TREA

with a principal constituent of the bonding area being a liquid not provided for in groups H01L2224/487 - H01L2224/4879

Follow

Industry

  • CPC
  • H01L2224/48794
This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/48794with a principal constituent of the bonding area being a liquid not provided for in groups H01L2224/487 - H01L2224/4879
Industries

Patents Grantslast 30 patents

Patents Applicationslast 30 patents