with a principal constituent of the material being a liquid not provided for in groups H01L2224/131 - H01L2224/13191

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H01L2224/13194

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/13194with a principal constituent of the material being a liquid not provided for in groups H01L2224/131 - H01L2224/13191

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Patents Grantslast 30 patents

Information Patent Grant
Electronic component module and method for manufacturing electronic...
- Patent number 9,860,989
- Issue date Jan 2, 2018
- Murata Manufacturing Co., Ltd.
- Shinya Kiyono
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Systems, methods and devices for inter-substrate coupling
- Patent number 9,728,489
- Issue date Aug 8, 2017
- Elwha LLC
- William David Duncan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming reinforced interconnects on a substrate
- Patent number 7,494,924
- Issue date Feb 24, 2009
- FREESCALE SEMICONDUCTOR, INC.
- Hei Ming Shiu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
FLIP CHIP PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20120168937
- Publication date Jul 5, 2012
- Samsung Electronics Co., Ltd.
- Yong-Kwan LEE
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for forming reinforced interconnects on a substrate
- Publication number 20070207605
- Publication date Sep 6, 2007
- Hei Ming Shiu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR