with a principal constituent of the material being a gas not provided for in groups H01L2224/296 - H01L2224/29691

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CPC
H01L2224/29695

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/29695with a principal constituent of the material being a gas not provided for in groups H01L2224/296 - H01L2224/29691

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Patents Grantslast 30 patents

Information Patent Grant
Solder preform and electronic component
- Patent number 7,800,230
- Issue date Sep 21, 2010
- Denso Corporation
- Naohiko Hirano
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device, circuit board, electro-optic device, electron...
- Patent number 7,375,427
- Issue date May 20, 2008
- Seiko Epson Corporation
- Shuichi Tanaka
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Solder Preform and Electronic Component
- Publication number 20090236725
- Publication date Sep 24, 2009
- DENSO Corporation
- Naohiko Hirano
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor device, circuit board, electro-optic device, electron...
- Publication number 20060091539
- Publication date May 4, 2006
- Seiko Epson Corporation
- Shuichi Tanaka
- G02 - OPTICS