12,341,081
- Issue date Jun 24, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chung-Jung Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and semiconductor device
- Patent number 12,341,087
- Issue date Jun 24, 2025
- Kioxia Corporation
- Takuya Okishima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through-substrate underfill formation for an integrated circuit ass...
- Patent number 12,341,121
- Issue date Jun 24, 2025
- Intel Corporation
- Eng Huat Goh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit device with through-electrode and electrode land...
- Patent number 12,341,084
- Issue date Jun 24, 2025
- Samsung Electronics Co., Ltd.
- Hojin Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device package substrate structure and method therefor
- Patent number 12,341,089
- Issue date Jun 24, 2025
- NXP USA, INC.
- Chee Seng Foong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Window ball grid array (WBGA) package and method for manufacturing...
- Patent number 12,341,090
- Issue date Jun 24, 2025
- NANYA TECHNOLOGY CORPORATION
- Wu-Der Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages having conductive patterns of redistribution...
- Patent number 12,341,091
- Issue date Jun 24, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chia-Kuei Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Compartmentalized shielding of a module utilizing self-shielded sub...
- Patent number 12,342,518
- Issue date Jun 24, 2025
- Qorvo US, Inc.
- Thomas Scott Morris
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrateless double-sided embedded multi-die interconnect bridge
- Patent number 12,341,129
- Issue date Jun 24, 2025
- Intel Corporation
- Biancun Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of semiconductor package
- Patent number 12,341,072
- Issue date Jun 24, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shih-Hao Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor circuit structure with direct die heat removal structure
- Patent number 12,341,076
- Issue date Jun 24, 2025
- INVENTION AND COLLABORATION LABORATORY, INC.
- Chao-Chun Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame
- Patent number 12,341,086
- Issue date Jun 24, 2025
- HAESUNG DS CO., LTD
- Dong Jin Yoon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bare-die smart bridge connected with copper pillars for system-in-p...
- Patent number 12,341,096
- Issue date Jun 24, 2025
- Intel Corporation
- Georg Seidemann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,341,105
- Issue date Jun 24, 2025
- Shinko Electric Industries Co., Ltd.
- Kenichi Koi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package structure, preparation method, and electronic device
- Patent number 12,341,116
- Issue date Jun 24, 2025
- Huawei Technologies Co., Ltd.
- Chaojun Deng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing thereof
- Patent number 12,341,107
- Issue date Jun 24, 2025
- Amkor Technology Singapore Holding Pte Ltd.
- Yi Seul Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatus for using structural elements to improve drop...
- Patent number 12,341,110
- Issue date Jun 24, 2025
- Micron Technology, Inc.
- Koustav Sinha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,341,122
- Issue date Jun 24, 2025
- Kabushiki Kaisha Toshiba
- Yoko Yamamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for multiple output integrated gate driver for...
- Patent number 12,341,454
- Issue date Jun 24, 2025
- BorgWarner US Technologies LLC
- Mark Wendell Gose
- B60 - VEHICLES IN GENERAL
Information Patent Grant
ESD structure for a display substrate edge
- Patent number 12,342,453
- Issue date Jun 24, 2025
- Innolux Corporation
- Chiu-Yuan Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High aspect ratio vias filled with liquid metal fill
- Patent number 12,336,112
- Issue date Jun 17, 2025
- Samtec, Inc.
- Christopher David Bohn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method
- Patent number 12,334,446
- Issue date Jun 17, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jiun Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including molding layer
- Patent number 12,334,454
- Issue date Jun 17, 2025
- Samsung Electronics Co., Ltd.
- Dongho Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with integrated capacitors
- Patent number 12,334,455
- Issue date Jun 17, 2025
- Chipletz, Inc.
- Michael Su
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
POWER MODULE WITH DETACHABLE FUNCTION
- Publication number 20250210421
- Publication date Jun 26, 2025
- Industrial Technology Research Institute
- Yu-Cheng LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING SUBSTRATE AND MANUFACTURING METHOD THEREOF
- Publication number 20250210422
- Publication date Jun 26, 2025
- ABSOLICS INC.
- Sungjin KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POLYMERIC DIE PAD FOR DIE ISOLATION IN CHIP ON LEAD PACKAGE
