TREA

with a principal constituent of the material being a liquid not provided for in groups H01L2224/296 - H01L2224/29691

Follow

Industry

  • CPC
  • H01L2224/29694
This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/29694with a principal constituent of the material being a liquid not provided for in groups H01L2224/296 - H01L2224/29691
Industries

Patents Grantslast 30 patents

  • Information Patent Grant

    Solder preform and electronic component
    • Patent number 7,800,230
    • Issue date Sep 21, 2010
    • Denso Corporation
    • Naohiko Hirano
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

  • Information Patent Application

    Solder Preform and Electronic Component
    • Publication number 20090236725
    • Publication date Sep 24, 2009
    • DENSO Corporation
    • Naohiko Hirano
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR