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with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material
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CPC
H01L2224/29398
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H
ELECTRICITY
H01
Electric elements
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L2224/00
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
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H01L2224/29398
with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material
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Patents Grants
last 30 patents
Information
Patent Grant
Anisotropic conductive interconnect material for electronic devices...
Patent number
6,011,307
Issue date
Jan 4, 2000
Micron Technology, Inc.
Tongbi Jiang
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
TANTALUM DOPED RUTHENIUM LAYERS FOR INTERCONNECTS
Publication number
20240071927
Publication date
Feb 29, 2024
Applied Materials, Inc.
Shinjae Hwang
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
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Patent Application
SEMICONDUCTOR DEVICES CONNECTED BY ANISOTROPIC CONDUCTIVE FILM COMP...
Publication number
20130154095
Publication date
Jun 20, 2013
Arum YU
H01 - BASIC ELECTRIC ELEMENTS