Membership
Tour
Register
Log in
with a principal constituent of the bonding area being a non metallic, non metalloid inorganic material
Follow
Industry
CPC
H01L2224/48786
This industry / category may be too specific. Please go to a parent level for more data
Parent Industries
H
ELECTRICITY
H01
Electric elements
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L2224/00
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
Current Industry
H01L2224/48786
with a principal constituent of the bonding area being a non metallic, non metalloid inorganic material
Industries
Overview
Organizations
People
Information
Impact
No activities in the last 12 months
CPC
H01L2224/48786
