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H01L2224/35847

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/35847with a mechanical process

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Patents Grantslast 30 patents

Information Patent Grant
Power module and method of manufacturing power module
- Patent number 9,673,118
- Issue date Jun 6, 2017
- Mitsubishi Electric Corporation
- Masaki Taya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module
- Patent number 9,633,967
- Issue date Apr 25, 2017
- NSK Ltd.
- Takashi Sunaga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module
- Patent number 9,609,775
- Issue date Mar 28, 2017
- NSK Ltd.
- Takashi Sunaga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module package and method of manufacturing the same
- Patent number 9,524,929
- Issue date Dec 20, 2016
- Samsung Electro-Mechanics Co., Ltd.
- Kwang Soo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module
- Patent number 9,402,311
- Issue date Jul 26, 2016
- NSK Ltd.
- Takashi Sunaga
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor module and method for manufacturing the same
- Patent number 9,312,234
- Issue date Apr 12, 2016
- NSK Ltd.
- Takashi Sunaga
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME
- Publication number 20210313294
- Publication date Oct 7, 2021
- Chau Fatt Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FOLDABLE LAYERED CONNECTION, AND METHOD FOR MANUFACTURING A FOLDABL...
- Publication number 20210272922
- Publication date Sep 2, 2021
- INL-International Iberian Nanotechnology Laboratory
- Rosana Maria ALVES DIAS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL CONNECTION MEMBER, ELECTRICAL CONNECTION STRUCTURE, AND...
- Publication number 20210257327
- Publication date Aug 19, 2021
- Hitachi Metals, Ltd.
- Junya NISHINA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR