with a principal constituent of the material being a liquid not provided for in groups H01L2224/137 - H01L2224/13791

Follow

Industry

CPC
H01L2224/13794

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/13794with a principal constituent of the material being a liquid not provided for in groups H01L2224/137 - H01L2224/13791

Industries

Patents Grantslast 30 patents

Information Patent Grant
Microelectronic packages with nanoparticle joining
- Patent number 9,397,063
- Issue date Jul 19, 2016
- Tessera, Inc.
- Belgacem Haba
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Semiconductor device and method of making bumpless flipchip interco...
- Patent number 9,240,331
- Issue date Jan 19, 2016
- STATS ChipPAC, Ltd.
- KyungMoon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked dual-chip packaging structure and preparation method thereof
- Patent number 9,184,117
- Issue date Nov 10, 2015
- Alpha and Omega Semiconductor Incorporated
- Yueh-Se Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic packages with nanoparticle joining
- Patent number 9,030,001
- Issue date May 12, 2015
- Tessera, Inc.
- Belgacem Haba
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Microelectronic packages with nanoparticle joining
- Patent number 8,580,607
- Issue date Nov 12, 2013
- Tessera, Inc.
- Belgacem Haba
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Doping minor elements into metal bumps
- Patent number 8,227,334
- Issue date Jul 24, 2012
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Da Cheng
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor Device and Method of Making Bumpless Flipchip Interco...
- Publication number 20140175661
- Publication date Jun 26, 2014
- STATS ChipPAC, Ltd.
- KyungMoon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED DUAL-CHIP PACKAGING STRUCTURE AND PREPARATION METHOD THEREOF
- Publication number 20140117523
- Publication date May 1, 2014
- Yueh-Se Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC PACKAGES WITH NANOPARTICLE JOINING
- Publication number 20140077351
- Publication date Mar 20, 2014
- Tessera, Inc.
- Belgacem Haba
- B82 - NANO-TECHNOLOGY
Information Patent Application
Doping Minor Elements into Metal Bumps
- Publication number 20120286423
- Publication date Nov 15, 2012
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Da Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC PACKAGES WITH NANOPARTICLE JOINING
- Publication number 20120025365
- Publication date Feb 2, 2012
- Tessera Research LLC
- Belgacem Haba
- B82 - NANO-TECHNOLOGY
Information Patent Application
Doping Minor Elements into Metal Bumps
- Publication number 20120018878
- Publication date Jan 26, 2012
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Da Cheng
- H01 - BASIC ELECTRIC ELEMENTS