with a principal constituent of the bonding area being a metal or a metalloid

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H01L2224/488

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/488with a principal constituent of the bonding area being a metal or a metalloid

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Method for predicting reliability of semiconductor device
- Patent number 12,152,997
- Issue date Nov 26, 2024
- Renesas Electronics Corporation
- Takuo Funaya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with nickel-silver pre-plated leadframe
- Patent number 12,154,845
- Issue date Nov 26, 2024
- Texas Instruments Incorporated
- Nazila Dadvand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power amplifier modules including semiconductor resistor and tantal...
- Patent number 12,143,077
- Issue date Nov 12, 2024
- Skyworks Solutions, Inc.
- Peter J. Zampardi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for preparing semiconductor device with wire bond
- Patent number 12,113,046
- Issue date Oct 8, 2024
- NANYA TECHNOLOGY CORPORATION
- Wei-Zhong Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and inspection device
- Patent number 12,040,303
- Issue date Jul 16, 2024
- Kabushiki Kaisha Toshiba
- Mitsuaki Kato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Radio frequency transmission line with finish plating on conductive...
- Patent number 11,984,423
- Issue date May 14, 2024
- Skyworks Solutions, Inc.
- Sandra Louise Petty-Weeks
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for preparing semiconductor device with wire bond
- Patent number 11,876,072
- Issue date Jan 16, 2024
- NANYA TECHNOLOGY CORPORATION
- Wei-Zhong Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Palladium-coated copper bonding wire, wire bonding structure, semic...
- Patent number 11,876,066
- Issue date Jan 16, 2024
- TANAKA DENSHI KOGYO K.K.
- Hiroyuki Amano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with nickel-silver pre-plated leadframe
- Patent number 11,848,258
- Issue date Dec 19, 2023
- Texas Instruments Incorporated
- Nazila Dadvand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor chip, method for producing a power semiconducto...
- Patent number 11,664,335
- Issue date May 30, 2023
- Semikron Elektronik GmbH & Co., KG
- Wolfgang-Michael Schulz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power amplifier systems with control interface and bias circuit
- Patent number 11,451,199
- Issue date Sep 20, 2022
- Skyworks Solutions, Inc.
- David Steven Ripley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming an aluminum oxide layer, metal surface with alumi...
- Patent number 11,424,201
- Issue date Aug 23, 2022
- Infineon Technologies AG
- Michael Rogalli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, electronic component and method
- Patent number 11,380,612
- Issue date Jul 5, 2022
- Infineon Technologies Austria AG
- Matthias Stecher
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 11,270,971
- Issue date Mar 8, 2022
- Renesas Electronics Corporation
- Kenji Ikura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bonding tool including a wedge tool
- Patent number 11,121,114
- Issue date Sep 14, 2021
- Fuji Electric Co., Ltd.
- Takanori Sugiyama
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrated circuit, and motor device including the same
- Patent number 10,991,642
- Issue date Apr 27, 2021
- JOHNSON ELECTRIC INTERNATIONAL AG
- Chiping Sun
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Radio frequency transmission line
- Patent number 10,937,759
- Issue date Mar 2, 2021
- Skyworks Solutions, Inc.
- Sandra Louise Petty-Weeks
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device
- Patent number 10,903,129
- Issue date Jan 26, 2021
- Rohm Co., Ltd.
- Motoharu Haga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods for forming a semiconductor device
- Patent number 10,867,893
- Issue date Dec 15, 2020
- Infineon Technologies AG
- Sergey Ananiev
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laser ablation for wire bonding on organic solderability preservati...
- Patent number 10,833,043
- Issue date Nov 10, 2020
- Vitesco Technologies USA, LLC.
- Jared Yagoda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor integrated circuit device
- Patent number 10,818,620
- Issue date Oct 27, 2020
- Renesas Electronics Corporation
- Hiromi Shigihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power amplifier modules including transistor with grading and semic...
- Patent number 10,771,024
- Issue date Sep 8, 2020
- Skyworks Solutions, Inc.
- Peter J. Zampardi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,770,375
- Issue date Sep 8, 2020
- Renesas Electronics Corporation
- Jun Shibata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for improved delamination characteristics in a...
- Patent number 10,763,130
- Issue date Sep 1, 2020
- Microchip Technology Incorporated
- Taweesak Laevohan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding wire for semiconductor device
- Patent number 10,737,356
- Issue date Aug 11, 2020
- Nippon Micrometal Corporation
- Takashi Yamada
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed adhesion deposition to mitigate integrated circuit package...
- Patent number 10,727,085
- Issue date Jul 28, 2020
- Texas Instruments Incorporated
- Yong Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor device that includes a copper layer disposed on...
- Patent number 10,643,967
- Issue date May 5, 2020
- Mitsubishi Electric Corporation
- Hiroaki Okabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device for preventing crack in pad region and fabrica...
- Patent number 10,636,703
- Issue date Apr 28, 2020
- MagnaChip Semiconductor, Ltd.
- Jong-yeul Jeong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding wire for semiconductor device
- Patent number 10,610,976
- Issue date Apr 7, 2020
