with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material

Industry

CPC
H01L2224/29198

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/29198with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material

Industries

Patents Grantslast 30 patents

Information Patent Grant
Display apparatus
- Patent number 11,995,277
- Issue date May 28, 2024
- Samsung Display Co., Ltd.
- Kiwook Kim
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Electronic device including conductive adhesive layer
- Patent number 11,805,685
- Issue date Oct 31, 2023
- Samsung Display Co., Ltd.
- Youngmin Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display apparatus
- Patent number 11,720,213
- Issue date Aug 8, 2023
- Samsung Display Co., Ltd.
- Kiwook Kim
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Display apparatus
- Patent number 11,360,621
- Issue date Jun 14, 2022
- Samsung Display Co., Ltd.
- Kiwook Kim
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Display apparatus
- Patent number 10,990,233
- Issue date Apr 27, 2021
- Samsung Display Co., Ltd.
- Kiwook Kim
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor integrated circuit device
- Patent number 10,818,620
- Issue date Oct 27, 2020
- Renesas Electronics Corporation
- Hiromi Shigihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages having an electric device with a recess
- Patent number 10,658,238
- Issue date May 19, 2020
- STMicroelectronics Pte Ltd
- Kim-Yong Goh
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Chip, flexible display panel and display device
- Patent number 10,651,141
- Issue date May 12, 2020
- BOE Technology Group Co., Ltd.
- Liqiang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display apparatus
- Patent number 10,615,242
- Issue date Apr 7, 2020
- Samsung Display Co., Ltd.
- Kiwook Kim
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Die with metallized sidewall and method of manufacturing
- Patent number 10,535,588
- Issue date Jan 14, 2020
- STMicroelectronics, Inc.
- Rennier Rodriguez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Anisotropic conductive material, electronic device including anisot...
- Patent number 9,831,211
- Issue date Nov 28, 2017
- Samsung Electronics Co., Ltd.
- Kunmo Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages having an electric device with a recess
- Patent number 9,824,924
- Issue date Nov 21, 2017
- STMicroelectronics Pte Ltd
- Kim-Yong Goh
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
High temperature bonding processes incorporating metal particles an...
- Patent number 9,620,434
- Issue date Apr 11, 2017
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Shailesh N. Joshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding structure and flexible device
- Patent number 9,607,960
- Issue date Mar 28, 2017
- Industrial Technology Research Institute
- Yi-Cheng Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Anisotropic conductive film, connection structure and method of pro...
- Patent number 9,515,042
- Issue date Dec 6, 2016
- Dexerials Corporation
- Yasushi Akutsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor integrated circuit device
- Patent number 9,466,559
- Issue date Oct 11, 2016
- Renesas Electronics Corporation
- Hiromi Shigihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light-reflective anisotropic conductive adhesive agent, and light e...
- Patent number 9,260,634
- Issue date Feb 16, 2016
- Dexerials Corporation
- Hidetsugu Namiki
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Anisotropic conductive material and method for manufacturing same
- Patent number 9,253,911
- Issue date Feb 2, 2016
- Dexerials Corporation
- Reiji Tsukao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Manufacturing method for protection circuit module of secondary bat...
- Patent number 8,966,749
- Issue date Mar 3, 2015
- Samsung SDI Co., Ltd.
- Bong Young Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Light-reflective anisotropic conductive adhesive agent, and light e...
- Patent number 8,916,894
- Issue date Dec 23, 2014
- Dexerials Corporation
- Hidetsugu Namiki
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Bonding material for semiconductor devices
- Patent number 8,896,119
- Issue date Nov 25, 2014
- Senju Metal Industry Co., Ltd.
- Yoshitsugu Sakamoto
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Device and method for manufacturing a device
- Patent number 8,633,600
- Issue date Jan 21, 2014
- Infineon Technologies AG
- Manfred Mengel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Acrylic insulating adhesive
- Patent number 8,613,623
- Issue date Dec 24, 2013
- Sony Chemical & Information Device Corporation
- Daisuke Sato
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Method for attaching a metal surface to a carrier, a method for att...
- Patent number 8,569,109
- Issue date Oct 29, 2013
- Infineon Technologies AG
- Manfred Mengel
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Derivatives of poly(styrene-co-allyl alcohol) and methods for use t...
- Patent number 8,287,686
- Issue date Oct 16, 2012
- Designer Molecules, Inc.
- Stephen M. Dershem
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Self-filleting die attach paste
- Patent number 8,286,465
- Issue date Oct 16, 2012
- Henkel AG & Co. KGaA
- Minghai Wang
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Adhesive composition and adhesive sheet
- Patent number 8,247,503
- Issue date Aug 21, 2012
- Lintec Corporation
- Naoya Saiki
- B32 - LAYERED PRODUCTS
Information Patent Grant
Semiconductor wafer coated with a filled, spin-coatable material
- Patent number 8,212,369
- Issue date Jul 3, 2012
- Henkel AG & Co. KGaA
- Eunsook Chae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor apparatus, and semiconductor...
- Patent number 8,212,364
- Issue date Jul 3, 2012
- Semiconductor Energy Laboratory Co., Ltd.
- Shunpei Yamazaki
- C30 - CRYSTAL GROWTH
Information Patent Grant
Resin paste for die bonding, containing a polyurethaneimide resin a...
- Patent number 8,212,370
- Issue date Jul 3, 2012
- Hitachi Chemical Company, Ltd.
- Syuichi Mori
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...

