with a principal constituent of the bonding area being a polymer

Industry

CPC
H01L2224/4889

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/4889with a principal constituent of the bonding area being a polymer

Industries

Patents Grantslast 30 patents

Information Patent Grant
Systems and methods for improved delamination characteristics in a...
- Patent number 10,763,130
- Issue date Sep 1, 2020
- Microchip Technology Incorporated
- Taweesak Laevohan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package (PoP) structure including stud bulbs
- Patent number 10,510,731
- Issue date Dec 17, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package (PoP) structure including stud bulbs
- Patent number 10,157,893
- Issue date Dec 18, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package on-package (PoP) structure including stud bulbs
- Patent number 9,812,427
- Issue date Nov 7, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package on-Package (PoP) structure including stud bulbs and method
- Patent number 9,502,394
- Issue date Nov 22, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package (PoP) structure including stud bulbs and method
- Patent number 8,912,651
- Issue date Dec 16, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Package-On-Package (PoP) Structure Including Stud Bulbs
- Publication number 20190123027
- Publication date Apr 25, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Systems And Methods For Improved Delamination Characteristics In A...
- Publication number 20180308713
- Publication date Oct 25, 2018
- MICROCHIP TECHNOLOGY INCORPORATED
- Taweesak Laevohan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package-On-Package (PoP) Structure Including Stud Bulbs
- Publication number 20180047709
- Publication date Feb 15, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING A METAL PAD STRUCTURE OF A DIE, A METHOD F...
- Publication number 20140054800
- Publication date Feb 27, 2014
- INFINEON TECHNOLOGIES AG
- Johann Gatterbauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package-On-Package (PoP) Structure and Method
- Publication number 20130134588
- Publication date May 30, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING A HEAT SPREADER
- Publication number 20120175755
- Publication date Jul 12, 2012
- INFINEON TECHNOLOGIES AG
- Reinhold Bayerer
- H01 - BASIC ELECTRIC ELEMENTS

with a principal constituent of the bonding area being a polymer

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Systems and methods for improved delamination characteristics in a...

Package-on-package (PoP) structure including stud bulbs

Package-on-package (PoP) structure including stud bulbs

Package on-package (PoP) structure including stud bulbs

Package on-Package (PoP) structure including stud bulbs and method

Package-on-package (PoP) structure including stud bulbs and method

Patents Applicationslast 30 patents

Package-On-Package (PoP) Structure Including Stud Bulbs

Systems And Methods For Improved Delamination Characteristics In A...

Package-On-Package (PoP) Structure Including Stud Bulbs

METHOD FOR MANUFACTURING A METAL PAD STRUCTURE OF A DIE, A METHOD F...

Package-On-Package (PoP) Structure and Method

SEMICONDUCTOR DEVICE INCLUDING A HEAT SPREADER