with a principal constituent of the material being a gas not provided for in groups H01L2224/292 - H01L2224/29291

Industry

CPC
H01L2224/29295

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/29295with a principal constituent of the material being a gas not provided for in groups H01L2224/292 - H01L2224/29291

Industries

Patents Grantslast 30 patents

Information Patent Grant
Process and device for low-temperature pressure sintering
- Patent number 11,776,932
- Issue date Oct 3, 2023
- Danfoss Silicon Power GmbH
- Ronald Eisele
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Process and device for low-temperature pressure sintering
- Patent number 11,626,383
- Issue date Apr 11, 2023
- Danfoss Silicon Power GmbH
- Ronald Eisele
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Sintering materials and attachment methods using same
- Patent number 11,389,865
- Issue date Jul 19, 2022
- Alpha Assembly Solutions Inc.
- Shamik Ghoshal
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Contact structures with porous networks for solder connections, and...
- Patent number 10,849,240
- Issue date Nov 24, 2020
- Invensas Corporation
- Liang Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for producing a silver sintering agent having silver oxide s...
- Patent number 10,785,877
- Issue date Sep 22, 2020
- Heraeus Deutschland GmbH & Co. KG
- Michael Schäfer
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Methods and apparatuses for high temperature bonding controlled pro...
- Patent number 10,500,661
- Issue date Dec 10, 2019
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Hannes Martin Hinrich Greve
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Anisotropic conductive film and production method of the same
- Patent number 10,442,958
- Issue date Oct 15, 2019
- Dexerials Corporation
- Yuta Araki
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Carrier and clip each having sinterable, solidified paste for conne...
- Patent number 10,347,566
- Issue date Jul 9, 2019
- Heraeus Deutschland GmbH & Co. KG
- Michael Benedikt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing a material-bonding connection between a semico...
- Patent number 9,659,793
- Issue date May 23, 2017
- Infineon Technologies AG
- Nicolas Heuck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Array based fabrication of power semiconductor package with integra...
- Patent number 9,620,475
- Issue date Apr 11, 2017
- Infineon Technologies Americas Corp.
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contacting means and method for contacting electrical components
- Patent number 8,925,789
- Issue date Jan 6, 2015
- Heraeus Materials Technology GmbH & Co. KG
- Michael Schäfer
- B22 - CASTING POWDER METALLURGY

Patents Applicationslast 30 patents

Information Patent Application
PROCESS AND DEVICE FOR LOW-TEMPERATURE PRESSURE SINTERING
- Publication number 20210104488
- Publication date Apr 8, 2021
- DANFOSS SILICON POWER GMBH
- Ronald Eisele
- B22 - CASTING POWDER METALLURGY
Information Patent Application
POWER CONVERTER
- Publication number 20120235162
- Publication date Sep 20, 2012
- KABUSHIKI KAISHA YASKAWA DENKI
- Tasuku ISOBE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Contacting Means and Method for Contacting Electrical Components
- Publication number 20120055978
- Publication date Mar 8, 2012
- HERAEUS MATERIALS TECHNOLOGY GMBH & CO. KG
- Michael SCHÄFER
- B22 - CASTING POWDER METALLURGY

with a principal constituent of the material being a gas not provided for in groups H01L2224/292 - H01L2224/29291

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Process and device for low-temperature pressure sintering

Process and device for low-temperature pressure sintering

Sintering materials and attachment methods using same

Contact structures with porous networks for solder connections, and...

Method for producing a silver sintering agent having silver oxide s...

Methods and apparatuses for high temperature bonding controlled pro...

Anisotropic conductive film and production method of the same

Carrier and clip each having sinterable, solidified paste for conne...

Method for producing a material-bonding connection between a semico...

Array based fabrication of power semiconductor package with integra...

Contacting means and method for contacting electrical components

Patents Applicationslast 30 patents

PROCESS AND DEVICE FOR LOW-TEMPERATURE PRESSURE SINTERING

POWER CONVERTER

Contacting Means and Method for Contacting Electrical Components