with a principal constituent of the material being a metal or a metalloid

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H01L2224/855

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/855with a principal constituent of the material being a metal or a metalloid

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor packages with pass-through clock traces and associate...
- Patent number 11,855,048
- Issue date Dec 26, 2023
- Thomas H. Kinsley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device and method for fabricating an electronic device
- Patent number 9,355,984
- Issue date May 31, 2016
- Infineon Technologies AG
- Irmgard Escher-Poeppel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die package structure
- Patent number 9,299,626
- Issue date Mar 29, 2016
- Shih-Chi Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding wire for semiconductor
- Patent number 8,742,258
- Issue date Jun 3, 2014
- Nippon Steel & Sumikin Materials Co., Ltd.
- Shinichi Terashima
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Cu-pad/bonded/Cu-wire with self-passivating Cu-alloys
- Patent number 6,515,373
- Issue date Feb 4, 2003
- Infineon Technologies AG
- Hans-Joachim Barth
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGES WITH PASS-THROUGH CLOCK TRACES AND ASSOCIATE...
- Publication number 20240178193
- Publication date May 30, 2024
- Lodestar Licensing Group LLC
- Thomas H. Kinsley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD CARRIER STRUCTURE AND PACKAGES FORMED THEREFROM WITHOUT DIE AT...
- Publication number 20180047588
- Publication date Feb 15, 2018
- EoPlex Limited
- Philip E ROGREN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE PACKAGE STRUCTURE
- Publication number 20140197524
- Publication date Jul 17, 2014
- Shih-Chi CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING WIRE FOR SEMICONDUCTOR
- Publication number 20130306352
- Publication date Nov 21, 2013
- NIPPON STEEL & SUMIKIN MATERIALS CO., LTD.
- Shinichi Terashima
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
BONDING WIRE FOR SEMICONDUCTOR
- Publication number 20120118610
- Publication date May 17, 2012
- NIPPON MICROMETAL CORPORATION
- Shinichi Terashima
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
Cu-pad/bonded/Cu-wire with self-passivating Cu-alloys
- Publication number 20020084311
- Publication date Jul 4, 2002
- Hans-Joachim Barth
- H01 - BASIC ELECTRIC ELEMENTS