with a principal constituent of the bonding area being a polymer

Industry

CPC
H01L2224/4869

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/4869with a principal constituent of the bonding area being a polymer

Industries

Patents Grantslast 30 patents

Information Patent Grant
Impedance controlled electrical interconnection employing meta-mate...
- Patent number 12,027,465
- Issue date Jul 2, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Christopher Wyland
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,476,183
- Issue date Oct 18, 2022
- Mitsubishi Electric Corporation
- Motoki Imanishi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Impedance controlled electrical interconnection employing meta-mate...
- Patent number 11,456,255
- Issue date Sep 27, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Christopher Wyland
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with terminal pattern for increased channel d...
- Patent number 11,211,315
- Issue date Dec 28, 2021
- Texas Instruments Incorporated
- Casey Thomas Morrison
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged semiconductor assemblies and methods for manufacturing suc...
- Patent number 10,622,308
- Issue date Apr 14, 2020
- Micron Technology, Inc.
- Suan Jeung Boon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package (PoP) structure including stud bulbs
- Patent number 10,510,731
- Issue date Dec 17, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Impedance controlled electrical interconnection employing meta-mate...
- Patent number 10,483,209
- Issue date Nov 19, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Christopher Wyland
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package (PoP) structure including stud bulbs
- Patent number 10,157,893
- Issue date Dec 18, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged semiconductor device
- Patent number 10,122,358
- Issue date Nov 6, 2018
- Mitsubishi Electric Corporation
- Takuya Shiraishi
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Semiconductor device
- Patent number 10,068,823
- Issue date Sep 4, 2018
- Rohm Co., Ltd.
- Hiroshi Okumura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heavy-wire bond arrangement and method for producing same
- Patent number 9,992,861
- Issue date Jun 5, 2018
- Technische Universitat Berlin
- Andreas Middendorf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a sealant layer including carbon direct...
- Patent number 9,953,952
- Issue date Apr 24, 2018
- Infineon Technologies AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged semiconductor assemblies and methods for manufacturing suc...
- Patent number 9,911,696
- Issue date Mar 6, 2018
- Micron Technology, Inc.
- Suan Jeung Boon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package on-package (PoP) structure including stud bulbs
- Patent number 9,812,427
- Issue date Nov 7, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit with inductive bond wires
- Patent number 9,646,947
- Issue date May 9, 2017
- Lenovo Enterprise Solutions (Singapore) Pte. Ltd.
- Justin P. Bandholz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Glass/ceramic replacement of epoxy for high temperature hermeticall...
- Patent number 9,601,400
- Issue date Mar 21, 2017
- Semtech Corporation
- Victor Hugo Cruz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 9,508,672
- Issue date Nov 29, 2016
- Rohm Co., Ltd.
- Hiroshi Okumura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package on-Package (PoP) structure including stud bulbs and method
- Patent number 9,502,394
- Issue date Nov 22, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 9,490,224
- Issue date Nov 8, 2016
- SII SEMICONDUCTOR CORPORATION
- Noriyuki Kimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire loops, methods of forming wire loops, and related processes
- Patent number 9,455,544
- Issue date Sep 27, 2016
- Kulicke and Soffa Industries, Inc.
- Gary S. Gillotti
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Chip package and method for forming the same
- Patent number 9,437,478
- Issue date Sep 6, 2016
- Xintec Inc.
- Yen-Shih Ho
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Chip package
- Patent number 9,425,134
- Issue date Aug 23, 2016
- Xintec Inc.
- Yen-Shih Ho
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor device
- Patent number 9,401,284
- Issue date Jul 26, 2016
- Sumitomo Electric Device Innovations, Inc.
- Hiroshi Kawakubo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 9,401,319
- Issue date Jul 26, 2016
- Mitsubishi Electric Corporation
- Takuya Oga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bonding structure of semiconductor device and wire bonding method
- Patent number 9,379,085
- Issue date Jun 28, 2016
- Rohm Co., Ltd.
- Ryuji Tsubaki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit device
- Patent number 9,362,205
- Issue date Jun 7, 2016
- Semiconductor Components Industries, LLC
- Takashi Shibasaki
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Circuit device
- Patent number 9,363,894
- Issue date Jun 7, 2016
- Semiconductor Components Industries, LLC
- Takashi Shibasaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Chip package and method for forming the same
- Patent number 9,355,975
- Issue date May 31, 2016
- Xintec Inc.
- Yen-Shih Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding structure of bonding wire
- Patent number 9,331,049
- Issue date May 3, 2016
- Nippon Steel & Sumikin Materials Co., Ltd.
- Tomohiro Uno
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Electronic component and method for producing same
- Patent number 9,299,653
- Issue date Mar 29, 2016
- TDK Corporation
