with a graded temperature profile

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CPC
H01L2224/80204

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/80204with a graded temperature profile

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Modular construction of hybrid-bonded semiconductor die assemblies...
- Patent number 12,278,202
- Issue date Apr 15, 2025
- Micron Technology, Inc.
- Bharat Bhushan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid bonding with through substrate via (TSV)
- Patent number 11,658,172
- Issue date May 23, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid bonding and apparatus for performing the same
- Patent number 9,331,032
- Issue date May 3, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ping-Yin Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three dimensional integrated circuit structures and hybrid bonding...
- Patent number 8,809,123
- Issue date Aug 19, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ping-Yin Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming bonded semiconductor structures including interc...
- Patent number 8,728,863
- Issue date May 20, 2014
- Soitec
- Bich-Yen Nguyen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MODULAR CONSTRUCTION OF HYBRID-BONDED SEMICONDUCTOR DIE ASSEMBLIES...
- Publication number 20230395545
- Publication date Dec 7, 2023
- Micron Technology, Inc.
- Bharat Bhushan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE, AND METHOD OF MANUFACTURING THE SAME
- Publication number 20230141447
- Publication date May 11, 2023
- Samsung Electronics Co., Ltd.
- Wonil LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID BONDING WITH THROUGH SUBSTRATE VIA (TSV)
- Publication number 20200027868
- Publication date Jan 23, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jing-Cheng LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Hybrid Bonding and Apparatus for Performing the Same
- Publication number 20140256087
- Publication date Sep 11, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ping-Yin Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Three Dimensional Integrated Circuit Structures and Hybrid Bonding...
- Publication number 20130320556
- Publication date Dec 5, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ping-Yin Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING BONDED SEMICONDUCTOR STRUCTURES INCLUDING INTERC...
- Publication number 20130037959
- Publication date Feb 14, 2013
- S.O.I TEC SILICON ON INSULATOR TECHNOLOGIES
- Bich-Yen Nguyen
- H01 - BASIC ELECTRIC ELEMENTS

with a graded temperature profile

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Modular construction of hybrid-bonded semiconductor die assemblies...

Hybrid bonding with through substrate via (TSV)

Hybrid bonding and apparatus for performing the same

Three dimensional integrated circuit structures and hybrid bonding...

Methods of forming bonded semiconductor structures including interc...

Patents Applicationslast 30 patents

MODULAR CONSTRUCTION OF HYBRID-BONDED SEMICONDUCTOR DIE ASSEMBLIES...

SEMICONDUCTOR PACKAGE, AND METHOD OF MANUFACTURING THE SAME

HYBRID BONDING WITH THROUGH SUBSTRATE VIA (TSV)

Hybrid Bonding and Apparatus for Performing the Same

Three Dimensional Integrated Circuit Structures and Hybrid Bonding...

METHODS OF FORMING BONDED SEMICONDUCTOR STRUCTURES INCLUDING INTERC...