with a graded temperature profile

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H01L2224/83204

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/83204with a graded temperature profile

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Process and device for low-temperature pressure sintering
- Patent number 11,776,932
- Issue date Oct 3, 2023
- Danfoss Silicon Power GmbH
- Ronald Eisele
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Process and device for low-temperature pressure sintering
- Patent number 11,626,383
- Issue date Apr 11, 2023
- Danfoss Silicon Power GmbH
- Ronald Eisele
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Adhesive for semiconductor device, and high productivity method for...
- Patent number 11,608,455
- Issue date Mar 21, 2023
- SHOWA DENKO MATERIALS CO., LTD.
- Kazutaka Honda
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Multilayer electronics assembly and method for embedding electrical...
- Patent number 11,172,572
- Issue date Nov 9, 2021
- Crane Electronics, Inc.
- Ernest Clyde Parker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding material and bonding method using same
- Patent number 10,903,185
- Issue date Jan 26, 2021
- Dowa Electronics Materials Co., Ltd.
- Keiichi Endoh
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Bonding material and bonding method using same
- Patent number 10,821,558
- Issue date Nov 3, 2020
- Dowa Electronics Materials Co., Ltd.
- Keiichi Endoh
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Electronic element and electronic device comprising the same
- Patent number 10,825,787
- Issue date Nov 3, 2020
- Innolux Corporation
- Wei-Cheng Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Joint manufacturing method
- Patent number 10,821,543
- Issue date Nov 3, 2020
- Nitto Denko Corporation
- Nao Kamakura
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Method for manufacturing semiconductor device including heating and...
- Patent number 10,669,454
- Issue date Jun 2, 2020
- Hitachi Chemical Company, Ltd.
- Kazutaka Honda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
A-staged thermoplastic-polyimide (TPI) adhesive compound and method...
- Patent number 10,550,299
- Issue date Feb 4, 2020
- FRAIVILLIG TECHNOGIES COMPANY
- James B. Fraivillig
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
A-staged thermoplastic-polyimide (TPI) adhesive compound containing...
- Patent number 10,435,603
- Issue date Oct 8, 2019
- Fravillig Technologies Company
- James B. Fraivillig
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Method for manufacturing semiconductor apparatus, method for manufa...
- Patent number 10,416,557
- Issue date Sep 17, 2019
- Shin-Etsu Chemical Co., Ltd.
- Kyoko Soga
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Semiconductor chip mounted on a packaging substrate
- Patent number 10,418,340
- Issue date Sep 17, 2019
- Sony Corporation
- Makoto Murai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 10,249,604
- Issue date Apr 2, 2019
- Samsung Electronics Co., Ltd.
- Kunmo Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 10,211,194
- Issue date Feb 19, 2019
- Samsung Electronics Co., Ltd.
- Kunmo Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip mounting structure
- Patent number 10,141,278
- Issue date Nov 27, 2018
- International Business Machines Corporation
- Akihiro Horibe
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Mounted substrate, mounted-substrate production method, and mounted...
- Patent number 10,136,570
- Issue date Nov 20, 2018
- Sharp Kabushiki Kaisha
- Katsuhiro Yamaguchi
- G02 - OPTICS
Information Patent Grant
A-staged thermoplastic-polyimide (TPI) adhesive compound and method...
- Patent number 10,035,936
- Issue date Jul 31, 2018
- James B. Fraivillig
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Underfill material, laminated sheet and method for producing semico...
- Patent number 10,014,235
- Issue date Jul 3, 2018
- Nitto Denko Corporation
- Naohide Takamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Anisotropic conductive film including oblique region having lower c...
- Patent number 9,997,486
- Issue date Jun 12, 2018
- Dexerials Corporation
- Yasushi Akutsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Underfill material and method for manufacturing semiconductor devic...
- Patent number 9,957,411
- Issue date May 1, 2018
- Dexerials Corporation
- Takayuki Saito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip mounting structure
- Patent number 9,893,031
- Issue date Feb 13, 2018
- International Business Machines Corporation
- Akihiro Horibe
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer electronics assembly and method for embedding electrical...
- Patent number 9,888,568
- Issue date Feb 6, 2018
- Crane Electronics, Inc.
- Ernest Clyde Parker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Underfill material and method for manufacturing semiconductor devic...
- Patent number 9,840,645
- Issue date Dec 12, 2017
- Dexerials Corporation
- Taichi Koyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesive for mounting flip chip for use in a method for producing a...
- Patent number 9,748,195
- Issue date Aug 29, 2017
- Sekisui Chemical Co., Ltd.
- Sayaka Wakioka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resin composition, resin sheet, and production method for semicondu...
- Patent number 9,738,763
- Issue date Aug 22, 2017
- Toray Industries, Inc.
- Yoichi Shimba
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Method for making electronic device with cover layer with openings...
- Patent number 9,681,543
- Issue date Jun 13, 2017
- Harris Corporation
- Louis Joseph Rendek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Underfill material and method for manufacturing semiconductor devic...
- Patent number 9,653,371
- Issue date May 16, 2017
- Dexerials Corporation
- Hironobu Moriyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for a seal ring structure
- Patent number 9,650,243
- Issue date May 16, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ting-Ying Chen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Adhesive composition and adhesive film having same, substrate provi...
- Patent number 9,617,451
- Issue date Apr 11, 2017
- Toray Industries, Inc.
- Takuro Oda
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR USING A BUFFER SHEET
- Publication number 20230095879
- Publication date Mar 30, 2023
- Showa Denko Materials Co., Ltd.
- Yuta Koseki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC SYSTEM HAVING INTERMETALLIC CONNECTION STRUCTURE WITH CE...
- Publication number 20230027669
- Publication date Jan 26, 2023
- INFINEON TECHNOLOGIES AG
- Chee Yang NG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DICING DIE ATTACH FILM AND METHOD OF PRODUCING THE SAME, AND SEMICO...
- Publication number 20220367234
- Publication date Nov 17, 2022
- FURUKAWA ELECTRIC CO., LTD.
- Yota OTANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-LAYER SHEET FOR MOLD UNDERFILL ENCAPSULATION, METHOD FOR MOLD...
- Publication number 20220310546
- Publication date Sep 29, 2022
- NAGASE CHEMTEX CORPORATION
- Daisuke MORI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DICING DIE ATTACH FILM AND METHOD OF PRODUCING THE SAME, AND SEMICO...
- Publication number 20220310547
- Publication date Sep 29, 2022
- FURUKAWA ELECTRIC CO., LTD.
- Minoru MORITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESS AND DEVICE FOR LOW-TEMPERATURE PRESSURE SINTERING
- Publication number 20210104488
- Publication date Apr 8, 2021
- DANFOSS SILICON POWER GMBH
- Ronald Eisele
- B22 - CASTING POWDER METALLURGY
Information Patent Application
ADHESIVE FOR SEMICONDUCTOR, SEMICONDUCTOR DEVICE, AND METHOD FOR MA...
- Publication number 20200095481
- Publication date Mar 26, 2020
- Hitachi Chemical Company, Ltd.
- Kazutaka HONDA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
A-staged Thermoplastic-Polyimide (TPI) Adhesive Compound Containing...
- Publication number 20190048238
- Publication date Feb 14, 2019
- James B. Fraivillig
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
A-staged Thermoplastic-Polyimide (TPI) Adhesive Compound and Method...
- Publication number 20180346777
- Publication date Dec 6, 2018
- James B. Fraivillig
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
MULTILAYER ELECTRONICS ASSEMBLY AND METHOD FOR EMBEDDING ELECTRICAL...
- Publication number 20180146547
- Publication date May 24, 2018
- Crane Electronics, Inc.