- Nippon Micrometal Corporation
- Takashi Yamada
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 10,586,777
- Issue date Mar 10, 2020
- Renesas Electronics Corporation
- Kentaro Yamada
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE WITH NICKEL-SILVER PRE-PLATED LEADFRAME
- Publication number 20240153853
- Publication date May 9, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Nazila Dadvand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PREPARING SEMICONDUCTOR DEVICE WITH WIRE BOND
- Publication number 20240063175
- Publication date Feb 22, 2024
- NANYA TECHNOLOGY CORPORATION
- WEI-ZHONG LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR PACKAGING
- Publication number 20230110402
- Publication date Apr 13, 2023
- NXP USA, Inc.
- YOU GE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PREPARING SEMICONDUCTOR DEVICE WITH WIRE BOND
- Publication number 20230061312
- Publication date Mar 2, 2023
- NANYA TECHNOLOGY CORPORATION
- WEI-ZHONG LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PREDICTING RELIABILITY OF SEMICONDUCTOR DEVICE
- Publication number 20220260504
- Publication date Aug 18, 2022
- RENESAS ELECTRONICS CORPORATION
- Takuo FUNAYA
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR PACKAGE WITH NICKEL-SILVER PRE-PLATED LEADFRAME
- Publication number 20220208665
- Publication date Jun 30, 2022
- TEXAS INSTRUMENTS INCORPORATED
- Nazila Dadvand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PALLADIUM-COATED COPPER BONDING WIRE, WIRE BONDING STRUCTURE, SEMIC...
- Publication number 20210366867
- Publication date Nov 25, 2021
- TANAKA DENSHI KOGYO K.K.
- Hiroyuki AMANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND INSPECTION DEVICE
- Publication number 20210296279
- Publication date Sep 23, 2021
- Kabushiki Kaisha Toshiba
- Mitsuaki KATO
- G01 - MEASURING TESTING
Information Patent Application
INTEGRATED CIRCUIT, AND MOTOR DEVICE INCLUDING THE SAME
- Publication number 20210210417
- Publication date Jul 8, 2021
- Johnson Electric International AG
- Chiping SUN
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
RADIO FREQUENCY TRANSMISSION LINE WITH FINISH PLATING ON CONDUCTIVE...
- Publication number 20210159209
- Publication date May 27, 2021
- Skyworks Solutions, Inc.
- Sandra Louise Petty-Weeks
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20200135687
- Publication date Apr 30, 2020
- RENESAS ELECTRONICS CORPORATION
- Kenji IKURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20190259687
- Publication date Aug 22, 2019
- RENESAS ELECTRONICS CORPORATION
- Jun SHIBATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT, AND MOTOR DEVICE INCLUDING THE SAME
- Publication number 20190244880
- Publication date Aug 8, 2019
- Johnson Electric International AG
- Chiping SUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LASER ABLATION FOR WIRE BONDING ON ORGANIC SOLDERABILITY PRESERVATI...
- Publication number 20190198475
- Publication date Jun 27, 2019
- CONTINENTAL AUTOMOTIVE SYSTEMS, INC.
- Jared Yagoda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME
- Publication number 20190172812
- Publication date Jun 6, 2019
- MITSUBISHI ELECTRIC CORPORATION
- Hiroaki OKABE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package-On-Package (PoP) Structure Including Stud Bulbs
- Publication number 20190123027
- Publication date Apr 25, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WEDGE TOOL AND WEDGE BONDING METHOD
- Publication number 20190088616
- Publication date Mar 21, 2019
- Fuji Electric Co., Ltd.
- Takanori SUGIYAMA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRE BOND CONNECTION WITH INTERMEDIATE CONTACT STRUCTURE
- Publication number 20190051627
- Publication date Feb 14, 2019
- Intel Corporation
- Yong SHE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20180308812
- Publication date Oct 25, 2018
- Toyota Jidosha Kabushiki Kaisha
- Naoya TAKE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADDING CAP TO COPPER PASSIVATION FLOW FOR ELECTROLESS PLATING
- Publication number 20180308816
- Publication date Oct 25, 2018
- TEXAS INSTRUMENTS INCORPORATED
- Pragnesh R. Vaghela
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Systems And Methods For Improved Delamination Characteristics In A...
- Publication number 20180308713
- Publication date Oct 25, 2018
- MICROCHIP TECHNOLOGY INCORPORATED
- Taweesak Laevohan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SUBSTRATE, METHOD FOR FABRICATING THE SAME, AND PACKAGE DEV...
- Publication number 20180211909
- Publication date Jul 26, 2018
- Samsung Electronics Co., Ltd.
- Soojae PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20180211930
- Publication date Jul 26, 2018
- Toyota Jidosha Kabushiki Kaisha
- Naoya TAKE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20180182731
- Publication date Jun 28, 2018
- RENESAS ELECTRONICS CORPORATION
- Yuko MATSUBARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING WIRE FOR SEMICONDUCTOR DEVICE
- Publication number 20180122765
- Publication date May 3, 2018
- NIPPON MICROMETAL CORPORATION
- Daizo ODA
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20180108629
- Publication date Apr 19, 2018
- RENESAS ELECTRONICS CORPORATION
- Kentaro YAMADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP ARRANGEMENT AND METHOD FOR FORMING A CONTACT CONNECTION
- Publication number 20180047697
- Publication date Feb 15, 2018
- Pac Tech - Packaging Technologies GmbH
- Heinrich Lüdeke
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package-On-Package (PoP) Structure Including Stud Bulbs
- Publication number 20180047709
- Publication date Feb 15, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20180047698
- Publication date Feb 15, 2018
- Rohm Co., Ltd.
- Mamoru YAMAGAMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20180005981
- Publication date Jan 4, 2018
- Rohm Co., Ltd.
- Motoharu HAGA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

