with a principal constituent of the material being a liquid not provided for in groups H01L2224/136 - H01L2224/13691

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H01L2224/13694

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/13694with a principal constituent of the material being a liquid not provided for in groups H01L2224/136 - H01L2224/13691

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Patents Grantslast 30 patents

Information Patent Grant
Chip packages with sintered interconnects formed out of pads
- Patent number 10,777,496
- Issue date Sep 15, 2020
- International Business Machines Corporation
- Thomas J. Brunschwiler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Intermetallic compound layer on a pillar between a chip and substrate
- Patent number 9,293,433
- Issue date Mar 22, 2016
- Shinko Electric Industries Co., Ltd.
- Yoshihiro Machida
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents