with a principal constituent of the bonding area being a polymer

Industry

CPC
H01L2224/4879

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/4879with a principal constituent of the bonding area being a polymer

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package with terminal pattern for increased channel d...
- Patent number 11,211,315
- Issue date Dec 28, 2021
- Texas Instruments Incorporated
- Casey Thomas Morrison
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive wire through-mold connection apparatus and method
- Patent number 10,756,072
- Issue date Aug 25, 2020
- Intel Corporation
- Mao Guo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package (PoP) structure including stud bulbs
- Patent number 10,510,731
- Issue date Dec 17, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package (PoP) structure including stud bulbs
- Patent number 10,157,893
- Issue date Dec 18, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package substrate having a plurality of chips electrically connecte...
- Patent number 10,079,220
- Issue date Sep 18, 2018
- PHOENIX & CORPORATION
- Chu-Chin Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,068,823
- Issue date Sep 4, 2018
- Rohm Co., Ltd.
- Hiroshi Okumura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a protective material with a first pH f...
- Patent number 10,037,965
- Issue date Jul 31, 2018
- NXP USA, INC.
- Leo M. Higgins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing semiconductor device
- Patent number 9,922,928
- Issue date Mar 20, 2018
- Renesas Electronics Corporation
- Takashi Tonegawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resin sealing type semiconductor device and method of manufacturing...
- Patent number 9,905,497
- Issue date Feb 27, 2018
- Semiconductor Components Industries, LLC
- Takeshi Susaki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 9,853,005
- Issue date Dec 26, 2017
- Renesas Electronics Corporation
- Takehiko Maeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package on-package (PoP) structure including stud bulbs
- Patent number 9,812,427
- Issue date Nov 7, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 9,508,672
- Issue date Nov 29, 2016
- Rohm Co., Ltd.
- Hiroshi Okumura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for protecting copper wire bonds on aluminum pads of a semic...
- Patent number 9,508,622
- Issue date Nov 29, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Leo M. Higgins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package on-Package (PoP) structure including stud bulbs and method
- Patent number 9,502,394
- Issue date Nov 22, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Spot plated leadframe and IC bond pad via array design for copper wire
- Patent number 9,230,928
- Issue date Jan 5, 2016
- Conexant Systems, Inc.
- Robert W. Warren
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Processes and structures for IC fabrication
- Patent number 9,224,641
- Issue date Dec 29, 2015
- Jayna Sheats
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Semiconductor device and method of manufacturing the semiconductor...
- Patent number 9,209,153
- Issue date Dec 8, 2015
- Renesas Electronics Corporation
- Norihiro Asamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor apparatus
- Patent number 9,177,938
- Issue date Nov 3, 2015
- Fujitsu Limited
- Motoaki Tani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resin sealing type semiconductor device and method of manufacturing...
- Patent number 9,171,761
- Issue date Oct 27, 2015
- Semiconductor Components Industries, LLC
- Takeshi Sasaki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Resin sealing type semiconductor device and method of manufacturing...
- Patent number 9,136,174
- Issue date Sep 15, 2015
- Semiconductor Components Industries, LLC
- Takeshi Sasaki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Moisture barrier for a wire bond
- Patent number 9,136,245
- Issue date Sep 15, 2015
- Avago Technologies General IP (Singapore) Pte. Ltd.
- John M. DeLucca
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 9,070,673
- Issue date Jun 30, 2015
- Rohm Co., Ltd.
- Hiroshi Okumura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Module having a stacked passive element and method of forming the same
- Patent number 9,054,086
- Issue date Jun 9, 2015
- Enpirion, Inc.
- Ashraf W. Lotfi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic assembly with impedance controlled wirebond and con...
- Patent number 8,994,195
- Issue date Mar 31, 2015
- Tessera, Inc.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including a contact clip having protrusions an...
- Patent number 8,987,879
- Issue date Mar 24, 2015
- Infineon Technologies AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Epoxy resin composition for semiconductor encapsulation, cured prod...
- Patent number 8,963,344
- Issue date Feb 24, 2015
- Sumitomo Bakelite Co., Ltd.
- Shingo Itoh
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Processes and structures for IC fabrication
- Patent number 8,928,118
- Issue date Jan 6, 2015
- Jayna Sheats
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package (PoP) structure including stud bulbs and method
- Patent number 8,912,651
- Issue date Dec 16, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods to fabricate integrated circuits by assembling components
- Patent number 8,889,482
- Issue date Nov 18, 2014
- Jayna Sheats
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor apparatus, method for manufacturing the same and elec...
- Patent number 8,866,312