with a principal constituent of the bonding area being a metal or a metalloid

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method for predicting reliability of semiconductor device

Semiconductor package with nickel-silver pre-plated leadframe

Power amplifier modules including semiconductor resistor and tantal...

Method for preparing semiconductor device with wire bond

Semiconductor device and inspection device

Radio frequency transmission line with finish plating on conductive...

Method for preparing semiconductor device with wire bond

Palladium-coated copper bonding wire, wire bonding structure, semic...

Semiconductor package with nickel-silver pre-plated leadframe

Power semiconductor chip, method for producing a power semiconducto...

Power amplifier systems with control interface and bias circuit

Method of forming an aluminum oxide layer, metal surface with alumi...

Semiconductor device, electronic component and method

Semiconductor device and method of manufacturing the same

Wire bonding tool including a wedge tool

Integrated circuit, and motor device including the same

Radio frequency transmission line

Electronic device

Semiconductor devices and methods for forming a semiconductor device

Laser ablation for wire bonding on organic solderability preservati...

Semiconductor integrated circuit device

Power amplifier modules including transistor with grading and semic...

Semiconductor device

Systems and methods for improved delamination characteristics in a...

Bonding wire for semiconductor device

Printed adhesion deposition to mitigate integrated circuit package...

Power semiconductor device that includes a copper layer disposed on...

Semiconductor device for preventing crack in pad region and fabrica...

Bonding wire for semiconductor device

Semiconductor device and method of manufacturing the same

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE WITH NICKEL-SILVER PRE-PLATED LEADFRAME

METHOD FOR PREPARING SEMICONDUCTOR DEVICE WITH WIRE BOND

SEMICONDUCTOR DEVICE AND METHOD FOR PACKAGING

METHOD FOR PREPARING SEMICONDUCTOR DEVICE WITH WIRE BOND

METHOD FOR PREDICTING RELIABILITY OF SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE WITH NICKEL-SILVER PRE-PLATED LEADFRAME

PALLADIUM-COATED COPPER BONDING WIRE, WIRE BONDING STRUCTURE, SEMIC...

SEMICONDUCTOR DEVICE AND INSPECTION DEVICE

INTEGRATED CIRCUIT, AND MOTOR DEVICE INCLUDING THE SAME

RADIO FREQUENCY TRANSMISSION LINE WITH FINISH PLATING ON CONDUCTIVE...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE

INTEGRATED CIRCUIT, AND MOTOR DEVICE INCLUDING THE SAME

LASER ABLATION FOR WIRE BONDING ON ORGANIC SOLDERABILITY PRESERVATI...

POWER SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME

Package-On-Package (PoP) Structure Including Stud Bulbs

WEDGE TOOL AND WEDGE BONDING METHOD

WIRE BOND CONNECTION WITH INTERMEDIATE CONTACT STRUCTURE

SEMICONDUCTOR DEVICE

ADDING CAP TO COPPER PASSIVATION FLOW FOR ELECTROLESS PLATING

Systems And Methods For Improved Delamination Characteristics In A...

PACKAGE SUBSTRATE, METHOD FOR FABRICATING THE SAME, AND PACKAGE DEV...

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

BONDING WIRE FOR SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

CHIP ARRANGEMENT AND METHOD FOR FORMING A CONTACT CONNECTION

Package-On-Package (PoP) Structure Including Stud Bulbs

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE