with a graded temperature profile

Industry

CPC
H01L2224/83211

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/83211with a graded temperature profile

Industries

Patents Grantslast 30 patents

Information Patent Grant
Multilayer electronics assembly and method for embedding electrical...
- Patent number 11,172,572
- Issue date Nov 9, 2021
- Crane Electronics, Inc.
- Ernest Clyde Parker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
A-staged thermoplastic-polyimide (TPI) adhesive compound and method...
- Patent number 10,550,299
- Issue date Feb 4, 2020
- FRAIVILLIG TECHNOGIES COMPANY
- James B. Fraivillig
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
A-staged thermoplastic-polyimide (TPI) adhesive compound containing...
- Patent number 10,435,603
- Issue date Oct 8, 2019
- Fravillig Technologies Company
- James B. Fraivillig
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Die bonding to a board
- Patent number 10,115,716
- Issue date Oct 30, 2018
- Semiconductor Components Industries, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,103,091
- Issue date Oct 16, 2018
- Toyota Jidosha Kabushiki Kaisha
- Satoshi Takahagi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
A-staged thermoplastic-polyimide (TPI) adhesive compound and method...
- Patent number 10,035,936
- Issue date Jul 31, 2018
- James B. Fraivillig
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor device, heat insulating load...
- Patent number 10,020,282
- Issue date Jul 10, 2018
- Nissan Motor Co., Ltd.
- Satoshi Tanimoto
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder paste, joining method using the same and joined structure
- Patent number 10,010,980
- Issue date Jul 3, 2018
- MURATA MANUFACTURING CO., LTD.
- Kosuke Nakano
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer electronics assembly and method for embedding electrical...
- Patent number 9,888,568
- Issue date Feb 6, 2018
- Crane Electronics, Inc.
- Ernest Clyde Parker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of stacking a plurality of dies to form a stacked semiconduc...
- Patent number 9,290,377
- Issue date Mar 22, 2016
- STMicroelectronics (Malta) Ltd.
- Conrad Cachia
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Solder paste, joining method using the same and joined structure
- Patent number 9,044,816
- Issue date Jun 2, 2015
- MURATA MANUFACTURING CO., LTD.
- Kosuke Nakano
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High melting point soldering layer alloyed by transient liquid phas...
- Patent number 8,592,986
- Issue date Nov 26, 2013
- Rohm Co., Ltd.
- Takukazu Otsuka
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Metallic thermal joint for high power density chips
- Patent number 8,368,205
- Issue date Feb 5, 2013
- Oracle America, Inc.
- Seshasayee Ankireddi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pressurized underfill cure
- Patent number 8,008,122
- Issue date Aug 30, 2011
- International Business Machines Corporation
- Michael A. Gaynes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High-temperature solder, high-temperature solder paste and power se...
- Patent number 7,879,455
- Issue date Feb 1, 2011
- Hitachi, Ltd.
- Ryoichi Kajiwara
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flip chip mounting method and bump forming method
- Patent number 7,638,883
- Issue date Dec 29, 2009
- Panasonic Corporation
- Seiji Karashima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flip chip mounting method and bump forming method
- Patent number 7,531,387
- Issue date May 12, 2009
- Panasonic Corporation
- Seiji Karashima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Fluxless bonding of microelectronic chips
- Patent number 4,645,116
- Issue date Feb 24, 1987
- AT&T Bell Laboratories
- Gerard E. Henein
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
A-staged Thermoplastic-Polyimide (TPI) Adhesive Compound Containing...
- Publication number 20190048238
- Publication date Feb 14, 2019
- James B. Fraivillig
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
DIE BONDING TO A BOARD
- Publication number 20190013308
- Publication date Jan 10, 2019
- Semiconductor Components Industries, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
A-staged Thermoplastic-Polyimide (TPI) Adhesive Compound and Method...
- Publication number 20180346777
- Publication date Dec 6, 2018
- James B. Fraivillig
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
MULTILAYER ELECTRONICS ASSEMBLY AND METHOD FOR EMBEDDING ELECTRICAL...
- Publication number 20180146547
- Publication date May 24, 2018
- Crane Electronics, Inc.
- Ernest Clyde Parker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods And Apparatuses For High Temperature Bonding Controlled Pro...
- Publication number 20170129031
- Publication date May 11, 2017
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Hannes Martin Hinrich Greve
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
METALLIC THERMAL JOINT FOR HIGH POWER DENSITY CHIPS
- Publication number 20120153453
- Publication date Jun 21, 2012
- ORACLE AMERICA, INC.
- Seshasayee Ankireddi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Solder Paste, Joining Method Using the Same and Joined Structure
- Publication number 20120156512
- Publication date Jun 21, 2012
- Murata Manufacturing Co., Ltd.
- Kosuke Nakano
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
HIGH MELTING POINT SOLDERING LAYER AND FABRICATION METHOD FOR THE S...
- Publication number 20120112201
- Publication date May 10, 2012
- Board of Trustees of the Univ. of Arkansas, acting for&on behalf of the Univ....
- Takukazu OTSUKA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLIP CHIP MOUNTING METHOD AND BUMP FORMING METHOD
- Publication number 20090117688
- Publication date May 7, 2009
- Seiji Karashima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Flip chip mounting method and bump forming method
- Publication number 20080284046
- Publication date Nov 20, 2008
- Matsushita Electric Industrial Co., Ltd.
- Seiji Karashima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
High-temperature solder, high-temperature solder paste and power se...
- Publication number 20070125449
- Publication date Jun 7, 2007
- Ryoichi Kajiwara
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

with a graded temperature profile

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Multilayer electronics assembly and method for embedding electrical...

A-staged thermoplastic-polyimide (TPI) adhesive compound and method...

A-staged thermoplastic-polyimide (TPI) adhesive compound containing...

Die bonding to a board

Semiconductor device

A-staged thermoplastic-polyimide (TPI) adhesive compound and method...

Method for manufacturing semiconductor device, heat insulating load...

Solder paste, joining method using the same and joined structure

Multilayer electronics assembly and method for embedding electrical...

Method of stacking a plurality of dies to form a stacked semiconduc...

Solder paste, joining method using the same and joined structure

High melting point soldering layer alloyed by transient liquid phas...

Metallic thermal joint for high power density chips

Pressurized underfill cure

High-temperature solder, high-temperature solder paste and power se...

Flip chip mounting method and bump forming method

Flip chip mounting method and bump forming method

Fluxless bonding of microelectronic chips

Patents Applicationslast 30 patents

A-staged Thermoplastic-Polyimide (TPI) Adhesive Compound Containing...

DIE BONDING TO A BOARD

A-staged Thermoplastic-Polyimide (TPI) Adhesive Compound and Method...

MULTILAYER ELECTRONICS ASSEMBLY AND METHOD FOR EMBEDDING ELECTRICAL...

Methods And Apparatuses For High Temperature Bonding Controlled Pro...

METALLIC THERMAL JOINT FOR HIGH POWER DENSITY CHIPS

Solder Paste, Joining Method Using the Same and Joined Structure

HIGH MELTING POINT SOLDERING LAYER AND FABRICATION METHOD FOR THE S...

FLIP CHIP MOUNTING METHOD AND BUMP FORMING METHOD

Flip chip mounting method and bump forming method

High-temperature solder, high-temperature solder paste and power se...