- Issue date Oct 21, 2014
- Fujitsu Limited
- Motoaki Tani
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
STRENGTHENED WIRE-BOND
- Publication number 20220020717
- Publication date Jan 20, 2022
- Semiconductor Components Industries, LLC
- WuXing Xia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package-On-Package (PoP) Structure Including Stud Bulbs
- Publication number 20190123027
- Publication date Apr 25, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH TERMINAL PATTERN FOR INCREASED CHANNEL D...
- Publication number 20190115292
- Publication date Apr 18, 2019
- TEXAS INSTRUMENTS INCORPORATED
- Casey Thomas Morrison
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE WIRE THROUGH-MOLD CONNECTION APPARATUS AND METHOD
- Publication number 20180374832
- Publication date Dec 27, 2018
- Intel Corporation
- Mao GUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SUBSTRATE AND ITS FABRICATION METHOD
- Publication number 20180130771
- Publication date May 10, 2018
- PHOENIX PIONEER TECHNOLOGY CO., LTD.
- Chu-Chin Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20180068964
- Publication date Mar 8, 2018
- RENESAS ELECTRONICS CORPORATION
- Takehiko MAEDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package-On-Package (PoP) Structure Including Stud Bulbs
- Publication number 20180047709
- Publication date Feb 15, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20170092605
- Publication date Mar 30, 2017
- RENESAS ELECTRONICS CORPORATION
- Takashi TONEGAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BOND STRENGTHENING
- Publication number 20160322329
- Publication date Nov 3, 2016
- SKYWORKS SOLUTIONS, INC.
- Aldrin Quinones GARING
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20160013142
- Publication date Jan 14, 2016
- RENESAS ELECTRONICS CORPORATION
- Takehiko MAEDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20150061160
- Publication date Mar 5, 2015
- Renesas Electronics Corporation
- Norihiro Asamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOISTURE BARRIER FOR A WIRE BOND
- Publication number 20140349475
- Publication date Nov 27, 2014
- LSI Corporation
- John M. DeLucca
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RESIN SEALING TYPE SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING...
- Publication number 20140179063
- Publication date Jun 26, 2014
- Semiconductor Components Industries, LLC
- Takeshi Sasaki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
MICROELECTRONIC ASSEMBLY WITH IMPEDANCE CONTROLLED WIREBOND AND CON...
- Publication number 20140103500
- Publication date Apr 17, 2014
- Tessera, Inc.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Processes and structures for IC fabrication
- Publication number 20130193561
- Publication date Aug 1, 2013
- TEREPAC CORPORATION
- Jayna Sheats
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING STRUCTURE OF MULTILAYER COPPER BONDING WIRE
- Publication number 20130180757
- Publication date Jul 18, 2013
- Nippon Micrometal Corporation
- Tomohiro Uno
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Package-On-Package (PoP) Structure and Method
- Publication number 20130134588
- Publication date May 30, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20130113096
- Publication date May 9, 2013
- Rohm Co., Ltd.
- Hiroshi Okumura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Spot Plated Leadframe and IC Bond Pad Via Array Design for Copper Wire
- Publication number 20130062742
- Publication date Mar 14, 2013
- Conexant Systems, Inc.
- Robert W. Warren
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power Semiconductor Chip Having Two Metal Layers on One Face
- Publication number 20130027113
- Publication date Jan 31, 2013
- INFINEON TECHNOLOGIES AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Including a Contact Clip Having Protrusions an...
- Publication number 20130009295
- Publication date Jan 10, 2013
- INFINEON TECHNOLOGIES AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH ADHESIVE MATERIAL PRE-PRINTED ON THE LEA...
- Publication number 20120322207
- Publication date Dec 20, 2012
- Xiaotian Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER BONDING WIRE FOR SEMICONDUCTOR AND BONDING STRUCTURE THEREOF
- Publication number 20120299182
- Publication date Nov 29, 2012
- Tomohiro Uno
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20120302009
- Publication date Nov 29, 2012
- RENESAS ELECTRONICS CORPORATION
- Masahiko SEKIHARA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE WITH PROTECTIVE MATERIAL AND METHOD FOR ENCAPS...
- Publication number 20120273954
- Publication date Nov 1, 2012
- LEO M. HIGGINS, III
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EPOXY RESIN COMPOSITION FOR SEMICONDUCTOR ENCAPSULATION, CURED PROD...
- Publication number 20120261807
- Publication date Oct 18, 2012
- Shingo Itoh
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH INTERCONNECTS AND METHOD O...
- Publication number 20120241931
- Publication date Sep 27, 2012
- Henry Descalzo Bathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM USING B-STAGE POLYMER AND METHO...
- Publication number 20120228768
- Publication date Sep 13, 2012
- Reza Argenty Pagaila
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOISTURE BARRIER FOR A WIRE BOND
- Publication number 20120223432
- Publication date Sep 6, 2012
- LSI Corporation
- JOHN M. DELUCCA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR APPARATUS, METHOD FOR MANUFACTURING THE SAME AND ELEC...
- Publication number 20120217660
- Publication date Aug 30, 2012
- FUJITSU LIMITED
- Motoaki TANI
- H01 - BASIC ELECTRIC ELEMENTS

with a principal constituent of the bonding area being a polymer

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor package with terminal pattern for increased channel d...

Conductive wire through-mold connection apparatus and method

Package-on-package (PoP) structure including stud bulbs

Package-on-package (PoP) structure including stud bulbs

Package substrate having a plurality of chips electrically connecte...

Semiconductor device

Semiconductor device having a protective material with a first pH f...

Semiconductor device and method of manufacturing semiconductor device

Resin sealing type semiconductor device and method of manufacturing...

Semiconductor device and method of manufacturing the same

Package on-package (PoP) structure including stud bulbs

Semiconductor device

Method for protecting copper wire bonds on aluminum pads of a semic...

Package on-Package (PoP) structure including stud bulbs and method

Spot plated leadframe and IC bond pad via array design for copper wire

Processes and structures for IC fabrication

Semiconductor device and method of manufacturing the semiconductor...

Method for manufacturing semiconductor apparatus

Resin sealing type semiconductor device and method of manufacturing...

Resin sealing type semiconductor device and method of manufacturing...

Moisture barrier for a wire bond

Semiconductor device

Module having a stacked passive element and method of forming the same

Microelectronic assembly with impedance controlled wirebond and con...

Semiconductor device including a contact clip having protrusions an...

Epoxy resin composition for semiconductor encapsulation, cured prod...

Processes and structures for IC fabrication

Package-on-package (PoP) structure including stud bulbs and method

Methods to fabricate integrated circuits by assembling components

Semiconductor apparatus, method for manufacturing the same and elec...

Patents Applicationslast 30 patents

STRENGTHENED WIRE-BOND

Package-On-Package (PoP) Structure Including Stud Bulbs

SEMICONDUCTOR PACKAGE WITH TERMINAL PATTERN FOR INCREASED CHANNEL D...

CONDUCTIVE WIRE THROUGH-MOLD CONNECTION APPARATUS AND METHOD

PACKAGE SUBSTRATE AND ITS FABRICATION METHOD

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Package-On-Package (PoP) Structure Including Stud Bulbs

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

WIRE BOND STRENGTHENING

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...

MOISTURE BARRIER FOR A WIRE BOND

RESIN SEALING TYPE SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING...

MICROELECTRONIC ASSEMBLY WITH IMPEDANCE CONTROLLED WIREBOND AND CON...

Processes and structures for IC fabrication

BONDING STRUCTURE OF MULTILAYER COPPER BONDING WIRE

Package-On-Package (PoP) Structure and Method

SEMICONDUCTOR DEVICE

Spot Plated Leadframe and IC Bond Pad Via Array Design for Copper Wire

Power Semiconductor Chip Having Two Metal Layers on One Face

Semiconductor Device Including a Contact Clip Having Protrusions an...

SEMICONDUCTOR PACKAGE WITH ADHESIVE MATERIAL PRE-PRINTED ON THE LEA...

COPPER BONDING WIRE FOR SEMICONDUCTOR AND BONDING STRUCTURE THEREOF

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE WITH PROTECTIVE MATERIAL AND METHOD FOR ENCAPS...

EPOXY RESIN COMPOSITION FOR SEMICONDUCTOR ENCAPSULATION, CURED PROD...

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH INTERCONNECTS AND METHOD O...

INTEGRATED CIRCUIT PACKAGING SYSTEM USING B-STAGE POLYMER AND METHO...

MOISTURE BARRIER FOR A WIRE BOND

SEMICONDUCTOR APPARATUS, METHOD FOR MANUFACTURING THE SAME AND ELEC...