with a principal constituent of the material being a liquid not provided for in groups H01L2224/291 - H01L2224/29191

Industry

CPC
H01L2224/29194

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/29194with a principal constituent of the material being a liquid not provided for in groups H01L2224/291 - H01L2224/29191

Industries

Patents Grantslast 30 patents

Information Patent Grant
Electronic package and fabrication method thereof
- Patent number 12,100,642
- Issue date Sep 24, 2024
- Siliconware Precision Industries Co., Ltd.
- Yu-Lung Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and manufacturing method of the same
- Patent number 12,062,742
- Issue date Aug 13, 2024
- Unimicron Technology Corp.
- Hao-Wei Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor wafer and method of manufacturing the same
- Patent number 11,532,589
- Issue date Dec 20, 2022
- Kioxia Corporation
- Jun Iijima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package and fabrication method thereof
- Patent number 11,482,470
- Issue date Oct 25, 2022
- Siliconware Precision Industries Co., Ltd.
- Yu-Lung Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-layer thin film composite thermal interface materials
- Patent number 10,937,716
- Issue date Mar 2, 2021
- Arizona Board of Regents on behalf of Arizona State University
- Konrad Rykaczewski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having a metal paint layer
- Patent number 10,580,741
- Issue date Mar 3, 2020
- Skyworks Solutions, Inc.
- Matthew Sean Read
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure of fingerprint identification chip
- Patent number 10,445,553
- Issue date Oct 15, 2019
- Primax Electronics Ltd.
- Tsung-Yi Lu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method of manufacturing printed-circuit board assembly
- Patent number 10,426,041
- Issue date Sep 24, 2019
- Samsung Electronics Co., Ltd.
- Jung-Je Bang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Using MEMS fabrication incorporating into LED device mounting and a...
- Patent number 10,403,804
- Issue date Sep 3, 2019
- Epistar Corporation
- Guan Ru He
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing printed-circuit board assembly
- Patent number 10,383,235
- Issue date Aug 13, 2019
- Samsung Electronics Co., Ltd.
- Jung-Je Bang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for chip placement and molding
- Patent number 10,269,694
- Issue date Apr 23, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jui Hsieh Lai
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Semiconductor package having a metal paint layer
- Patent number 10,163,814
- Issue date Dec 25, 2018
- Skyworks Solutions, Inc.
- Matthew Sean Read
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Using MEMS fabrication incorporating into LED device mounting and a...
- Patent number 10,026,882
- Issue date Jul 17, 2018
- Epistar Corporation
- Guan Ru He
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for performing direct bonding between two structures
- Patent number 9,922,954
- Issue date Mar 20, 2018
- Commisariat A l'Energie Atomique et Aux Energies Alternatives
- Hubert Moriceau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip arranging method
- Patent number 9,806,057
- Issue date Oct 31, 2017
- Disco Corporation
- Kazuma Sekiya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having a metal paint layer
- Patent number 9,653,409
- Issue date May 16, 2017
- Skyworks Solutions, Inc.
- Matthew Sean Read
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board and semiconductor package using the same
- Patent number 9,502,341
- Issue date Nov 22, 2016
- Samsung Electronics Co., Ltd.
- Jik-Ho Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package device
- Patent number 9,029,998
- Issue date May 12, 2015
- Samsung Electronics Co., Ltd.
- Eon Soo Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3475660
- Patent number 3,475,660
- Issue date Oct 28, 1969
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
LIGHT-EMITTING DEVICE, LIGHT-EMITTING MODULE AND PREPARATION METHOD...
- Publication number 20240266470
- Publication date Aug 8, 2024
- BOE MLED TECHNOLOGY CO., LTD.
- Zhijun XIONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF INTERCONNECTING SEMICONDUCTOR DEVICES AND ASSEMBLY OF INT...
- Publication number 20240266320
- Publication date Aug 8, 2024
- Yibu Semiconductor Co., Ltd.
- Yifan Guo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240063131
- Publication date Feb 22, 2024
- Samsung Electronics Co., Ltd.
- Jaeean Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD OF THE SAME
- Publication number 20230231087
- Publication date Jul 20, 2023
- Unimicron Technology Corp.
- Hao-Wei TSENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND FABRICATION METHOD THEREOF
- Publication number 20220336323
- Publication date Oct 20, 2022
- Siliconware Precision Industries Co., Ltd.
- Yu-Lung Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LAMINATING METHOD
- Publication number 20220310557
- Publication date Sep 29, 2022
- Disco Corporation
- Masaru Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Seamless Interconnect Thresholds using Dielectric Fluid Channels
- Publication number 20220238401
- Publication date Jul 28, 2022
- SCIPERIO, INC.
- Jason Benoit
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND FABRICATION METHOD THEREOF
- Publication number 20210287962
- Publication date Sep 16, 2021
- Siliconware Precision Industries Co., Ltd.
- Yu-Lung Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-LAYER THIN FILM COMPOSITE THERMAL INTERFACE MATERIALS
- Publication number 20190181069
- Publication date Jun 13, 2019
- Konrad Rykaczewski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
USING MEMS FABRICATION INCORPORATING INTO LED DEVICE MOUNTING AND A...
- Publication number 20180301609
- Publication date Oct 18, 2018
- EPISTAR CORPORATION
- Guan Ru He
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING A METAL PAINT LAYER
- Publication number 20170301629
- Publication date Oct 19, 2017
- SKYWORKS SOLUTIONS, INC.
- Matthew Sean Read
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PERFORMING DIRECT BONDING BETWEEN TWO STRUCTURES
- Publication number 20170179073
- Publication date Jun 22, 2017
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- Hubert MORICEAU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING A METAL PAINT LAYER
- Publication number 20160181206
- Publication date Jun 23, 2016
- SKYWORKS SOLUTIONS, INC.
- Matthew Sean Read
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE DEVICE
- Publication number 20140339708
- Publication date Nov 20, 2014
- Eon Soo JANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING A METAL PAINT LAYER
- Publication number 20130335288
- Publication date Dec 19, 2013
- Matthew Sean Read
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STARTING MATERIAL FOR A SINTERED BOND AND PROCESS FOR PRODUCING THE...
- Publication number 20130216847
- Publication date Aug 22, 2013
- ROBERT BOSCH GmbH
- Daniel Wolde-Giorgis
- B32 - LAYERED PRODUCTS