- Publication number 20250210470
- Publication date Jun 26, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Rongwei Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD FRAME AND SEMICONDUCTOR DEVICE
- Publication number 20250210473
- Publication date Jun 26, 2025
- Shinko Electric Industries Co., Ltd.
- Shintaro HAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGING STRUCTURE
- Publication number 20250210477
- Publication date Jun 26, 2025
- QUANZHOU SANAN INTEGRATED CIRCUIT CO., LTD.
- Kai CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND METHOD OF FORMING A CHIP PACKAGE
- Publication number 20250210478
- Publication date Jun 26, 2025
- INFINEON TECHNOLOGIES AG
- Chan Lam Cha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR INTERPOSER STRUCTURE
- Publication number 20250210480
- Publication date Jun 26, 2025
- NANYA TECHNOLOGY CORPORATION
- CHIN-LING HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE INCLUDING A PACKAGE SUBSTRATE AND METHODS OF FORM...
- Publication number 20250210484
- Publication date Jun 26, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Chia-Jen Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPOSITE SUBSTRATE AND MANUFACTURING METHOD OF THE SAME AND COMMUN...
- Publication number 20250210485
- Publication date Jun 26, 2025
- AUO Corporation
- Shih-Hsien Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20250210489
- Publication date Jun 26, 2025
- Innolux Corporation
- Ker-Yih Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE INCLUDING PACKAGE-SIDE CONDUCTIVE PATH
- Publication number 20250210496
- Publication date Jun 26, 2025
- Christopher Schaef
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250210502
- Publication date Jun 26, 2025
- Samsung Electronics Co., Ltd.
- Youngbae Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250210503
- Publication date Jun 26, 2025
- Kabushiki Kaisha Toshiba
- Fumiyoshi KAWASHIRO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR 3D INTEGRATION
- Publication number 20250210528
- Publication date Jun 26, 2025
- Meta Platforms Technologies, LLC
- Rajendra D Pendse
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING PATTERNS, PACKAGE, AND MANUFACTURING METHOD OF PA...
- Publication number 20250210564
- Publication date Jun 26, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Chun Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250210567
- Publication date Jun 26, 2025
- Samsung Electronics Co., Ltd.
- Kyungdon Mun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250210578
- Publication date Jun 26, 2025
- ROHM CO., LTD.
- Kenichi YOSHIMOCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DOUBLE-SIDED INTEGRATED CIRCUIT PACKAGE APPARATUS AND RELATED METHODS
- Publication number 20250208204
- Publication date Jun 26, 2025
- Intel Corporation
- Joshua Dean Freier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-LAYER LINE STRUCTURE
- Publication number 20250210524
- Publication date Jun 26, 2025
- DAI NIPPON PRINTING CO., LTD.
- Hiroshi Kudo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250210566
- Publication date Jun 26, 2025
- Samsung Electronics Co., Ltd.
- Sungmin MOON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME
- Publication number 20250210571
- Publication date Jun 26, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kai-Fang Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250210592
- Publication date Jun 26, 2025
- KIOXIA Corporation
- Yasuo TAKEMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED PACKAGE DEVICE WITH INTERCONNECTED SUBSTRATES
- Publication number 20250210593
- Publication date Jun 26, 2025
- Powertech Technology Inc.
- HUNG HSIN HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20250210433
- Publication date Jun 26, 2025
- Advanced Semiconductor Engineering, Inc.
- Fan-Yu MIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250210434
- Publication date Jun 26, 2025
- Samsung Electronics Co., Ltd.
- Sang Ho SHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPLANAR CONTROL FOR FILM-TYPE THERMAL INTERFACE
- Publication number 20250210455
- Publication date Jun 26, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Hsun Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP PACKAGING DEFECT FREE DIMPLE PROCESS AND DEVICE
- Publication number 20250210471
- Publication date Jun 26, 2025
- NXP B.V.
- Chanon SUWANKASAB
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR BATTERY CONNECTION IN MICROELECTRONIC PACKAGES
- Publication number 20250210479
- Publication date Jun 26, 2025
- NXP USA, Inc.
- Namrata Kanth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250210494
- Publication date Jun 26, 2025
- Samsung Electronics Co., Ltd.
- JUNWOO PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES WITH SELECTIVE METALLIZATION FOR GLASS C...
- Publication number 20250210495
- Publication date Jun 26, 2025
- Intel Corporation
- Jeremy Ecton
- H01 - BASIC ELECTRIC ELEMENTS

Wire-like arrangements or pins or rods

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Dual die integrated circuit system in an integrated circuit package...

Semiconductor circuit structure with direct die heat removal structure

Wiring board and semiconductor device each having non-photosensitiv...

Packaging structure and power amplifier

Chip-on-film package, display panel, and display device

Semiconductor device stack-up with bulk substrate material to mitig...

Semiconductor device and manufacturing method thereof

Semiconductor package and semiconductor device

Through-substrate underfill formation for an integrated circuit ass...

Integrated circuit device with through-electrode and electrode land...

Device package substrate structure and method therefor

Window ball grid array (WBGA) package and method for manufacturing...

Semiconductor packages having conductive patterns of redistribution...

Compartmentalized shielding of a module utilizing self-shielded sub...

Substrateless double-sided embedded multi-die interconnect bridge

Manufacturing method of semiconductor package

Semiconductor circuit structure with direct die heat removal structure

Lead frame

Bare-die smart bridge connected with copper pillars for system-in-p...

Semiconductor device

Chip package structure, preparation method, and electronic device

Semiconductor device and method of manufacturing thereof

Methods and apparatus for using structural elements to improve drop...

Semiconductor device

Systems and methods for multiple output integrated gate driver for...

ESD structure for a display substrate edge

High aspect ratio vias filled with liquid metal fill

Semiconductor package and method

Semiconductor package including molding layer

Semiconductor package with integrated capacitors

Patents Applicationslast 30 patents

POWER MODULE WITH DETACHABLE FUNCTION

PACKAGING SUBSTRATE AND MANUFACTURING METHOD THEREOF

POLYMERIC DIE PAD FOR DIE ISOLATION IN CHIP ON LEAD PACKAGE

LEAD FRAME AND SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGING STRUCTURE

CHIP PACKAGE AND METHOD OF FORMING A CHIP PACKAGE

SEMICONDUCTOR INTERPOSER STRUCTURE

PACKAGE STRUCTURE INCLUDING A PACKAGE SUBSTRATE AND METHODS OF FORM...

COMPOSITE SUBSTRATE AND MANUFACTURING METHOD OF THE SAME AND COMMUN...

PACKAGING DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DIE INCLUDING PACKAGE-SIDE CONDUCTIVE PATH

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE

SYSTEMS AND METHODS FOR 3D INTEGRATION

METHOD OF FORMING PATTERNS, PACKAGE, AND MANUFACTURING METHOD OF PA...

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE

DOUBLE-SIDED INTEGRATED CIRCUIT PACKAGE APPARATUS AND RELATED METHODS

MULTI-LAYER LINE STRUCTURE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME

SEMICONDUCTOR DEVICE

STACKED PACKAGE DEVICE WITH INTERCONNECTED SUBSTRATES

PACKAGE STRUCTURE

SEMICONDUCTOR PACKAGE

COPLANAR CONTROL FOR FILM-TYPE THERMAL INTERFACE

SEMICONDUCTOR CHIP PACKAGING DEFECT FREE DIMPLE PROCESS AND DEVICE

METHODS FOR BATTERY CONNECTION IN MICROELECTRONIC PACKAGES

SEMICONDUCTOR PACKAGE

MICROELECTRONIC ASSEMBLIES WITH SELECTIVE METALLIZATION FOR GLASS C...