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with a principal constituent of the material being a liquid not provided for in groups H01L2224/371 - H01L2224/37191
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CPC
H01L2224/37194
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Parent Industries
H
ELECTRICITY
H01
Electric elements
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L2224/00
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
Current Industry
H01L2224/37194
with a principal constituent of the material being a liquid not provided for in groups H01L2224/371 - H01L2224/37191
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Patents Grants
last 30 patents
Information
Patent Grant
Electric device package and method of making an electric device pac...
Patent number
8,824,145
Issue date
Sep 2, 2014
Infineon Technologies AG
Khalil Hosseini
F28 - HEAT EXCHANGE IN GENERAL
Patents Applications
last 30 patents
Information
Patent Application
Electric Device Package and Method of Making an Electric Device Pac...
Publication number
20130329365
Publication date
Dec 12, 2013
INFINEON TECHNOLOGIES AG
Khalil Hosseini
F28 - HEAT EXCHANGE IN GENERAL