with a principal constituent of the material being a liquid not provided for in groups H01L2224/057 - H01L2224/05791

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H01L2224/05794

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/05794with a principal constituent of the material being a liquid not provided for in groups H01L2224/057 - H01L2224/05791

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Conductive connections, structures with such connections, and metho...
- Patent number 10,090,231
- Issue date Oct 2, 2018
- Invensas Corporation
- Cyprian Emeka Uzoh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Hybrid low metal loading flux
- Patent number 9,950,393
- Issue date Apr 24, 2018
- Intel Corporation
- Rajen S. Sidhu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor packaging and manufacturing method thereof
- Patent number 9,935,044
- Issue date Apr 3, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsiu-Jen Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic devices with semiconductor die attached with sintered me...
- Patent number 9,875,987
- Issue date Jan 23, 2018
- NXP USA, INC.
- Lakshminarayan Viswanathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive connections, structures with such connections, and metho...
- Patent number 9,793,198
- Issue date Oct 17, 2017
- Invensas Corporation
- Cyprian Emeka Uzoh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for processing a semiconductor substrate and a method for pr...
- Patent number 9,673,096
- Issue date Jun 6, 2017
- Infineon Technologies AG
- Joachim Hirschler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic devices with semiconductor die coupled to a thermally co...
- Patent number 9,589,860
- Issue date Mar 7, 2017
- NXP USA, INC.
- Lakshminarayan Viswanathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Warpage control for flexible substrates
- Patent number 9,502,271
- Issue date Nov 22, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packaging and manufacturing method thereof
- Patent number 9,355,927
- Issue date May 31, 2016
- Taiwan Semiconductor Manufacturing Company Ltd.
- Hsiu-Jen Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solderless die attach to a direct bonded aluminum substrate
- Patent number 9,111,782
- Issue date Aug 18, 2015
- IXYS Corporation
- Nathan Zommer
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solderless die attach to a direct bonded aluminum substrate
- Patent number 8,716,864
- Issue date May 6, 2014
- IXYS Corporation
- Nathan Zommer
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Power MOSFET having selectively silvered pads for clip and bond wir...
- Patent number 8,653,667
- Issue date Feb 18, 2014
- IXYS Corporation
- Nathan Zommer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power MOSFET having selectively silvered pads for clip and bond wir...
- Patent number 8,586,480
- Issue date Nov 19, 2013
- IXYS Corporation
- Nathan Zommer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for packaging ultra-thin chip with solder ball thermo-compre...
- Patent number 8,563,417
- Issue date Oct 22, 2013
- Alpha & Omega Semiconductor, Inc.
- Jun Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of packaging and interconnection of integrated circuits
- Patent number 7,964,964
- Issue date Jun 21, 2011
- James Sheats
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic element that includes multilayered bonding interface bet...
- Patent number 7,960,834
- Issue date Jun 14, 2011
- Murata Manufacturing Co., Ltd.
- Tatsuya Funaki
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method of packaging and interconnection of integrated circuits
- Patent number 7,618,844
- Issue date Nov 17, 2009
- Intelleflex Corporation
- James Sheats
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
HYBRID LOW METAL LOADING FLUX
- Publication number 20180236609
- Publication date Aug 23, 2018
- Intel Corporation
- Rajen S. SIDHU
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONDUCTIVE CONNECTIONS, STRUCTURES WITH SUCH CONNECTIONS, AND METHO...
- Publication number 20180019191
- Publication date Jan 18, 2018
- Invensas Corporation
- Cyprian Emeka UZOH
- B32 - LAYERED PRODUCTS
Information Patent Application
Warpage Control for Flexible Substrates
- Publication number 20140302642
- Publication date Oct 9, 2014
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Solderless Die Attach to a Direct Bonded Aluminum Substrate
- Publication number 20140225267
- Publication date Aug 14, 2014
- IXYS Corporation
- Nathan Zommer
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SILVER-TO-SILVER BONDED IC PACKAGE HAVING TWO CERAMIC SUBSTRATES EX...
- Publication number 20140183716
- Publication date Jul 3, 2014
- IXYS Corporation
- Nathan Zommer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Warpage Control for Flexible Substrates
- Publication number 20140131897
- Publication date May 15, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power MOSFET Having Selectively Silvered Pads for Clip and Bond Wir...
- Publication number 20140042624
- Publication date Feb 13, 2014
- IXYS Corporation
- Nathan Zommer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID LOW METAL LOADING FLUX
- Publication number 20130341379
- Publication date Dec 26, 2013
- Rajen S. Sidhu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Solderless Die Attach to a Direct Bonded Aluminum Substrate
- Publication number 20130328204
- Publication date Dec 12, 2013
- IXYS Corporation
- Nathan Zommer
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR PACKAGING ULTRA-THIN CHIP WITH SOLDER BALL THERMO-COMPRE...
- Publication number 20130130443
- Publication date May 23, 2013
- Jun Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of packaging and interconnection of integrated circuits
- Publication number 20100038770
- Publication date Feb 18, 2010
- James Sheats
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electronic Element, Electronic Element Device Using the Same, and M...
- Publication number 20090039507
- Publication date Feb 12, 2009
- Murata Manufacturing Co., Ltd.
- Tatsuya Funaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of packaging and interconnection of integrated circuits
- Publication number 20070040272
- Publication date Feb 22, 2007
- INTELLEFLEX CORPORATION
- James Sheats
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

with a principal constituent of the material being a liquid not provided for in groups H01L2224/057 - H01L2224/05791

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Conductive connections, structures with such connections, and metho...

Hybrid low metal loading flux

Semiconductor packaging and manufacturing method thereof

Electronic devices with semiconductor die attached with sintered me...

Conductive connections, structures with such connections, and metho...

Method for processing a semiconductor substrate and a method for pr...

Electronic devices with semiconductor die coupled to a thermally co...

Warpage control for flexible substrates

Semiconductor packaging and manufacturing method thereof

Solderless die attach to a direct bonded aluminum substrate

Solderless die attach to a direct bonded aluminum substrate

Power MOSFET having selectively silvered pads for clip and bond wir...

Power MOSFET having selectively silvered pads for clip and bond wir...

Method for packaging ultra-thin chip with solder ball thermo-compre...

Method of packaging and interconnection of integrated circuits

Electronic element that includes multilayered bonding interface bet...

Method of packaging and interconnection of integrated circuits

Patents Applicationslast 30 patents

HYBRID LOW METAL LOADING FLUX

CONDUCTIVE CONNECTIONS, STRUCTURES WITH SUCH CONNECTIONS, AND METHO...

Warpage Control for Flexible Substrates

Solderless Die Attach to a Direct Bonded Aluminum Substrate

SILVER-TO-SILVER BONDED IC PACKAGE HAVING TWO CERAMIC SUBSTRATES EX...

Warpage Control for Flexible Substrates

Power MOSFET Having Selectively Silvered Pads for Clip and Bond Wir...

HYBRID LOW METAL LOADING FLUX

Solderless Die Attach to a Direct Bonded Aluminum Substrate

METHOD FOR PACKAGING ULTRA-THIN CHIP WITH SOLDER BALL THERMO-COMPRE...

Method of packaging and interconnection of integrated circuits

Electronic Element, Electronic Element Device Using the Same, and M...

Method of packaging and interconnection of integrated circuits