- Ernest Clyde Parker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP MOUNTING STRUCTURE
- Publication number 20180076162
- Publication date Mar 15, 2018
- International Business Machines Corporation
- Akihiro HORIBE
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLEXIBLE MICROELECTRONIC ASSEMBLY AND METHOD
- Publication number 20150187681
- Publication date Jul 2, 2015
- Ravi V. Mahajan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and Apparatus for a Seal Ring Structure
- Publication number 20140217557
- Publication date Aug 7, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ting-Ying Chen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
INTERCONNECT ASSEMBLIES AND METHODS OF MAKING AND USING SAME
- Publication number 20140145328
- Publication date May 29, 2014
- Georgia Tech Research Corporation
- Rao Tummala
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING ELECTRONIC DEVICE AND ELECTRONIC DEVICE
- Publication number 20140084491
- Publication date Mar 27, 2014
- Tetsuya TAKAHASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Pre-Sintered Semiconductor Die Structure
- Publication number 20140061909
- Publication date Mar 6, 2014
- INFINEON TECHNOLOGIES AG
- Roland Speckels
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBMICRON CONNECTION LAYER AND METHOD FOR USING THE SAME TO CONNECT...
- Publication number 20140008801
- Publication date Jan 9, 2014
- Kuan-Neng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING MATERIAL AND BONDING BODY, AND BONDING METHOD
- Publication number 20130323529
- Publication date Dec 5, 2013
- DOWA ELECTRONICS MATERIALS CO., LTD.
- Satoru Kurita
- B32 - LAYERED PRODUCTS
Information Patent Application
PHOTOSENSITIVE ADHESIVE COMPOSITION, PHOTOSENSITIVE ADHESIVE FILM,...
- Publication number 20130105998
- Publication date May 2, 2013
- TORAY INDUSTRIES, INC.
- Kazuyuki Matsumura
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
BONDING PROCESS FOR SENSITIVE MICRO- AND NANO-SYSTEMS
- Publication number 20120321907
- Publication date Dec 20, 2012
- SENSONOR TECHNOLOGIES AS
- Nils Hoivik
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Electrical Component Having an Electrical Connection Arrangement an...
- Publication number 20120212918
- Publication date Aug 23, 2012
- MICRO SYSTEMS ENGINEERING GMBH
- Rainer Dohle
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADHESIVE COMPOSITION, ADHESIVE SHEET, CIRCUIT BOARD AND SEMICONDUCT...
- Publication number 20120129988
- Publication date May 24, 2012
- TORAY INDUSTRIES, INC.
- Koichi Fujimaru
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
HIGH MELTING POINT SOLDERING LAYER AND FABRICATION METHOD FOR THE S...
- Publication number 20120112201
- Publication date May 10, 2012
- Board of Trustees of the Univ. of Arkansas, acting for&on behalf of the Univ....
- Takukazu OTSUKA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor Structure
- Publication number 20110298124
- Publication date Dec 8, 2011
- CHIPMOS TECHNOLOGIES INC.
- Geng-Shin Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRIC COMPONENTS CONNECTING METHOD
- Publication number 20090229123
- Publication date Sep 17, 2009
- Matsushita Electric Industrial Co., Ltd.
- Tadahiko Sakai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC APPARATUS MANUFACTURING METHOD
- Publication number 20090170245
- Publication date Jul 2, 2009
- FUJITSU LIMITED
- Shuichi TAKEUCHI
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Flip chip mounting method and method for connecting substrates
- Publication number 20090126876
- Publication date May 21, 2009
- Matsushita Electric Industrial Co., Ltd.
- Seiji Karashima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLIP CHIP MOUNTING METHOD AND METHOD FOR CONNECTING SUBSTRATES
- Publication number 20090115071
- Publication date May 7, 2009
- Seiji Karashima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLIP CHIP MOUNTING METHOD AND BUMP FORMING METHOD
- Publication number 20090117688
- Publication date May 7, 2009
- Seiji Karashima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Flip chip mounting method and bump forming method
- Publication number 20080284046
- Publication date Nov 20, 2008
- Matsushita Electric Industrial Co., Ltd.
- Seiji Karashima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

