with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material

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H01L2924/16598

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

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H01L2924/16598with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device packages
- Patent number 9,837,328
- Issue date Dec 5, 2017
- NXP USA, INC.
- Lakshminarayan Viswanathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for forming semiconductor device packages
- Patent number 9,837,327
- Issue date Dec 5, 2017
- NXP USA, INC.
- Lakshminarayan Viswanathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hermetic-sealing package member, production method therefor, and he...
- Patent number 9,561,952
- Issue date Feb 7, 2017
- Tanaka Kikinzoku Kogyo K.K.
- Toshinori Ogashiwa
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method and apparatus for high temperature semiconductor device pack...
- Patent number 9,312,231
- Issue date Apr 12, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Lakshminarayan Viswanathan
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240120252
- Publication date Apr 11, 2024
- RENESAS ELECTRONICS CORPORATION
- Nobuhiro KINOSHITA
- H01 - BASIC ELECTRIC ELEMENTS