- Minoru Satoh
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Impedance Controlled Electrical Interconnection Employing Meta-Mate...
- Publication number 20230020310
- Publication date Jan 19, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Christopher Wyland
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRENGTHENED WIRE-BOND
- Publication number 20220020717
- Publication date Jan 20, 2022
- Semiconductor Components Industries, LLC
- WuXing Xia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED SEMICONDUCTOR ASSEMBLIES AND METHODS FOR MANUFACTURING SUC...
- Publication number 20220013460
- Publication date Jan 13, 2022
- Micron Technology, Inc.
- Suan Jeung Boon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20210351114
- Publication date Nov 11, 2021
- Mitsubishi Electric Corporation
- Motoki IMANISHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED SEMICONDUCTOR ASSEMBLIES AND METHODS FOR MANUFACTURING SUC...
- Publication number 20200243444
- Publication date Jul 30, 2020
- Micron Technology, Inc.
- Suan Jeung Boon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Impedance Controlled Electrical Interconnection Employing Meta-Mate...
- Publication number 20200083171
- Publication date Mar 12, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Christopher Wyland
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package-On-Package (PoP) Structure Including Stud Bulbs
- Publication number 20190123027
- Publication date Apr 25, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH TERMINAL PATTERN FOR INCREASED CHANNEL D...
- Publication number 20190115292
- Publication date Apr 18, 2019
- TEXAS INSTRUMENTS INCORPORATED
- Casey Thomas Morrison
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20180309441
- Publication date Oct 25, 2018
- Mitsubishi Electric Corporation
- Takuya SHIRAISHI
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
PACKAGED SEMICONDUCTOR ASSEMBLIES AND METHODS FOR MANUFACTURING SUC...
- Publication number 20180158778
- Publication date Jun 7, 2018
- Micron Technology, Inc.
- Suan Jeung Boon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package-On-Package (PoP) Structure Including Stud Bulbs
- Publication number 20180047709
- Publication date Feb 15, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED CHIP PACKAGE AND METHOD FOR FORMING THE SAME
- Publication number 20140332983
- Publication date Nov 13, 2014
- Yen-Shih HO
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
CHIP PACKAGE AND METHOD FOR FORMING THE SAME
- Publication number 20140332969
- Publication date Nov 13, 2014
- Yen-Shih HO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE
- Publication number 20140332968
- Publication date Nov 13, 2014
- Yen-Shih HO
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
CHIP PACKAGE AND METHOD FOR FORMING THE SAME
- Publication number 20140332908
- Publication date Nov 13, 2014
- Yen-Shih HO
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
PACKAGED SEMICONDUCTOR ASSEMBLIES AND METHODS FOR MANUFACTURING SUC...
- Publication number 20140124960
- Publication date May 8, 2014
- Micron Technology, Inc.
- Suan Jeung Boon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20140117544
- Publication date May 1, 2014
- Seiko Instruments Inc.
- Noriyuki KIMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING A METAL PAD STRUCTURE OF A DIE, A METHOD F...
- Publication number 20140054800
- Publication date Feb 27, 2014
- INFINEON TECHNOLOGIES AG
- Johann Gatterbauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20140035115
- Publication date Feb 6, 2014
- SUMITOMO BAKELITE CO., LTD.
- Shin-ichi Zenbutsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, INVERTER DEVICE PROVIDED WITH SEMICONDUCTOR D...
- Publication number 20130320818
- Publication date Dec 5, 2013
- MITSUBISHI ELECTRIC CORPORATION
- Takuya Oga
- B60 - VEHICLES IN GENERAL
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20130307130
- Publication date Nov 21, 2013
- MITSUBISHI ELECTRIC CORPORATION
- Takuya Oga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Through Wire Interconnect (TWI) For Semiconductor Components Having...
- Publication number 20130299983
- Publication date Nov 14, 2013
- Alan G. Wood
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT DEVICE
- Publication number 20130286617
- Publication date Oct 31, 2013
- ON SEMICONDUCTOR TRADING, LTD.
- Takashi Shibasaki
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
CIRCUIT DEVICE
- Publication number 20130286616
- Publication date Oct 31, 2013
- ON Semiconductor Trading, Ltd.
- Takashi Shibasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT DEVICE
- Publication number 20130286618
- Publication date Oct 31, 2013
- ON SEMICONDUCTOR TRADING, LTD.
- Takashi Shibasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20130267050
- Publication date Oct 10, 2013
- Satoshi SHIRAHAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAVY-WIRE BOND ARRANGEMENT AND METHOD FOR PRODUCING SAME
- Publication number 20130220673
- Publication date Aug 29, 2013
- Technische Universitaet Berlin
- Andreas Middendorf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Processes and structures for IC fabrication
- Publication number 20130193561
- Publication date Aug 1, 2013
- TEREPAC CORPORATION
- Jayna Sheats
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING CLADDED BASE PLATE
- Publication number 20130134572
- Publication date May 30, 2013
- INFINEON TECHNOLOGIES AG
- Andreas Lenniger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package-On-Package (PoP) Structure and Method
- Publication number 20130134588
- Publication date May 30, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS

