Membership
Tour
Register
Log in
with a principal constituent of the bonding area being a solid not provided for in groups H01L2224/488 - H01L2224/4889
Follow
Industry
CPC
H01L2224/48893
This industry / category may be too specific. Please go to a parent level for more data
Parent Industries
H
ELECTRICITY
H01
Electric elements
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L2224/00
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
Current Industry
H01L2224/48893
with a principal constituent of the bonding area being a solid not provided for in groups H01L2224/488 - H01L2224/4889
Industries
Overview
Organizations
People
Information
Impact
Please log in for detailed analytics
Patents Grants
last 30 patents
Information
Patent Grant
Package-on-package (PoP) structure including stud bulbs
Patent number
10,510,731
Issue date
Dec 17, 2019
Taiwan Semiconductor Manufacturing Company, Ltd.
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package-on-package (PoP) structure including stud bulbs
Patent number
10,157,893
Issue date
Dec 18, 2018
Taiwan Semiconductor Manufacturing Company, Ltd.
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package on-package (PoP) structure including stud bulbs
Patent number
9,812,427
Issue date
Nov 7, 2017
Taiwan Semiconductor Manufacturing Company, Ltd.
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package on-Package (PoP) structure including stud bulbs and method
Patent number
9,502,394
Issue date
Nov 22, 2016
Taiwan Semiconductor Manufacturing Company, Ltd.
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package-on-package (PoP) structure including stud bulbs and method
Patent number
8,912,651
Issue date
Dec 16, 2014
Taiwan Semiconductor Manufacturing Company, Ltd.
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
Package-On-Package (PoP) Structure Including Stud Bulbs
Publication number
20190123027
Publication date
Apr 25, 2019
Taiwan Semiconductor Manufacturing Company, Ltd.
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Package-On-Package (PoP) Structure Including Stud Bulbs
Publication number
20180047709
Publication date
Feb 15, 2018
Taiwan Semiconductor Manufacturing Company, Ltd.
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR MANUFACTURING A METAL PAD STRUCTURE OF A DIE, A METHOD F...
Publication number
20140054800
Publication date
Feb 27, 2014
INFINEON TECHNOLOGIES AG
Johann Gatterbauer
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Package-On-Package (PoP) Structure and Method
Publication number
20130134588
Publication date
May 30, 2013
Taiwan Semiconductor Manufacturing Company, Ltd.
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE INCLUDING A HEAT SPREADER
Publication number
20120175755
Publication date
Jul 12, 2012
INFINEON TECHNOLOGIES AG
Reinhold Bayerer
H01 - BASIC ELECTRIC ELEMENTS