with a graded temperature profile

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Process and device for low-temperature pressure sintering

Process and device for low-temperature pressure sintering

Adhesive for semiconductor device, and high productivity method for...

Multilayer electronics assembly and method for embedding electrical...

Bonding material and bonding method using same

Bonding material and bonding method using same

Electronic element and electronic device comprising the same

Joint manufacturing method

Method for manufacturing semiconductor device including heating and...

A-staged thermoplastic-polyimide (TPI) adhesive compound and method...

A-staged thermoplastic-polyimide (TPI) adhesive compound containing...

Method for manufacturing semiconductor apparatus, method for manufa...

Semiconductor chip mounted on a packaging substrate

Semiconductor device and method of manufacturing the same

Semiconductor device and method of manufacturing the same

Chip mounting structure

Mounted substrate, mounted-substrate production method, and mounted...

A-staged thermoplastic-polyimide (TPI) adhesive compound and method...

Underfill material, laminated sheet and method for producing semico...

Anisotropic conductive film including oblique region having lower c...

Underfill material and method for manufacturing semiconductor devic...

Chip mounting structure

Multilayer electronics assembly and method for embedding electrical...

Underfill material and method for manufacturing semiconductor devic...

Adhesive for mounting flip chip for use in a method for producing a...

Resin composition, resin sheet, and production method for semicondu...

Method for making electronic device with cover layer with openings...

Underfill material and method for manufacturing semiconductor devic...

Method and apparatus for a seal ring structure

Adhesive composition and adhesive film having same, substrate provi...

Patents Applicationslast 30 patents

METHOD FOR USING A BUFFER SHEET

ELECTRONIC SYSTEM HAVING INTERMETALLIC CONNECTION STRUCTURE WITH CE...

DICING DIE ATTACH FILM AND METHOD OF PRODUCING THE SAME, AND SEMICO...

MULTI-LAYER SHEET FOR MOLD UNDERFILL ENCAPSULATION, METHOD FOR MOLD...

DICING DIE ATTACH FILM AND METHOD OF PRODUCING THE SAME, AND SEMICO...

PROCESS AND DEVICE FOR LOW-TEMPERATURE PRESSURE SINTERING

ADHESIVE FOR SEMICONDUCTOR, SEMICONDUCTOR DEVICE, AND METHOD FOR MA...

A-staged Thermoplastic-Polyimide (TPI) Adhesive Compound Containing...

A-staged Thermoplastic-Polyimide (TPI) Adhesive Compound and Method...

MULTILAYER ELECTRONICS ASSEMBLY AND METHOD FOR EMBEDDING ELECTRICAL...

CHIP MOUNTING STRUCTURE

FLEXIBLE MICROELECTRONIC ASSEMBLY AND METHOD

Method and Apparatus for a Seal Ring Structure

INTERCONNECT ASSEMBLIES AND METHODS OF MAKING AND USING SAME

METHOD FOR MANUFACTURING ELECTRONIC DEVICE AND ELECTRONIC DEVICE

Pre-Sintered Semiconductor Die Structure

SUBMICRON CONNECTION LAYER AND METHOD FOR USING THE SAME TO CONNECT...

BONDING MATERIAL AND BONDING BODY, AND BONDING METHOD

PHOTOSENSITIVE ADHESIVE COMPOSITION, PHOTOSENSITIVE ADHESIVE FILM,...

BONDING PROCESS FOR SENSITIVE MICRO- AND NANO-SYSTEMS

Electrical Component Having an Electrical Connection Arrangement an...

ADHESIVE COMPOSITION, ADHESIVE SHEET, CIRCUIT BOARD AND SEMICONDUCT...

HIGH MELTING POINT SOLDERING LAYER AND FABRICATION METHOD FOR THE S...

Semiconductor Structure

ELECTRIC COMPONENTS CONNECTING METHOD

ELECTRONIC APPARATUS MANUFACTURING METHOD

Flip chip mounting method and method for connecting substrates

FLIP CHIP MOUNTING METHOD AND METHOD FOR CONNECTING SUBSTRATES

FLIP CHIP MOUNTING METHOD AND BUMP FORMING METHOD

Flip chip mounting method and bump forming method