TREA

with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material

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Industry

  • CPC
  • H01L2224/13198
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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/13198with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material
Industries

Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    SEMICONDUCTOR PACKAGE
    • Publication number 20250219000
    • Publication date Jul 3, 2025
    • Samsung Electronics Co., Ltd.
    • Junghoon KANG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SELF-HEALING SOLDER INTERCONNECTION
    • Publication number 20250157968
    • Publication date May 15, 2025
    • META PLATFORMS, INC.
    • Pradip Sairam PICHUMANI
    • H01 - BASIC ELECTRIC ELEMENTS