with a principal constituent of the bonding area being a polymer

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Impedance controlled electrical interconnection employing meta-mate...

Semiconductor package

Impedance controlled electrical interconnection employing meta-mate...

Semiconductor package with terminal pattern for increased channel d...

Packaged semiconductor assemblies and methods for manufacturing suc...

Package-on-package (PoP) structure including stud bulbs

Impedance controlled electrical interconnection employing meta-mate...

Package-on-package (PoP) structure including stud bulbs

Packaged semiconductor device

Semiconductor device

Heavy-wire bond arrangement and method for producing same

Semiconductor device having a sealant layer including carbon direct...

Packaged semiconductor assemblies and methods for manufacturing suc...

Package on-package (PoP) structure including stud bulbs

Integrated circuit with inductive bond wires

Glass/ceramic replacement of epoxy for high temperature hermeticall...

Semiconductor device

Package on-Package (PoP) structure including stud bulbs and method

Semiconductor device and manufacturing method thereof

Wire loops, methods of forming wire loops, and related processes

Chip package and method for forming the same

Chip package

Semiconductor device

Semiconductor device

Wire bonding structure of semiconductor device and wire bonding method

Circuit device

Circuit device

Chip package and method for forming the same

Bonding structure of bonding wire

Electronic component and method for producing same

Patents Applicationslast 30 patents

Impedance Controlled Electrical Interconnection Employing Meta-Mate...

STRENGTHENED WIRE-BOND

PACKAGED SEMICONDUCTOR ASSEMBLIES AND METHODS FOR MANUFACTURING SUC...

SEMICONDUCTOR PACKAGE

PACKAGED SEMICONDUCTOR ASSEMBLIES AND METHODS FOR MANUFACTURING SUC...

Impedance Controlled Electrical Interconnection Employing Meta-Mate...

Package-On-Package (PoP) Structure Including Stud Bulbs

SEMICONDUCTOR PACKAGE WITH TERMINAL PATTERN FOR INCREASED CHANNEL D...

SEMICONDUCTOR DEVICE

PACKAGED SEMICONDUCTOR ASSEMBLIES AND METHODS FOR MANUFACTURING SUC...

Package-On-Package (PoP) Structure Including Stud Bulbs

STACKED CHIP PACKAGE AND METHOD FOR FORMING THE SAME

CHIP PACKAGE AND METHOD FOR FORMING THE SAME

CHIP PACKAGE

CHIP PACKAGE AND METHOD FOR FORMING THE SAME

PACKAGED SEMICONDUCTOR ASSEMBLIES AND METHODS FOR MANUFACTURING SUC...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

METHOD FOR MANUFACTURING A METAL PAD STRUCTURE OF A DIE, A METHOD F...

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE, INVERTER DEVICE PROVIDED WITH SEMICONDUCTOR D...

SEMICONDUCTOR DEVICE

Through Wire Interconnect (TWI) For Semiconductor Components Having...

CIRCUIT DEVICE

CIRCUIT DEVICE

CIRCUIT DEVICE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...

HEAVY-WIRE BOND ARRANGEMENT AND METHOD FOR PRODUCING SAME

Processes and structures for IC fabrication

SEMICONDUCTOR DEVICE INCLUDING CLADDED BASE PLATE

Package-On-Package (PoP) Structure and Method