with a principal constituent of the material being a metal or a metalloid

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H01L2224/454

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/454with a principal constituent of the material being a metal or a metalloid

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and method for fabricating the same
- Patent number 11,676,920
- Issue date Jun 13, 2023
- United Microelectronics Corp.
- Da-Jun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device manufacturing method comprising bonding an ele...
- Patent number 10,522,482
- Issue date Dec 31, 2019
- Mitsubishi Electric Corporation
- Yumie Kitajima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit package with segmented external shield to provide internal...
- Patent number 10,134,682
- Issue date Nov 20, 2018
- Avago Technologies International Sales Pte. Limited
- Nitesh Kumbhat
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Semiconductor chip, semiconductor package and fabricating method th...
- Patent number 9,620,460
- Issue date Apr 11, 2017
- Samsung Electronics Co., Ltd.
- Hyun-Pil Noh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of semiconductor device and semiconductor device
- Patent number 9,385,071
- Issue date Jul 5, 2016
- Renesas Electronics Corporation
- Yoshiharu Kaneda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing semiconductor device
- Patent number 9,368,480
- Issue date Jun 14, 2016
- Sony Corporation
- Makoto Murai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-in-packages and methods of formation thereof
- Patent number 9,147,628
- Issue date Sep 29, 2015
- Infineon Technoloiges Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of semiconductor device and semiconductor device
- Patent number 9,076,777
- Issue date Jul 7, 2015
- Renesas Electronics Corporation
- Yoshiharu Kaneda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor module with segmented base plate
- Patent number 8,237,260
- Issue date Aug 7, 2012
- Infineon Technologies AG
- Roman Tschirbs
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
- Publication number 20230260937
- Publication date Aug 17, 2023
- UNITED MICROELECTRONICS CORP.
- Da-Jun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
- Publication number 20220238468
- Publication date Jul 28, 2022
- UNITED MICROELECTRONICS CORP.
- Da-Jun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE MANUFACTURING METHOD
- Publication number 20190139906
- Publication date May 9, 2019
- Mitsubishi Electric Corporation
- Yumie KITAJIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bonded System with Coated Copper Conductor
- Publication number 20140197539
- Publication date Jul 17, 2014
- INFINEON TECHNOLOGIES AG
- Reinhold Bayerer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE
- Publication number 20140070389
- Publication date Mar 13, 2014
- RENESAS ELECTRONICS CORPORATION
- Yoshiharu Kaneda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package-In-Packages and Methods of Formation Thereof
- Publication number 20140001615
- Publication date Jan 2, 2014
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR MODULE WITH SEGMENTED BASE PLATE
- Publication number 20100127371
- Publication date May 27, 2010
- INFINEON TECHNOLOGIES AG
- Roman Tschirbs
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

with a principal constituent of the material being a metal or a metalloid

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device and method for fabricating the same

Semiconductor device manufacturing method comprising bonding an ele...

Circuit package with segmented external shield to provide internal...

Semiconductor chip, semiconductor package and fabricating method th...

Manufacturing method of semiconductor device and semiconductor device

Semiconductor device and method of manufacturing semiconductor device

Package-in-packages and methods of formation thereof

Manufacturing method of semiconductor device and semiconductor device

Power semiconductor module with segmented base plate

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

SEMICONDUCTOR DEVICE MANUFACTURING METHOD

Bonded System with Coated Copper Conductor

MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE

Package-In-Packages and Methods of Formation Thereof

POWER SEMICONDUCTOR MODULE WITH SEGMENTED BASE PLATE