Patents Applicationslast 30 patents

Information Patent Application
DISPLAY APPARATUS
- Publication number 20230350524
- Publication date Nov 2, 2023
- SAMSUNG DISPLAY CO., LTD.
- Kiwook KIM
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
DISPLAY APPARATUS
- Publication number 20220308698
- Publication date Sep 29, 2022
- SAMSUNG DISPLAY CO., LTD.
- Kiwook KIM
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20220037446
- Publication date Feb 3, 2022
- SAMSUNG DISPLAY CO., LTD.
- YOUNGMIN CHO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY APPARATUS
- Publication number 20210240301
- Publication date Aug 5, 2021
- SAMSUNG DISPLAY CO., LTD.
- Kiwook KIM
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
DISPLAY APPARATUS
- Publication number 20200235192
- Publication date Jul 23, 2020
- SAMSUNG DISPLAY CO., LTD.
- Kiwook KIM
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
CHIP, FLEXIBLE DISPLAY PANEL AND DISPLAY DEVICE
- Publication number 20190148319
- Publication date May 16, 2019
- BOE TECHNOLOGY GROUP CO., LTD.
- Liqiang CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY APPARATUS
- Publication number 20180269269
- Publication date Sep 20, 2018
- Kiwook KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE WITH METALLIZED SIDEWALL AND METHOD OF MANUFACTURING
- Publication number 20180204786
- Publication date Jul 19, 2018
- STMICROELECTRONICS, INC.
- Rennier RODRIGUEZ
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE CONNECTED BY ANISOTROPIC CONDUCTIVE FILM
- Publication number 20150091192
- Publication date Apr 2, 2015
- Samsung SDI Co., Ltd.
- Young Ju SHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES HAVING AN ELECTRIC DEVICE WITH A RECESS
- Publication number 20140291812
- Publication date Oct 2, 2014
- STMicroelectronics Pte Ltd
- Kim-Yong Goh
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
- Publication number 20130313708
- Publication date Nov 28, 2013
- RENESAS ELECTRONICS CORPORATION
- HIROMI SHIGIHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bonding Material for Semiconductor Devices
- Publication number 20130134591
- Publication date May 30, 2013
- Yoshitsugu Sakamoto
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
ANISOTROPIC CONDUCTIVE MATERIAL AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20130135838
- Publication date May 30, 2013
- DEXERIALS CORPORATION
- Reiji Tsukao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SHEET PRODUCT
- Publication number 20130078406
- Publication date Mar 28, 2013
- NITTO DENKO CORPORATION
- Akira Shouji
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
LIGHT-REFLECTIVE ANISOTROPIC CONDUCTIVE ADHESIVE AGENT, AND LIGHT E...
- Publication number 20130049054
- Publication date Feb 28, 2013
- SONY CHEMICAL & INFORMATION DEVICE CORPORATION
- Hidetsugu Namiki
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
METHOD FOR ATTACHING A METAL SURFACE TO A CARRIER, A METHOD FOR ATT...
- Publication number 20130001803
- Publication date Jan 3, 2013
- INFINEON TECHNOLOGIES AG
- Manfred Mengel
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
ANISOTROPIC CONDUCTIVE FILM, CONNECTION STRUCTURE AND METHOD OF PRO...
- Publication number 20120228026
- Publication date Sep 13, 2012
- SONY CHEMICAL & INFORMATION DEVICE CORPORATION
- Yasushi Akutsu
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
FILL ROLL FOR PRODUCING SEMICONDUCTOR DEVICE
- Publication number 20120104134
- Publication date May 3, 2012
- NITTO DENKO CORPORATION
- Sadahilio Misumi
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Device and Method for Manufacturing a Device
- Publication number 20120068364
- Publication date Mar 22, 2012
- Manfred Mengel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Self-Filleting Die Attach Paste
- Publication number 20120055259
- Publication date Mar 8, 2012
- Minghai Wang
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
- Publication number 20120032329
- Publication date Feb 9, 2012
- Renesas Electronics Corporation
- HIROMI SHIGIHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ACRYLIC INSULATING ADHESIVE
- Publication number 20110159713
- Publication date Jun 30, 2011
- SONY CHEMICAL & INFORMATION DEVICE CORPORATION
- Daisuke Sato
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE FABRICATION METHOD
- Publication number 20110079896
- Publication date Apr 7, 2011
- Fujitsu Limited
- Yoshiyuki Satoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Self-Filleting Die Attach Paste
- Publication number 20110046268
- Publication date Feb 24, 2011
- Minghai Wang
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
ADHESIVE FILM FOR SEMICONDUCTOR AND SEMICONDUCTOR DEVICE USING THE...
- Publication number 20100320620
- Publication date Dec 23, 2010
- SUMITOMO BAKELITE CO., LTD.
- Hiroyuki Yasuda
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
METHOD OF MANUFACTURING DICING DIE-BONDING FILM
- Publication number 20100304092
- Publication date Dec 2, 2010
- Yasuhiro Amano
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
SEMICONDUCTOR WAFER COATED WITH A FILLED, SPIN-COATABLE MATERIAL
- Publication number 20100193973
- Publication date Aug 5, 2010
- Eunsook Chae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20100167468
- Publication date Jul 1, 2010
- Renesas Technology Corp.
- Hirohisa Shimokawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RESIN PASTE FOR DIE BONDING, METHOD FOR MANUFACTURING SEMICONDUCTOR...
- Publication number 20100155969
- Publication date Jun 24, 2010
- Syuichi Mori
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
- Publication number 20100133688
- Publication date Jun 3, 2010
- RENESAS TECHNOLOGY CORP.
- Hiromi Shigihara
- H01 - BASIC ELECTRIC ELEMENTS

