with a principal constituent of the material being a liquid not provided for in groups H01L2224/456 - H01L2224/45691

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CPC
H01L2224/45694

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/45694with a principal constituent of the material being a liquid not provided for in groups H01L2224/456 - H01L2224/45691

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Patents Grantslast 30 patents

Information Patent Grant
Gold wire for semiconductor element connection and semiconductor el...
- Patent number 6,492,593
- Issue date Dec 10, 2002
- Tanaka Denshi Kogyo K.K.
- Hiroshi Murai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Gold wire for semiconductor element connection and semiconductor el...
- Publication number 20020007957
- Publication date Jan 24, 2002
- Hiroshi Murai
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...