with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material

Industry

CPC
H01L2224/45698

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/45698with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor module system having encapsulated through wire interc...
- Patent number 9,018,751
- Issue date Apr 28, 2015
- Micron Technology, Inc.
- David R. Hembree
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor device
- Patent number 8,766,420
- Issue date Jul 1, 2014
- Sumitomo Bakelite Co., Ltd.
- Shingo Itoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating a through wire interconnect (TWI) on a semic...
- Patent number 8,741,667
- Issue date Jun 3, 2014
- Micron Technology, Inc.
- David R. Hembree
- G01 - MEASURING TESTING
Information Patent Grant
Through wire interconnect (TWI) having bonded connection and encaps...
- Patent number 8,581,387
- Issue date Nov 12, 2013
- Micron Technology, Inc.
- David R. Hembree
- G01 - MEASURING TESTING
Information Patent Grant
Method for fabricating stacked semiconductor system with encapsulat...
- Patent number 8,404,523
- Issue date Mar 26, 2013
- Micron Technoloy, Inc.
- David R. Hembree
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor module system having stacked components with encapsul...
- Patent number 8,217,510
- Issue date Jul 10, 2012
- Micron Technology, Inc.
- David R. Hembree
- G01 - MEASURING TESTING
Information Patent Grant
System with semiconductor components having encapsulated through wi...
- Patent number 8,120,167
- Issue date Feb 21, 2012
- Micron Technology, Inc.
- David R. Hembree
- G01 - MEASURING TESTING
Information Patent Grant
Method for fabricating semiconductor component having encapsulated...
- Patent number 7,883,908
- Issue date Feb 8, 2011
- Micron Technology, Inc.
- David R. Hembree
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor components having encapsulated through wire interconn...
- Patent number 7,659,612
- Issue date Feb 9, 2010
- Micron Technology, Inc.
- David R. Hembree
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR MODULE SYSTEM HAVING ENCAPSULATED THROUGH WIRE INTERC...
- Publication number 20140225259
- Publication date Aug 14, 2014
- Micron Technology, Inc.
- David R. Hembree
- G01 - MEASURING TESTING
Information Patent Application
METHOD FOR FABRICATING A THROUGH WIRE INTERCONNECT (TWI) ON A SEMIC...
- Publication number 20140038406
- Publication date Feb 6, 2014
- Micron Technology, Inc.
- David R. Hembree
- G01 - MEASURING TESTING
Information Patent Application
METHOD FOR FABRICATING STACKED SEMICONDUCTOR SYSTEM WITH ENCAPSULAT...
- Publication number 20120288997
- Publication date Nov 15, 2012
- Micron Technology, Inc.
- DAVID R. HEMBREE
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20120168927
- Publication date Jul 5, 2012
- Shingo Itoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Module System Having Stacked Components With Encapsul...
- Publication number 20120043670
- Publication date Feb 23, 2012
- David R. Hembree
- G01 - MEASURING TESTING
Information Patent Application
System With Semiconductor Components Having Encapsulated Through Wi...
- Publication number 20110024745
- Publication date Feb 3, 2011
- David R. Hembree
- G01 - MEASURING TESTING
Information Patent Application
Method For Fabricating Semiconductor Component Having Encapsulated...
- Publication number 20100047934
- Publication date Feb 25, 2010
- David R. Hembree
- G01 - MEASURING TESTING
Information Patent Application
Semiconductor components and systems having encapsulated through wi...
- Publication number 20070246819
- Publication date Oct 25, 2007
- Micron Technology, Inc.
- David R. Hembree
- G01 - MEASURING TESTING

with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor module system having encapsulated through wire interc...

Semiconductor device

Method for fabricating a through wire interconnect (TWI) on a semic...

Through wire interconnect (TWI) having bonded connection and encaps...

Method for fabricating stacked semiconductor system with encapsulat...

Semiconductor module system having stacked components with encapsul...

System with semiconductor components having encapsulated through wi...

Method for fabricating semiconductor component having encapsulated...

Semiconductor components having encapsulated through wire interconn...

Patents Applicationslast 30 patents

SEMICONDUCTOR MODULE SYSTEM HAVING ENCAPSULATED THROUGH WIRE INTERC...

METHOD FOR FABRICATING A THROUGH WIRE INTERCONNECT (TWI) ON A SEMIC...

METHOD FOR FABRICATING STACKED SEMICONDUCTOR SYSTEM WITH ENCAPSULAT...

SEMICONDUCTOR DEVICE

Semiconductor Module System Having Stacked Components With Encapsul...

System With Semiconductor Components Having Encapsulated Through Wi...

Method For Fabricating Semiconductor Component Having Encapsulated...

Semiconductor components and systems having encapsulated through wi...