with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Display apparatus

Electronic device including conductive adhesive layer

Display apparatus

Display apparatus

Display apparatus

Semiconductor integrated circuit device

Semiconductor packages having an electric device with a recess

Chip, flexible display panel and display device

Display apparatus

Die with metallized sidewall and method of manufacturing

Anisotropic conductive material, electronic device including anisot...

Semiconductor packages having an electric device with a recess

High temperature bonding processes incorporating metal particles an...

Bonding structure and flexible device

Anisotropic conductive film, connection structure and method of pro...

Semiconductor integrated circuit device

Light-reflective anisotropic conductive adhesive agent, and light e...

Anisotropic conductive material and method for manufacturing same

Manufacturing method for protection circuit module of secondary bat...

Light-reflective anisotropic conductive adhesive agent, and light e...

Bonding material for semiconductor devices

Device and method for manufacturing a device

Acrylic insulating adhesive

Method for attaching a metal surface to a carrier, a method for att...

Derivatives of poly(styrene-co-allyl alcohol) and methods for use t...

Self-filleting die attach paste

Adhesive composition and adhesive sheet

Semiconductor wafer coated with a filled, spin-coatable material

Method for manufacturing semiconductor apparatus, and semiconductor...

Resin paste for die bonding, containing a polyurethaneimide resin a...

Patents Applicationslast 30 patents

DISPLAY APPARATUS

DISPLAY APPARATUS

ELECTRONIC DEVICE

DISPLAY APPARATUS

DISPLAY APPARATUS

CHIP, FLEXIBLE DISPLAY PANEL AND DISPLAY DEVICE

DISPLAY APPARATUS

DIE WITH METALLIZED SIDEWALL AND METHOD OF MANUFACTURING

SEMICONDUCTOR DEVICE CONNECTED BY ANISOTROPIC CONDUCTIVE FILM

SEMICONDUCTOR PACKAGES HAVING AN ELECTRIC DEVICE WITH A RECESS

SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE

Bonding Material for Semiconductor Devices

ANISOTROPIC CONDUCTIVE MATERIAL AND METHOD FOR MANUFACTURING THE SAME

SHEET PRODUCT

LIGHT-REFLECTIVE ANISOTROPIC CONDUCTIVE ADHESIVE AGENT, AND LIGHT E...

METHOD FOR ATTACHING A METAL SURFACE TO A CARRIER, A METHOD FOR ATT...

ANISOTROPIC CONDUCTIVE FILM, CONNECTION STRUCTURE AND METHOD OF PRO...

FILL ROLL FOR PRODUCING SEMICONDUCTOR DEVICE

Device and Method for Manufacturing a Device

Self-Filleting Die Attach Paste

SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE

ACRYLIC INSULATING ADHESIVE

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE FABRICATION METHOD

Self-Filleting Die Attach Paste

ADHESIVE FILM FOR SEMICONDUCTOR AND SEMICONDUCTOR DEVICE USING THE...

METHOD OF MANUFACTURING DICING DIE-BONDING FILM

SEMICONDUCTOR WAFER COATED WITH A FILLED, SPIN-COATABLE MATERIAL

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

RESIN PASTE FOR DIE BONDING, METHOD FOR MANUFACTURING SEMICONDUCTOR...

SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE