TREA

with a principal constituent of the material being a metal or a metalloid

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Industry

  • CPC
  • H01L2224/459
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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/459with a principal constituent of the material being a metal or a metalloid
Industries

Patents Grantslast 30 patents

  • Information Patent Grant

    Bonding wire for semiconductor device
    • Patent number 10,468,370
    • Issue date Nov 5, 2019
    • Nippon Micrometal Corporation
    • Takashi Yamada
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Bonding wire for semiconductor device
    • Patent number 9,773,748
    • Issue date Sep 26, 2017
    • Nippon Micrometal Corporation
    • Takashi Yamada
    • H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents