with a principal constituent of the material being a liquid not provided for in groups H01L2224/132 - H01L2224/13291

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/13294with a principal constituent of the material being a liquid not provided for in groups H01L2224/132 - H01L2224/13291

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Patents Grantslast 30 patents

Information Patent Grant
Packaged die and RDL with bonding structures therebetween
- Patent number 11,996,401
- Issue date May 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fingerprint sensor and manufacturing method thereof
- Patent number 11,990,435
- Issue date May 21, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Sung Sun Park
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 11,948,808
- Issue date Apr 2, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Dong Jin Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged die and RDL with bonding structures therebetween
- Patent number 11,640,958
- Issue date May 2, 2023
- Taiwan Semiconductor Manufacturing Company
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-die package with bridge layer
- Patent number 11,476,125
- Issue date Oct 18, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei Sen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fingerprint sensor and manufacturing method thereof
- Patent number 11,393,734
- Issue date Jul 19, 2022
- Amkor Technology Singapore Holding Pte Ltd.
- Sung Sun Park
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Sintering materials and attachment methods using same
- Patent number 11,389,865
- Issue date Jul 19, 2022
- Alpha Assembly Solutions Inc.
- Shamik Ghoshal
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Planar integrated circuit package interconnects
- Patent number 11,276,630
- Issue date Mar 15, 2022
- Intel Corporation
- Robert L. Sankman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level integration including design/co-design, structure proce...
- Patent number 11,201,138
- Issue date Dec 14, 2021
- International Business Machines Corporation
- Bing Dang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 11,195,726
- Issue date Dec 7, 2021
- Amkor Technology Singapore Holding Pte Ltd.
- Dong Jin Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Assembly comprising hybrid interconnecting means including intermed...
- Patent number 11,011,490
- Issue date May 18, 2021
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Rabih Khazaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged die and RDL with bonding structures therebetween
- Patent number 11,004,838
- Issue date May 11, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead-free solder alloy, solder joint, solder paste composition, ele...
- Patent number 10,926,360
- Issue date Feb 23, 2021
- Tamura Corporation
- Masaya Arai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flux, solder paste, and method for forming solder bump
- Patent number 10,836,000
- Issue date Nov 17, 2020
- Tamura Corporation
- Masanori Shibasaki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for electrical coupling and electric coupling arrangement
- Patent number 10,833,049
- Issue date Nov 10, 2020
- International Business Machines Corporation
- Thomas J. Brunschwiler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Protrusion bump pads for bond-on-trace processing
- Patent number 10,804,192
- Issue date Oct 13, 2020
- Taiwan Semiconductor Manufacturing Company
- Yu-Min Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
MOSFET with reduced resistance
- Patent number 10,707,327
- Issue date Jul 7, 2020
- Great Wall Semiconductor Corporation
- Patrick M. Shea
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making fully molded peripheral package on package device
- Patent number 10,672,624
- Issue date Jun 2, 2020
- Deca Technologies Inc.
- Christopher M. Scanlan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Planar integrated circuit package interconnects
- Patent number 10,651,116
- Issue date May 12, 2020
- Intel Corporation
- Robert L. Sankman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for making multi-die package with bridge layer
- Patent number 10,643,861
- Issue date May 5, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei Sen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
SSI PoP
- Patent number 10,622,291
- Issue date Apr 14, 2020
- Invensas Corporation
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with barrier layer
- Patent number 10,593,621
- Issue date Mar 17, 2020
- Shinko Electric Industries Co., Ltd.
- Keigo Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 10,553,451
- Issue date Feb 4, 2020
- Amkor Technology, Inc.
- Dong Jin Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fingerprint sensor and manufacturing method thereof
- Patent number 10,446,455
- Issue date Oct 15, 2019
- Amkor Technology, Inc.
- Sung Sun Park
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device package with a conductive post
- Patent number 10,446,411
- Issue date Oct 15, 2019
- Advanced Semiconductor Engineering, Inc.
- Tien-Szu Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Resin fluxed solder paste, and mount structure
- Patent number 10,440,834
- Issue date Oct 8, 2019
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Hirohisa Hino
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Fully molded miniaturized semiconductor module
- Patent number 10,373,902
- Issue date Aug 6, 2019
- Deca Technologies Inc.
- Christopher M. Scanlan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding structure and method for producing bonding structure
- Patent number 10,332,853
- Issue date Jun 25, 2019
- Osaka University
- Katsuaki Suganuma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cu core ball, solder paste, formed solder, Cu core column, and sold...
- Patent number 10,322,472
- Issue date Jun 18, 2019
- Senju Metal Industry Co., Ltd.
- Takahiro Hattori
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Fingerprint sensor and manufacturing method thereof
- Patent number 10,297,515
- Issue date May 21, 2019
- Amkor Technology, Inc.
- Sung Sun Park
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240332032
- Publication date Oct 3, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Dong Jin Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FINGERPRINT SENSOR AND MANUFACTURING METHOD THEREOF
- Publication number 20240304577
- Publication date Sep 12, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Sung Sun Park
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PACKAGED DIE AND RDL WITH BONDING STRUCTURES THEREBETWEEN
- Publication number 20230253395
- Publication date Aug 10, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED DIE AND RDL WITH BONDING STRUCTURES THEREBETWEEN
- Publication number 20210249399
- Publication date Aug 12, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods for Making Multi-Die Package With Bridge Layer
- Publication number 20200266074
- Publication date Aug 20, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei Sen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LEVEL INTEGRATION INCLUDING DESIGN/CO-DESIGN, STRUCTURE PROCE...
- Publication number 20200126951
- Publication date Apr 23, 2020
- International Business Machines Corporation
- Bing DANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Trace Design for Bump-on-Trace (BOT) Assembly
- Publication number 20190252347
- Publication date Aug 15, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yen-Liang Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor Packages and Methods of Forming the Same
- Publication number 20180374836
- Publication date Dec 27, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FULLY MOLDED PERIPHERAL PACKAGE ON PACKAGE DEVICE
- Publication number 20180330966
- Publication date Nov 15, 2018
- DECA TECHNOLOGIES INC
- Christopher M. Scanlan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20180308712
- Publication date Oct 25, 2018
- Amkor Technology, Inc.
- Dong Jin Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FULLY MOLDED MINIATURIZED SEMICONDUCTOR MODULE
- Publication number 20180108606
- Publication date Apr 19, 2018
- DECA TECHNOLOGIES INC
- Christopher M. Scanlan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE CONNECTIONS, STRUCTURES WITH SUCH CONNECTIONS, AND METHO...
- Publication number 20180019191
- Publication date Jan 18, 2018
- Invensas Corporation
- Cyprian Emeka UZOH
- B32 - LAYERED PRODUCTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME
- Publication number 20140361445
- Publication date Dec 11, 2014
- Norihiro NASHIDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Warpage Control for Flexible Substrates
- Publication number 20140302642
- Publication date Oct 9, 2014
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPONENT BUILT-IN BOARD AND METHOD OF MANUFACTURING THE SAME, AND...
- Publication number 20140268574
- Publication date Sep 18, 2014
- FUJIKURA LTD.
- Kazuhisa Itoi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING INTERPOSERS AND STACKED MEMORY DEVICES
- Publication number 20140263585
- Publication date Sep 18, 2014
- Sanmina Corporation
- Paul Sweere
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20140210066
- Publication date Jul 31, 2014
- KABUSHIKI KAISHA TOSHIBA
- Toshihiko Nagano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Making Bumpless Flipchip Interco...
- Publication number 20140175661
- Publication date Jun 26, 2014
- STATS ChipPAC, Ltd.
- KyungMoon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
- Publication number 20140145327
- Publication date May 29, 2014
- Samsung Electronics Co., Ltd.
- Hyung-Jun JEON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Warpage Control for Flexible Substrates
- Publication number 20140131897
- Publication date May 15, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DENSE INTERCONNECT WITH SOLDER CAP (DISC) FORMATION WITH LASER ABLA...
- Publication number 20140035134
- Publication date Feb 6, 2014
- Chuan Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20130277831
- Publication date Oct 24, 2013
- Samsung Electronics Co., Ltd.
- SUNG-HWAN YOON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR BUILDING VERTICAL PILLAR INTERCONNECT
- Publication number 20130196499
- Publication date Aug 1, 2013
- FlipChip International, LLC
- Guy F. Burgess
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NITRIDE BASED SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE...
- Publication number 20130056750
- Publication date Mar 7, 2013
- SAMSUNG ELECTRONICS CO., LTD.
- Jae Hoon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20130020709
- Publication date Jan 24, 2013
- Siliconware Precision Industries Co., Ltd.
- Chun-An Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE CONNECTING MEMBER AND MANUFACTURING METHOD OF SAME
- Publication number 20130001775
- Publication date Jan 3, 2013
- Hideo Nishikubo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20120252164
- Publication date Oct 4, 2012
- TOKYO ELECTRON LIMITED
- Ken NAKAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Solder Paste, Joining Method Using the Same and Joined Structure
- Publication number 20120156512
- Publication date Jun 21, 2012
- Murata Manufacturing Co., Ltd.
- Kosuke Nakano
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
EPOXY RESIN FORMULATIONS FOR UNDERFILL APPLICATIONS
- Publication number 20110122590
- Publication date May 26, 2011
- Dow Global Technologies Inc.
- Mark B. WILSON
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
METHODS AND STRUCTURES FOR A VERTICAL PILLAR INTERCONNECT
- Publication number 20110003470
- Publication date Jan 6, 2011
- FlipChip International, LLC
- Guy F. Burgess
- H01 - BASIC ELECTRIC ELEMENTS

with a principal constituent of the material being a liquid not provided for in groups H01L2224/132 - H01L2224/13291

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Packaged die and RDL with bonding structures therebetween

Fingerprint sensor and manufacturing method thereof

Semiconductor device and manufacturing method thereof

Packaged die and RDL with bonding structures therebetween

Multi-die package with bridge layer

Fingerprint sensor and manufacturing method thereof

Sintering materials and attachment methods using same

Planar integrated circuit package interconnects

Wafer level integration including design/co-design, structure proce...

Semiconductor device and manufacturing method thereof

Assembly comprising hybrid interconnecting means including intermed...

Packaged die and RDL with bonding structures therebetween

Lead-free solder alloy, solder joint, solder paste composition, ele...

Flux, solder paste, and method for forming solder bump

Method for electrical coupling and electric coupling arrangement

Protrusion bump pads for bond-on-trace processing

MOSFET with reduced resistance

Method of making fully molded peripheral package on package device

Planar integrated circuit package interconnects

Methods for making multi-die package with bridge layer

SSI PoP

Semiconductor device with barrier layer

Semiconductor device and manufacturing method thereof

Fingerprint sensor and manufacturing method thereof

Semiconductor device package with a conductive post

Resin fluxed solder paste, and mount structure

Fully molded miniaturized semiconductor module

Bonding structure and method for producing bonding structure

Cu core ball, solder paste, formed solder, Cu core column, and sold...

Fingerprint sensor and manufacturing method thereof

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

FINGERPRINT SENSOR AND MANUFACTURING METHOD THEREOF

PACKAGED DIE AND RDL WITH BONDING STRUCTURES THEREBETWEEN

PACKAGED DIE AND RDL WITH BONDING STRUCTURES THEREBETWEEN

Methods for Making Multi-Die Package With Bridge Layer

WAFER LEVEL INTEGRATION INCLUDING DESIGN/CO-DESIGN, STRUCTURE PROCE...

Trace Design for Bump-on-Trace (BOT) Assembly

Semiconductor Packages and Methods of Forming the Same

FULLY MOLDED PERIPHERAL PACKAGE ON PACKAGE DEVICE

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

FULLY MOLDED MINIATURIZED SEMICONDUCTOR MODULE

CONDUCTIVE CONNECTIONS, STRUCTURES WITH SUCH CONNECTIONS, AND METHO...

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME

Warpage Control for Flexible Substrates

COMPONENT BUILT-IN BOARD AND METHOD OF MANUFACTURING THE SAME, AND...

METHOD FOR FORMING INTERPOSERS AND STACKED MEMORY DEVICES

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

Semiconductor Device and Method of Making Bumpless Flipchip Interco...

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

Warpage Control for Flexible Substrates

DENSE INTERCONNECT WITH SOLDER CAP (DISC) FORMATION WITH LASER ABLA...

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

METHOD FOR BUILDING VERTICAL PILLAR INTERCONNECT

NITRIDE BASED SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE...

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

CONDUCTIVE CONNECTING MEMBER AND MANUFACTURING METHOD OF SAME

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

Solder Paste, Joining Method Using the Same and Joined Structure

EPOXY RESIN FORMULATIONS FOR UNDERFILL APPLICATIONS

METHODS AND STRUCTURES FOR A VERTICAL PILLAR INTERCONNECT