with a principal constituent of the material being a liquid not provided for in groups H01L2224/291 - H01L2224/29191

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Electronic package and fabrication method thereof

Package structure and manufacturing method of the same

Semiconductor wafer and method of manufacturing the same

Electronic package and fabrication method thereof

Multi-layer thin film composite thermal interface materials

Semiconductor package having a metal paint layer

Package structure of fingerprint identification chip

Method of manufacturing printed-circuit board assembly

Using MEMS fabrication incorporating into LED device mounting and a...

Method of manufacturing printed-circuit board assembly

Apparatus and method for chip placement and molding

Semiconductor package having a metal paint layer

Using MEMS fabrication incorporating into LED device mounting and a...

Method for performing direct bonding between two structures

Chip arranging method

Semiconductor package having a metal paint layer

Printed circuit board and semiconductor package using the same

Semiconductor package device

3475660

Patents Applicationslast 30 patents

LIGHT-EMITTING DEVICE, LIGHT-EMITTING MODULE AND PREPARATION METHOD...

METHOD OF INTERCONNECTING SEMICONDUCTOR DEVICES AND ASSEMBLY OF INT...

SEMICONDUCTOR PACKAGE

PACKAGE STRUCTURE AND MANUFACTURING METHOD OF THE SAME

ELECTRONIC PACKAGE AND FABRICATION METHOD THEREOF

WAFER LAMINATING METHOD

Seamless Interconnect Thresholds using Dielectric Fluid Channels

ELECTRONIC PACKAGE AND FABRICATION METHOD THEREOF

MULTI-LAYER THIN FILM COMPOSITE THERMAL INTERFACE MATERIALS

USING MEMS FABRICATION INCORPORATING INTO LED DEVICE MOUNTING AND A...

SEMICONDUCTOR PACKAGE HAVING A METAL PAINT LAYER

METHOD FOR PERFORMING DIRECT BONDING BETWEEN TWO STRUCTURES

SEMICONDUCTOR PACKAGE HAVING A METAL PAINT LAYER

SEMICONDUCTOR PACKAGE DEVICE

SEMICONDUCTOR PACKAGE HAVING A METAL PAINT LAYER

STARTING MATERIAL FOR A SINTERED BOND AND PROCESS FOR PRODUCING THE...