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with a principal constituent of the material being a liquid not provided for in groups H01L2224/294 - H01L2224/29491
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CPC
H01L2224/29494
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Parent Industries
H
ELECTRICITY
H01
Electric elements
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L2224/00
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
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H01L2224/29494
with a principal constituent of the material being a liquid not provided for in groups H01L2224/294 - H01L2224/29491
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Patents Grants
last 30 patents
Information
Patent Grant
Anisotropic conductive film, method for producing anisotropic condu...
Patent number
10,373,926
Issue date
Aug 6, 2019
Dexerials Corporation
Kouichi Sato
B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information
Patent Grant
Anisotropic conductive film, method for producing anisotropic condu...
Patent number
9,960,139
Issue date
May 1, 2018
Dexerials Corporation
Kouichi Sato
B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information
Patent Grant
Anisotropically conductive adhesive comprising crushable microcapsu...
Patent number
7,220,785
Issue date
May 22, 2007
Seiko Epson Corporation
Atsushi Saito
C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Patents Applications
last 30 patents
Information
Patent Application
ANISOTROPIC CONDUCTIVE FILM, METHOD FOR PRODUCING ANISOTROPIC CONDU...
Publication number
20180218994
Publication date
Aug 2, 2018
DEXERIALS CORPORATION
Kouichi SATO
B32 - LAYERED PRODUCTS
Information
Patent Application
Anisotropically conductive adhesive, mounting method, electro-optic...
Publication number
20040234763
Publication date
Nov 25, 2004
SEIKO EPSON CORPORATION
Atsushi Saito
C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...