Membership
Tour
Register
Log in
with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
Follow
Industry
CPC
H01L2924/095
This industry / category may be too specific. Please go to a parent level for more data
Parent Industries
H
ELECTRICITY
H01
Electric elements
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L2924/00
Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
Current Industry
H01L2924/095
with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
Industries
Overview
Organizations
People
Information
Impact
Please log in for detailed analytics
Patents Grants
last 30 patents
Information
Patent Grant
Thermal interface material, an integrated circuit formed therewith,...
Patent number
12,027,442
Issue date
Jul 2, 2024
ARIECA INC.
Jeffrey Gelorme
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of manufacturing semiconductor device
Patent number
10,879,205
Issue date
Dec 29, 2020
Kyocera Corporation
Masakazu Fujiwara
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of manufacturing semiconductor device
Patent number
10,840,206
Issue date
Nov 17, 2020
Kyocera Corporation
Masakazu Fujiwara
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Light emitting apparatus
Patent number
10,374,136
Issue date
Aug 6, 2019
Nichia Corporation
Ryohei Yamashita
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Dry-removable protective coatings
Patent number
9,472,517
Issue date
Oct 18, 2016
Intel Corporation
Mihir A. Oka
C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information
Patent Grant
Power semiconductor package with conductive clip
Patent number
9,118,126
Issue date
Aug 25, 2015
International Rectifier Corporation
Hsueh-Rong Chang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
IGBT power semiconductor package having a conductive clip
Patent number
8,354,733
Issue date
Jan 15, 2013
International Rectifier Corporation
Hsueh-Rong Chang
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
THERMAL INTERFACE MATERIAL INCLUDING A MULTI-LAYER STRUCTURE AND ME...
Publication number
20240371722
Publication date
Nov 7, 2024
Taiwan Semiconductor Manufacturing Company Limited
Chih-Chien Pan
F28 - HEAT EXCHANGE IN GENERAL
Information
Patent Application
METHOD OF DEPOSITION OF A THERMAL INTERFACE MATERIAL ONTO A CIRCUIT...
Publication number
20240203754
Publication date
Jun 20, 2024
Arieca Inc.
Navid Kazem
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CHIP PACKAGE
Publication number
20240120300
Publication date
Apr 11, 2024
Walton Advanced Engineering, Inc
HONG-CHI YU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ESTER COMPOUND AND RESIN COMPOSITION
Publication number
20230242705
Publication date
Aug 3, 2023
AJINOMOTO CO., INC.
Ichiro OGURA
C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information
Patent Application
SELF-DENSIFYING NANO-SILVER PASTE AND A METHOD OF FORMING INTERCONN...
Publication number
20230230950
Publication date
Jul 20, 2023
NANO AND ADVANCED MATERIALS INSTITUTE LIMITED
Yuechen WANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
TERMINAL AND CONNECTION METHOD
Publication number
20230075929
Publication date
Mar 9, 2023
SONY GROUP CORPORATION
JO UMEZAWA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DIRECT BONDING METHODS AND STRUCTURES
Publication number
20220320035
Publication date
Oct 6, 2022
INVENSAS BONDING TECHNOLOGIES, INC.
Cyprian Emeka Uzoh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
Publication number
20190393181
Publication date
Dec 26, 2019
Kyocera Corporation
Masakazu FUJIWARA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
LIGHT EMITTING APPARATUS
Publication number
20190027667
Publication date
Jan 24, 2019
Nichia Corporation.
Ryohei YAMASHITA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR DEVICE
Publication number
20160071777
Publication date
Mar 10, 2016
Panasonic Intellectual Property Management Co., Ltd.
Kazuhiro YAHATA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DRY-REMOVABLE PROTECTIVE COATINGS
Publication number
20150270235
Publication date
Sep 24, 2015
Mihir A. Oka
C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information
Patent Application
Power Semiconductor Package with Conductive Clip
Publication number
20130140602
Publication date
Jun 6, 2013
International Rectifier Corporation
Hsueh-Rong Chang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE, SEMICONDUCTOR MODULE STRUCTURE CONFIGURED BY...
Publication number
20130026650
Publication date
Jan 31, 2013
Osamu Yamagata
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
IGBT Power Semiconductor Package Having a Conductive Clip
Publication number
20120223415
Publication date
Sep 6, 2012
INTERNATIONAL RECTIFIER CORPORATION
Hsueh-Rong Chang
H01 - BASIC ELECTRIC ELEMENTS