with a principal constituent of the material being a gas not provided for in groups H01L2224/133 - H01L2224/13391

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H01L2224/13395

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/13395with a principal constituent of the material being a gas not provided for in groups H01L2224/133 - H01L2224/13391

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Patents Grantslast 30 patents

Information Patent Grant
Contact structures with porous networks for solder connections, and...
- Patent number 10,849,240
- Issue date Nov 24, 2020
- Invensas Corporation
- Liang Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
LED package and manufacturing method
- Patent number 9,461,027
- Issue date Oct 4, 2016
- Koninklijke Philips N.V.
- Josef Andreas Schug
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bump electrode for connecting electronic components
- Patent number 5,477,087
- Issue date Dec 19, 1995
- Matsushita Electric Industrial Co., Ltd.
- Tetsuo Kawakita
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
GOLD BONDING IN SEMICONDUCTOR DEVICES USING POROUS GOLD
- Publication number 20140061921
- Publication date Mar 6, 2014
- Alcatel-Lucent USA, Incorporated
- Nagesh Basavanhally
- G02 - OPTICS